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Formation and homogenisation of Sn Cu interconnects by self-propagated exothermic reactive bonding

Materials & design, 2019-07, Vol.174, p.107781, Article 107781

2019

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Metallurgical reactions and tribological properties of self-lubricating Al-WS2 composites: Laser powder bed fusion Vs. spark plasma sintering

Materials & design, 2022-04, Vol.216, p.110543, Article 110543

2022

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Simultaneously enhancing mechanical properties and electrical conductivity of aluminum by using graphene as the reinforcement

Materials letters, 2020-04, Vol.265, p.127440, Article 127440

2020

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MOX (M = Zn, Co, Fe)/AP shell–core nanocomposites for self-catalytical decomposition of ammonium perchlorate

Journal of alloys and compounds, 2012-02, Vol.513, p.213-219

2012

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Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Journal of alloys and compounds, 2017-10, Vol.722, p.746-752

2017

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Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation

Journal of materials research and technology, 2022-07, Vol.19, p.345-353, Article 345

2022

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Synthesis of Gold Nanoparticles Using the Interface of an Emulsion Droplet

Langmuir, 2017-06, Vol.33 (22), p.5464-5472

2017

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Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties

Materials & design, 2020-09, Vol.194, p.108865, Article 108865

2020

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Interfacial reactions and wetting in Al–Mg/oxide ceramic interpenetrating composites made by a pressureless infiltration technique

Composites science and technology, 2012-05, Vol.72 (8), p.886-893

2012

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Magnetic and structural properties of CoFeB thin films grown by pulsed laser deposition

Materials research express, 2020-10, Vol.7 (10), p.106406

2020

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Breakdown and Modification of Microplastic Beads by Aeolian Abrasion

Environmental science & technology, 2023-01, Vol.57 (1), p.76-84

2023

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Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging

Microelectronics and reliability, 2021-11, Vol.126, p.114241, Article 114241

2021

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Transient liquid phase bonding with Ga-based alloys for electronics interconnections

Journal of manufacturing processes, 2022-12, Vol.84, p.1310-1319

2022

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ZnO Micro/Nanocrystals with Tunable Exposed (0001) Facets for Enhanced Catalytic Activity on the Thermal Decomposition of Ammonium Perchlorate

Journal of physical chemistry. C, 2014-06, Vol.118 (22), p.11833-11841

2014

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Measuring coefficient of thermal expansion of materials of micrometre size using SEM/FIB microscope with in situ MEMS heating stage

Journal of microscopy (Oxford), 2024-08, Vol.295 (2), p.191-198

2024

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Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field

Materials today communications, 2022-06, Vol.31, p.103408, Article 103408

2022

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Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Materials letters, 2022-01, Vol.307, p.131074, Article 131074

2022

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Evolution and formation of dissimilar metal interfaces in fusion welding

Acta materialia, 2023-10, Vol.258, p.119232, Article 119232

2023

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Mesoscopic structure features in synthetic graphite

Materials & design, 2018-03, Vol.142, p.268-278

2018

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Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling

Journal of electronic materials, 2024-03, Vol.53 (3), p.1374-1398

2024

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Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging

Microelectronics and reliability, 2022-11, Vol.138, p.114688, Article 114688

2022

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Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding

Materials today communications, 2024-03, Vol.38, p.108401, Article 108401

2024

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Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding

Microelectronics and reliability, 2022-11, Vol.138, p.114654, Article 114654

2022

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Amorphous-crystalline nanostructured Nd-Fe-B permanent magnets using laser powder bed fusion: Metallurgy and magnetic properties

Acta materialia, 2023-10, Vol.259, p.119239, Article 119239

2023

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The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

ACS applied materials & interfaces, 2024-01, Vol.16 (1), p.1846-1860

2024

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Formation and homogenisation of Sn Cu interconnects by self-propagated exothermic reactive bonding

Metallurgical reactions and tribological properties of self-lubricating Al-WS2 composites: Laser powder bed fusion Vs. spark plasma sintering

Simultaneously enhancing mechanical properties and electrical conductivity of aluminum by using graphene as the reinforcement

MOX (M = Zn, Co, Fe)/AP shell–core nanocomposites for self-catalytical decomposition of ammonium perchlorate

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation

Synthesis of Gold Nanoparticles Using the Interface of an Emulsion Droplet

Laser sintering and patterning of gallium-doped zinc oxide/indium-tin oxide nanoparticle films with tailorable electrical and optical properties

Interfacial reactions and wetting in Al–Mg/oxide ceramic interpenetrating composites made by a pressureless infiltration technique

Magnetic and structural properties of CoFeB thin films grown by pulsed laser deposition

Breakdown and Modification of Microplastic Beads by Aeolian Abrasion

Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging

Transient liquid phase bonding with Ga-based alloys for electronics interconnections

ZnO Micro/Nanocrystals with Tunable Exposed (0001) Facets for Enhanced Catalytic Activity on the Thermal Decomposition of Ammonium Perchlorate

Measuring coefficient of thermal expansion of materials of micrometre size using SEM/FIB microscope with in situ MEMS heating stage

Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field

Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Evolution and formation of dissimilar metal interfaces in fusion welding

Mesoscopic structure features in synthetic graphite

Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling

Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging

Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding

Investigation of thermal effect on solidification in Sn/Cu interconnects during self-propagating exothermic reaction bonding

Amorphous-crystalline nanostructured Nd-Fe-B permanent magnets using laser powder bed fusion: Metallurgy and magnetic properties

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

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