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Design and Fabrication of CMOS Microstructures to Locally Synthesize Carbon Nanotubes for Gas Sensing

Sensors (Basel, Switzerland), 2019-10, Vol.19 (19), p.4340

2019

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Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride-A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting

Polymers, 2023-03, Vol.15 (6), p.1552

2023

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Post-CMOS processing challenges and design developments of CMOS-MEMS microheaters for local CNT synthesis

Microsystems & nanoengineering, 2023-11, Vol.9 (1), p.136-136, Article 136

2023

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Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2015-06, Vol.46 (6), p.2637-2645

2015

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Integration of Carbon Nanotubes in Microsystems: Local Growth and Electrical Properties of Contacts

Materials, 2013-07, Vol.6 (8), p.3094-3107

2013

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Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Journal of electronic materials, 2013-12, Vol.42 (12), p.3582-3592

2013

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Local Synthesis of Carbon Nanotubes in Silicon Microsystems: The Effect of Temperature Distribution on Growth Structure

Materials, 2013-07, Vol.6 (8), p.3160-3170

2013

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Direct Integration of Carbon Nanotubes in CMOS, Towards an Industrially Feasible Process: A Review

IEEE transactions on nanotechnology, 2020, Vol.19, p.113-122

2020

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A Review of Eutectic Au-Ge Solder Joints

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2019-10, Vol.50 (10), p.4632-4641

2019

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Thermal management of an interventional medical device with double layer encapsulation

Experimental heat transfer, 2022-07, Vol.35 (5), p.708-725

2022

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Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives

Journal of applied polymer science, 2016-08, Vol.133 (31), p.np-n/a

2016

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Direct integration of carbon nanotubes in Si microstructures

Journal of micromechanics and microengineering, 2012-07, Vol.22 (7), p.74006-6

2012

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Stability of Laser-Patterned Electrode Compositions

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-09, Vol.8 (9), p.1517-1523

2018

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In–Bi low-temperature SLID bonding for piezoelectric materials

Soldering & surface mount technology, 2018-03, Vol.30 (2), p.100-105

2018

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Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-11, Vol.5 (11), p.1559-1566

2015

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Local synthesis of carbon nanotubes for direct integration in Si microsystems - design considerations

Advances in manufacturing, 2013-09, Vol.1 (3), p.218-225

2013

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High Temperature Interconnect and Die Attach Technology: Au-Sn SLID Bonding

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-06, Vol.3 (6), p.904-914

2013

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Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-09, Vol.1 (9), p.1350-1358

2011

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High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2015-11, Vol.46 (11), p.5266-5274

2015

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Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-07, Vol.3 (7), p.1084-1093

2013

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Encapsulation for smart textile electronics - humidity and temperature sensor

Studies in health technology and informatics, 2015, Vol.211, p.207

2015

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In-Situ Silver Nanoparticle Formation on Surface-Modified Polyetherimide Films

IEEE transactions on nanotechnology, 2014-07, Vol.13 (4), p.736-742

2014

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Carbon Nanotube Growth on the Polysilicon Layers of CMOS

2023 IEEE 23rd International Conference on Nanotechnology (NANO), 2023, p.411-414

2023

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Shear strength of off-eutectic Au Ge joints at high-temperature

Microelectronics and reliability, 2019-08, Vol.99, p.31-43

2019

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Shear strength of off-eutectic AuGe joints at high-temperature

Microelectronics and reliability, 2019-08, Vol.99, p.31-43

2019

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Design and Fabrication of CMOS Microstructures to Locally Synthesize Carbon Nanotubes for Gas Sensing

Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride-A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting

Post-CMOS processing challenges and design developments of CMOS-MEMS microheaters for local CNT synthesis

Characterization of Wafer-Level Au-In-Bonded Samples at Elevated Temperatures

Integration of Carbon Nanotubes in Microsystems: Local Growth and Electrical Properties of Contacts

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

Local Synthesis of Carbon Nanotubes in Silicon Microsystems: The Effect of Temperature Distribution on Growth Structure

Direct Integration of Carbon Nanotubes in CMOS, Towards an Industrially Feasible Process: A Review

A Review of Eutectic Au-Ge Solder Joints

Thermal management of an interventional medical device with double layer encapsulation

Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives

Direct integration of carbon nanotubes in Si microstructures

Stability of Laser-Patterned Electrode Compositions

In–Bi low-temperature SLID bonding for piezoelectric materials

Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors

Local synthesis of carbon nanotubes for direct integration in Si microsystems - design considerations

High Temperature Interconnect and Die Attach Technology: Au-Sn SLID Bonding

Wafer-Level Cu/Sn to Cu/Sn SLID-Bonded Interconnects With Increased Strength

High-Temperature Mechanical Integrity of Cu-Sn SLID Wafer-Level Bonds

Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres

Encapsulation for smart textile electronics - humidity and temperature sensor

In-Situ Silver Nanoparticle Formation on Surface-Modified Polyetherimide Films

Carbon Nanotube Growth on the Polysilicon Layers of CMOS

Shear strength of off-eutectic Au Ge joints at high-temperature

Shear strength of off-eutectic AuGe joints at high-temperature

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