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Detection of current-induced vacancies in thin aluminum–copper lines using positrons

Applied physics letters, 1996-01, Vol.68 (3), p.406-408

1996

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Single-Event Upsets in Microelectronics: Fundamental Physics and Issues

MRS bulletin, 2003-02, Vol.28 (2), p.111-116

2003

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32 and 45 nm Radiation-Hardened-by-Design (RHBD) SOI Latches

IEEE transactions on nuclear science, 2011-12, Vol.58 (6), p.2702-2710

2011

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Texture in multilayer metallization structures

Journal of applied physics, 1994-09, Vol.76 (5), p.2671-2680

1994

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Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

IBM journal of research and development, 1995-07, Vol.39 (4), p.465-497

1995

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Nanometer-scale pores in low- k dielectric films probed by positron annihilation lifetime spectroscopy

Applied physics letters, 2002-12, Vol.81 (23), p.4413-4415

2002

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Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu

Journal of materials research, 2001-05, Vol.16 (5), p.1449-1459

2001

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Stacked devices for SEU immune design

2010 IEEE International SOI Conference (SOI), 2010, p.1-2

2010

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Correlation of texture with electromigration behavior in Al metallization

Applied physics letters, 1991-12, Vol.59 (25), p.3241-3243

1991

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Texture inheritance in Al(Cu) interconnect materials

Journal of applied physics, 2001-02, Vol.89 (4), p.2337-2342

2001

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Ultra-Low Emissivity Alpha-Particle Detection

IEEE transactions on nuclear science, 2012-12, Vol.59 (6), p.3101-3109

2012

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Control of in-plane texture of body centered cubic metal thin films

Journal of applied physics, 1997-11, Vol.82 (9), p.4319-4326

1997

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Hardness Assurance Testing for Proton Direct Ionization Effects

IEEE transactions on nuclear science, 2012-08, Vol.59 (4), p.1197-1202

2012

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Estimation of Heavy-Ion LET Thresholds in Advanced SOI IC Technologies From Two-Photon Absorption Laser Measurements

IEEE transactions on nuclear science, 2010-08, Vol.57 (4), p.1827-1834

2010

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COPPER METALLIZATION FOR HIGH PERFORMANCE SILICON TECHNOLOGY

Annual review of materials science, 2000-08, Vol.30 (1), p.229-262

2000

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Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps

IEEE transactions on nuclear science, 2010-12, Vol.57 (6), p.3251-3256

2010

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The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines

Journal of applied physics, 1994-04, Vol.75 (7), p.3423-3434

1994

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Study of Positronium in Low-k Dielectric Films by Means of 2D-Angular Correlation Experiments at a High-Intensity Slow-Positron Beam

Materials science forum, 2001-04, Vol.363-365, p.585-587

2001

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Radiation effects in low dielectric constant methyl-silsesquioxane films

IEEE transactions on nuclear science, 2002-12, Vol.49 (6), p.2724-2728

2002

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Comparison of Single and Two-Photon Absorption for Laser Characterization of Single-Event Upsets in SOI SRAMs

IEEE transactions on nuclear science, 2011-12, Vol.58 (6), p.2968-2975

2011

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Effect of a surface layer on the stress relaxation of thin films

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 1996-07, Vol.14 (4), p.2454-2461

1996

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A Comparison of Grain Size Measurements in Al-Cu Thin Films: Imaging verses Diffraction Techniques

Microscopy and microanalysis, 2002-08, Vol.8 (S02), p.672-673

2002

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Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines

Applied physics letters, 1998-01, Vol.72 (3), p.326-328

1998

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The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines

Journal of applied physics, 2000-11, Vol.88 (9), p.5093-5099

2000

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Electrodeposition of bismuth thin films on n-GaAs (110)

Applied physics letters, 2005-03, Vol.86 (12)

2005

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Detection of current-induced vacancies in thin aluminum–copper lines using positrons

Single-Event Upsets in Microelectronics: Fundamental Physics and Issues

32 and 45 nm Radiation-Hardened-by-Design (RHBD) SOI Latches

Texture in multilayer metallization structures

Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

Nanometer-scale pores in low- k dielectric films probed by positron annihilation lifetime spectroscopy

Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu

Stacked devices for SEU immune design

Correlation of texture with electromigration behavior in Al metallization

Texture inheritance in Al(Cu) interconnect materials

Ultra-Low Emissivity Alpha-Particle Detection

Control of in-plane texture of body centered cubic metal thin films

Hardness Assurance Testing for Proton Direct Ionization Effects

Estimation of Heavy-Ion LET Thresholds in Advanced SOI IC Technologies From Two-Photon Absorption Laser Measurements

COPPER METALLIZATION FOR HIGH PERFORMANCE SILICON TECHNOLOGY

Alpha-Particle Emission Energy Spectra From Materials Used for Solder Bumps

The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines

Study of Positronium in Low-k Dielectric Films by Means of 2D-Angular Correlation Experiments at a High-Intensity Slow-Positron Beam

Radiation effects in low dielectric constant methyl-silsesquioxane films

Comparison of Single and Two-Photon Absorption for Laser Characterization of Single-Event Upsets in SOI SRAMs

Effect of a surface layer on the stress relaxation of thin films

A Comparison of Grain Size Measurements in Al-Cu Thin Films: Imaging verses Diffraction Techniques

Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines

The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines

Electrodeposition of bismuth thin films on n-GaAs (110)

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