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Novel compensation chemical metal polishing for low dishing and high global planarity for ultra-planar die applications in micro-optics and micro-electro-mechanical systems

Thin solid films, 2004-07, Vol.460 (1), p.306-314

2004

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Fabrication of Ultraplanar Aluminum Mirror Array by Novel Encapsulation CMP for Microoptics and MEMS Applications

Journal of the Electrochemical Society, 2004, Vol.151 (11), p.H232

2004

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CMOS shallow-trench-isolation to 50-nm channel widths

IEEE transactions on electron devices, 2000-06, Vol.47 (6), p.1175-1182

2000

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Approaches toward ultralarge FPDs

Proceedings of the IEEE, 2002-04, Vol.90 (4), p.559-580

2002

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Dynamic response of high-speed PIN and Schottky-barrier photodiode layers to nonuniform optical illumination

Journal of lightwave technology, 1994-08, Vol.12 (8), p.1387-1393

1994

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Rapid thermal processing of thin gate dielectrics. Oxidation of silicon

IEEE electron device letters, 1985-05, Vol.6 (5), p.205-207

1985

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Modeling and simulation of integrated capacitors for high frequency chip power decoupling

IEEE transactions on components and packaging technologies, 2000-12, Vol.23 (4), p.611-619

2000

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Series resistance of silicided ohmic contacts for nanoelectronics

IEEE transactions on electron devices, 1992-08, Vol.39 (8), p.1882-1888

1992

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Heterojunction vertical FETs revisited: potential for 225-GHz large-current operation

IEEE transactions on electron devices, 1992-05, Vol.39 (5), p.1050-1055

1992

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Characteristics of submicrometer gaps in buried-channel CCD structures

IEEE transactions on electron devices, 1991-05, Vol.38 (5), p.1175-1181

1991

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Superconducting Nb-film LC resonator

Review of scientific instruments, 2001-09, Vol.72 (9), p.3682-3686

2001

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Electrical limitations of advanced LOCOS isolation for deep submicrometer CMOS

IEEE transactions on electron devices, 1991-02, Vol.38 (2), p.242-245

1991

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Inversion channel edge in trench-isolated sub-1/4-μm MOSFET's

IEEE transactions on electron devices, 1996-08, Vol.43 (8), p.1274-1280

1996

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Transient response of high-speed p- i- n photodiodes including diffusion effects

Solid-state electronics, 1994-11, Vol.37 (11), p.1841-1847

1994

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Chemically Assisted Ion Beam Etching for Silicon‐Based Microfabrication

Journal of the Electrochemical Society, 1994-06, Vol.141 (6), p.1585-1589

1994

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Conditions for space-charge reversal at thermionic heterojunctions designed for ballistic electron injection

IEEE electron device letters, 1988-02, Vol.9 (2), p.81-83

1988

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Space-charge effects in ballistic injection across heterojunctions (FETs)

IEEE transactions on electron devices, 1992-07, Vol.39 (7), p.1780-1782

1992

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Improved statistical method for extraction of MOSFET effective channel length and resistance

IEEE transactions on electron devices, 1987-06, Vol.34 (6), p.1354-1359

1987

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Lateral space-charge effects on ballistic electron transport across graded heterojunctions

Solid-state electronics, 1989-12, Vol.32 (12), p.1557-1561

1989

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Technology Independent Device Modeling for Simulation of Integrated Circuits for FET Technologies

IEEE transactions on computer-aided design of integrated circuits and systems, 1985-01, Vol.4 (1), p.99-110

1985

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Field Oxide Thinning in Poly Buffer LOCOS Isolation with Active Area Spacings to 0.1 μm

Journal of the Electrochemical Society, 1990-06, Vol.137 (6), p.1867-1870

1990

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2-GHz 150-μW self-aligned Si MESFET logic

IEEE electron device letters, 1984-01, Vol.5 (5), p.159-161

1984

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Shallow, small area, TiSi2 contacts to n+ and p+ silicon

Journal of electronic materials, 1990-10, Vol.19 (10), p.1145-1149

1990

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Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

IEEE transactions on advanced packaging, 1999-11, Vol.22 (4), p.642-648

1999

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Process modeling for submicron complementary metal-oxide-semiconductor very large scale integrated circuits

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 1986-05, Vol.4 (3), p.905-911

Krusius, J. P.

1986

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Novel compensation chemical metal polishing for low dishing and high global planarity for ultra-planar die applications in micro-optics and micro-electro-mechanical systems

Fabrication of Ultraplanar Aluminum Mirror Array by Novel Encapsulation CMP for Microoptics and MEMS Applications

CMOS shallow-trench-isolation to 50-nm channel widths

Approaches toward ultralarge FPDs

Dynamic response of high-speed PIN and Schottky-barrier photodiode layers to nonuniform optical illumination

Rapid thermal processing of thin gate dielectrics. Oxidation of silicon

Modeling and simulation of integrated capacitors for high frequency chip power decoupling

Series resistance of silicided ohmic contacts for nanoelectronics

Heterojunction vertical FETs revisited: potential for 225-GHz large-current operation

Characteristics of submicrometer gaps in buried-channel CCD structures

Superconducting Nb-film LC resonator

Electrical limitations of advanced LOCOS isolation for deep submicrometer CMOS

Inversion channel edge in trench-isolated sub-1/4-μm MOSFET's

Transient response of high-speed p- i- n photodiodes including diffusion effects

Chemically Assisted Ion Beam Etching for Silicon‐Based Microfabrication

Conditions for space-charge reversal at thermionic heterojunctions designed for ballistic electron injection

Space-charge effects in ballistic injection across heterojunctions (FETs)

Improved statistical method for extraction of MOSFET effective channel length and resistance

Lateral space-charge effects on ballistic electron transport across graded heterojunctions

Technology Independent Device Modeling for Simulation of Integrated Circuits for FET Technologies

Field Oxide Thinning in Poly Buffer LOCOS Isolation with Active Area Spacings to 0.1 μm

2-GHz 150-μW self-aligned Si MESFET logic

Shallow, small area, TiSi2 contacts to n+ and p+ silicon

Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

Process modeling for submicron complementary metal-oxide-semiconductor very large scale integrated circuits

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