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Facile access to pyridinium-based bent aromatic amphiphiles: nonionic surface modification of nanocarbons in water

Beilstein journal of organic chemistry, 2024, Vol.20 (1), p.32-40

2024

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Contributions of CSF interleukin-6 elevation to the pathogenesis of myelin oligodendrocyte glycoprotein antibody–associated disease

Multiple sclerosis, 2024-07, Vol.30 (8), p.977-982

2024

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Serum anti-John Cunningham virus antibody seroprevalence and index among Japanese patients with neuromyelitis optica spectrum disorders

Multiple sclerosis, 2020-01, Vol.26 (1), p.128-129

2020

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Facile Processing of Unsubstituted π‐Conjugated Aromatic Polymers through Water‐solubilization Using Aromatic Micelles

Angewandte Chemie International Edition, 2023-08, Vol.62 (31), p.e202306399-n/a

International ed. in English, 2023

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Examination of Teaching Methods to Improve the Wall-Kicking Behavior of a Student With Autism Spectrum Disorder and Intellectual Disability Exhibited Whilst Walking

Tokushu kyōikugaku kenkyū, 2024, Article 23P020

2024

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Long-term disability progression in aquaporin-4 antibody-positive neuromyelitis optica spectrum disorder: a retrospective analysis of 101 patients

Journal of neurology, neurosurgery and psychiatry, 2024-07, Vol.95 (7), p.626-629

2024

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Umbrella‐Shaped Amphiphiles: Internal Alkylation of an Aromatic Micelle and Its Impact on Cavity Features

Angewandte Chemie International Edition, 2024-06, Vol.63 (26), p.e202404088-n/a

International ed. in English, 2024

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Facile Processing of Unsubstituted π‐Conjugated Aromatic Polymers through Water‐solubilization Using Aromatic Micelles

Angewandte Chemie, 2023-08, Vol.135 (31), p.n/a

2023

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Umbrella‐Shaped Amphiphiles: Internal Alkylation of an Aromatic Micelle and Its Impact on Cavity Features

Angewandte Chemie, 2024-06, Vol.136 (26), p.n/a

2024

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Serum anti-JCV antibody indexes in Japanese patients with multiple sclerosis: elevations along with fingolimod treatment duration

Journal of neurology, 2018-05, Vol.265 (5), p.1145-1150

2018

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Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique

Journal of electronic materials, 2005-05, Vol.34 (5), p.630-634

2005

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Promoting Communication in Difficult Cases: Elementary School Special Support Education Coordinators

Tokushu kyōikugaku kenkyū, 2016, Vol.54 (1), p.35-45

2016

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Fabrication of 0.95Sn-0.05Au solder micro-bumps for flip-chip bonding

Journal of electronic materials, 2001-06, Vol.30 (6), p.L25-L27

2001

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Ecological Analysis and Training Dressing by a Pupil With Autism at an Elementary School for Children With Special Needs

Tokushu kyōikugaku kenkyū, 2012, Vol.50 (4), p.393-401

2012

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Recovery of recombination lifetime by pouring de-ionized water onto a rotating plasma-damaged wafer

Journal of applied physics, 1994-06, Vol.75 (12), p.8153-8157

1994

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Submicrometer gold interconnect wiring by sidewall electroplating technology

Japanese Journal of Applied Physics, 1994-04, Vol.33 (4A), p.L553-L555

1994

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Transient enhanced diffusion of ion-implanted boron in Si during rapid thermal annealing

Journal of applied physics, 1988-03, Vol.63 (5), p.1754-1757

1988

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Novel micro-bump fabrication for flip-chip bonding

Journal of electronic materials, 2004-11, Vol.33 (11), p.L21-L23

2004

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High-precision optical lithography for gate process using an antireflective undercoating and local exposure dose control

Microelectronic engineering, 1993-04, Vol.21 (1), p.47-50

1993

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Controllability of novel Sn0.95Au0.05 microbumps using interlaminated tin and gold layers for flip-chip interconnection

IEEE microwave and wireless components letters, 2003-07, Vol.13 (7), p.256-258

2003

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2A2-K03 Development of virtual hand illusion system using augmented reality(Virtual/Augmented Reality and Interfaces)

The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec), 2014-05, Vol.2014, p.2A2-K03_1-2A2-K03_4

2014

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11-ketotestosterone synchronously induces oocyte development and silvering-related changes in the Japanese eel, Anguilla japonica

Zoological science, 2012-04, Vol.29 (4), p.254-259

2012

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Novel flip-chip bonding technology for W-band interconnections using alternate lead-free solder bumps

IEEE microwave and wireless components letters, 2002-10, Vol.12 (10), p.372-374

2002

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Extremely low-noise performance of GaAs MESFETs with wide-head T-shaped gate

IEEE transactions on electron devices, 1999-02, Vol.46 (2), p.310-319

1999

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Effectiveness of First-time Multi-Feedback for Healthy University Student

Japanese Journal of Biofeedback Research, 2007/04/28, Vol.34(1), pp.33-39

2007

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Facile access to pyridinium-based bent aromatic amphiphiles: nonionic surface modification of nanocarbons in water

Contributions of CSF interleukin-6 elevation to the pathogenesis of myelin oligodendrocyte glycoprotein antibody–associated disease

Serum anti-John Cunningham virus antibody seroprevalence and index among Japanese patients with neuromyelitis optica spectrum disorders

Facile Processing of Unsubstituted π‐Conjugated Aromatic Polymers through Water‐solubilization Using Aromatic Micelles

Examination of Teaching Methods to Improve the Wall-Kicking Behavior of a Student With Autism Spectrum Disorder and Intellectual Disability Exhibited Whilst Walking

Long-term disability progression in aquaporin-4 antibody-positive neuromyelitis optica spectrum disorder: a retrospective analysis of 101 patients

Umbrella‐Shaped Amphiphiles: Internal Alkylation of an Aromatic Micelle and Its Impact on Cavity Features

Facile Processing of Unsubstituted π‐Conjugated Aromatic Polymers through Water‐solubilization Using Aromatic Micelles

Umbrella‐Shaped Amphiphiles: Internal Alkylation of an Aromatic Micelle and Its Impact on Cavity Features

Serum anti-JCV antibody indexes in Japanese patients with multiple sclerosis: elevations along with fingolimod treatment duration

Fluxless fabrications of Sn-Au solder microbumps by a hydrogen plasma reflow technique

Promoting Communication in Difficult Cases: Elementary School Special Support Education Coordinators

Fabrication of 0.95Sn-0.05Au solder micro-bumps for flip-chip bonding

Ecological Analysis and Training Dressing by a Pupil With Autism at an Elementary School for Children With Special Needs

Recovery of recombination lifetime by pouring de-ionized water onto a rotating plasma-damaged wafer

Submicrometer gold interconnect wiring by sidewall electroplating technology

Transient enhanced diffusion of ion-implanted boron in Si during rapid thermal annealing

Novel micro-bump fabrication for flip-chip bonding

High-precision optical lithography for gate process using an antireflective undercoating and local exposure dose control

Controllability of novel Sn0.95Au0.05 microbumps using interlaminated tin and gold layers for flip-chip interconnection

2A2-K03 Development of virtual hand illusion system using augmented reality(Virtual/Augmented Reality and Interfaces)

11-ketotestosterone synchronously induces oocyte development and silvering-related changes in the Japanese eel, Anguilla japonica

Novel flip-chip bonding technology for W-band interconnections using alternate lead-free solder bumps

Extremely low-noise performance of GaAs MESFETs with wide-head T-shaped gate

Effectiveness of First-time Multi-Feedback for Healthy University Student

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