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A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

IEEE electron device letters, 2024-03, Vol.45 (3), p.452-455

2024

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A novel fluorescein-based “turn-on” probe for the detection of hydrazine and its application in living cells

Spectrochimica acta. Part A, Molecular and biomolecular spectroscopy, 2018-03, Vol.193, p.324-329

2018

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Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding

ECS journal of solid state science and technology, 2021-06, Vol.10 (6), p.64008

2021

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Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-08, Vol.10 (8), p.1296-1303

2020

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Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-09, Vol.7 (9), p.1560-1566

2017

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An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

IEEE transactions on electron devices, 2017-04, Vol.64 (4), p.1666-1673

2017

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Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect

Journal of materials research and technology, 2024-11, Vol.33, p.4522-4532

2024

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Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-02, Vol.8 (2), p.310-316

2018

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A fluorescein-based highly specific colorimetric and fluorescent probe for hypochlorites in aqueous solution and its application in tap water

Sensors and actuators. B, Chemical, 2012-05, Vol.166-167, p.44-49

2012

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Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.149-156

2022

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Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.660-667

2022

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High Transmittance Broadband THz Polarizer Using 3D-IC Technologies

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1793-1798

2017

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Large-Scale Quantum System Design on Nb-based Superconducting Silicon Interconnect Fabric

2021 22nd International Symposium on Quality Electronic Design (ISQED), 2021, p.315-315

2021

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TSV-less Power Delivery for Wafer-scale Assemblies and Interposers

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1934-1939

2022

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Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.637-642

2017

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A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.2266-2271

2021

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Copper to gold thermal compression bonding in heterogenous wafer-scale systems

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.487-493

2021

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Fine-Pitch (≤ 10 µm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application

2021 IEEE International Electron Devices Meeting (IEDM), 2021, p.1-4

2021

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Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1577-1582

2021

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An Intelligent Digital Microfluidic Processor for Biomedical Detection

Journal of signal processing systems, 2015, Vol.78 (1), p.85-93

2015

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A digital microfluidic processor for biomedical applications

SiPS 2013 Proceedings, 2013, p.54-58

2013

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Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1241-1246

2020

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RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.949-955

2022

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Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1861-1866

2020

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0.0354mm 82μW 125KS/s 3-axis readout circuit for capacitive MEMS accelerometer

2013 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2013, p.109-112

2013

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A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

A novel fluorescein-based “turn-on” probe for the detection of hydrazine and its application in living cells

Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding

Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration

Low-Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3-D Heterogeneous Integration

An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect

Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration

A fluorescein-based highly specific colorimetric and fluorescent probe for hypochlorites in aqueous solution and its application in tap water

Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding

Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric

High Transmittance Broadband THz Polarizer Using 3D-IC Technologies

Large-Scale Quantum System Design on Nb-based Superconducting Silicon Interconnect Fabric

TSV-less Power Delivery for Wafer-scale Assemblies and Interposers

Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration

A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils

Copper to gold thermal compression bonding in heterogenous wafer-scale systems

Fine-Pitch (≤ 10 µm) Nb-based Superconducting Silicon Interconnect Fabric for Large-Scale Quantum System Application

Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications

An Intelligent Digital Microfluidic Processor for Biomedical Detection

A digital microfluidic processor for biomedical applications

Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric

RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications

Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding

0.0354mm 82μW 125KS/s 3-axis readout circuit for capacitive MEMS accelerometer

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