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IEEE transactions on electron devices, 2005-05, Vol.52 (5), p.909-917
2005
- Link zum Volltext
IEEE transactions on electron devices, 2005-07, Vol.52 (7), p.1541-1547
2005
- Link zum Volltext
IEEE transactions on electron devices, 2004-02, Vol.51 (2), p.279-282
2004
- Link zum Volltext
IEEE transactions on electron devices, 2009-01, Vol.56 (1), p.100-108
2009
- Link zum Volltext
IEEE electron device letters, 2007-01, Vol.28 (1), p.65-67
2007
- Link zum Volltext
2018 IEEE International Electron Devices Meeting (IEDM), 2018, p.28.7.1-28.7.4
- Bae, Geumjong
- Bae, D.-I.
- Kang, M.
- Hwang, S.M.
- Kim, S.S.
- Seo, B.
- Kwon, T.Y.
- Lee, T.J.
- Moon, C.
- Choi, Y.M.
- Oikawa, K.
- Masuoka, S.
- Chun, K.Y.
- Park, S.H.
- Shin, H.J.
- Kim, J.C.
- Bhuwalka, K.K.
- Kim, D.H.
- Kim, W.J.
- Yoo, J.
- Jeon, H.Y.
- Yang, M.S.
- Chung, S.-J.
- Kim, D.
- Ham, B.H.
- Park, K.J.
- Kim, W.D.
- Song, G.
- Kim, Y.H.
- Kang, M.S.
- Hwang, K.H.
- Park, C.-H.
- Lee, J.-H.
- Kim, D.-W.
- Jung, S-M.
- Kang, H.K.
2018
- Link zum Volltext
Thin solid films, 2006-06, Vol.508 (1), p.323-325
2006
Link zum Volltext
Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850), 2004, p.241-244
2004
Link zum Volltext
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