UB Paderborn / Katalog / Suche / in CDI

IMTC 2001. Proceedings of the 18th IEEE Instrumentation and Measurement Technology Conference. Rediscovering Measurement in the Age of Informatics (Cat. No.01CH 37188), 2001, Vol.1, p.443-447 vol.1

2001

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IEEE_Xplore

Variable embedded capacitor for active systems packaging

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1574-1577 Vol. 2

2005

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IEEE_Xplore

Embedded decoupling capacitor performance in high speed circuits

Proceedings Electronic Components and Technology, 2005. ECTC '05, 2005, p.1617-1622 Vol. 2

2005

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IEEE_Xplore

New paradigm in IC package interconnections by reworkable nano-interconnects

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.451-460 Vol.1

2004

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IEEE_Xplore

Integrating Solution-Derived 3D PZT Structures on Si Mems Platform for RF and Biomedical Applications

2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 2006, p.122-122

2006

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IEEE_Xplore

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.282-288 Vol.1

2004

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IEEE_Xplore

Organic-Based RF Capacitors with Ceramic-Like Properties

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1866-1869

2007

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IEEE_Xplore

Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration

56th Electronic Components and Technology Conference 2006, 2006, p.6 pp.

2006

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IEEE_Xplore

Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.514-520 Vol.1

2004

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IEEE_Xplore

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005, 2005, p.249-254

2005

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IEEE_Xplore

Low-cost embedded capacitor technology with hydrothermal and sol-gel processes

9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings, 2004, p.78-83

2004

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IEEE_Xplore

Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications

56th Electronic Components and Technology Conference 2006, 2006, p.5 pp.

2006

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IEEE_Xplore

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings, 2004, p.69-73

2004

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IEEE_Xplore

Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1520-1527

2003

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IEEE_Xplore

Sol-gel derived and repairable nano-interconnects

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), 2003, p.385-389

2003

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IEEE_Xplore

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Processing and Dielectric Properties of Nanocomposite Thin Film "Supercapacitors" for High-Frequency Embedded Decoupling

Integrating High-k Ceramic Thin Film Capacitors into Organic Substrates Via Low-Cost Solution Processing

Lead-Free Solder Films Via Novel Solution Synthesis Routes

Sol-Gel Processing of Some Electroceramic Powders

Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages

Electrostatically deposited surface seeding and promotion of crystallization of sol-gel derived LaAl11O18 coating on oxide fibers

Electrostatically deposited surface seeding and promotion of crystallization of sol-gel derived LaAl 11O 18 coating on oxide fibers

Processing of Pb(Zr{sub 0.52}Ti{sub 0.48})O{sub 3} (PZT) ceramics from microwave and conventional hydrothermal powders

Dielectric Properties of Highly Oriented Lead Zirconium Titanate Thin Films Prepared by Reactive RF-Sputtering

Magnetic nanocomposites for organic compatible miniaturized antennas and inductors

Fabrication and device design of bulk and thin film photostrictive materials

Variable embedded capacitor for active systems packaging

Embedded decoupling capacitor performance in high speed circuits

New paradigm in IC package interconnections by reworkable nano-interconnects

Integrating Solution-Derived 3D PZT Structures on Si Mems Platform for RF and Biomedical Applications

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

Organic-Based RF Capacitors with Ceramic-Like Properties

Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration

Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

Low-cost embedded capacitor technology with hydrothermal and sol-gel processes

Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)

Sol-gel derived and repairable nano-interconnects

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