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Obtaining and Characterization of New Materials

Sandu, Andrei Victor

2022

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Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Journal of electronic materials, 2016-01, Vol.45 (1), p.88-97

2016

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Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

Journal of electronic materials, 2006-01, Vol.35 (1), p.89-93

2006

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Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

Soldering & surface mount technology, 2017-09, Vol.29 (4), p.191-198

2017

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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Journal of electronic materials, 2006-01, Vol.35 (1), p.94-106

2006

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Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder

Journal of electronic materials, 2008-04, Vol.37 (4), p.515-522

2008

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Reactions of Sn-4.0Ag-0.5Cu on Cu and Electroless Ni Substrate in Premelting Soldering Process

Journal of electronic materials, 2013-06, Vol.42 (6), p.1254-1259

2013

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A review: On the development of low melting temperature Pb-free solders

Microelectronics and reliability, 2014-06, Vol.54 (6-7), p.1253-1273

2014

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Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Journal of electronic materials, 2006-07, Vol.35 (7), p.1581-1592

2006

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Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Journal of alloys and compounds, 2016-09, Vol.679, p.18-25

2016

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Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Journal of electronic materials, 2006-01, Vol.35 (1), p.65-71

2006

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Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C

Journal of electronic materials, 2011-12, Vol.40 (12), p.2436-2444

2011

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Comparison study of SAC405 and SAC405+0.1%Al lead free solders

Soldering & surface mount technology, 2013-06, Vol.25 (3), p.175-183

2013

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Surface oxide analysis of lead-free solder particles

Soldering & surface mount technology, 2013-01, Vol.25 (1), p.39-44

2013

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Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-08, Vol.702, p.371-385

2017

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Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Journal of electronic materials, 2006-10, Vol.35 (10), p.1818-1824

2006

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Spreading of Sn-Ag solders on FeNi alloys

Acta materialia, 2003-06, Vol.51 (11), p.3185-3197

2003

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Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

Journal of materials processing technology, 2015-01, Vol.215, p.6-11

2015

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Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates

Journal of electronic materials, 2008, Vol.37 (1), p.45-50

2008

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Microvoid Formation at Solder–Copper Interfaces During Annealing: a Systematic Study of the Root Cause

Journal of electronic materials, 2011-12, Vol.40 (12), p.2415-2424

2011

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Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Journal of electronic materials, 2005-09, Vol.34 (9), p.1249-1254

2005

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The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Materials, 2020-10, Vol.13 (19), p.4443

2020

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Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

Journal of alloys and compounds, 2021-03, Vol.858, p.158340, Article 158340

2021

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Low-cycle fatigue properties of eutectic solders at high temperatures

Fatigue & fracture of engineering materials & structures, 2007-05, Vol.30 (5), p.413-419

2007

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Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Materials today communications, 2022-06, Vol.31, p.103221, Article 103221

2022

Volltextzugriff (PDF)

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Obtaining and Characterization of New Materials

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints

Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder

Reactions of Sn-4.0Ag-0.5Cu on Cu and Electroless Ni Substrate in Premelting Soldering Process

A review: On the development of low melting temperature Pb-free solders

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

Effects of Minor Amounts of Zn on the Sn-Zn/Ni Interfacial Reactions and Phase Equilibria of the Ternary Sn-Zn-Ni System at 250°C

Comparison study of SAC405 and SAC405+0.1%Al lead free solders

Surface oxide analysis of lead-free solder particles

Lead free Sn-Ag-Cu solders reinforced by Ni-coated graphene nanosheets prepared by mechanical alloying: Microstructural evolution and mechanical durability

Depressing effect of 0.2wt.%Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

Spreading of Sn-Ag solders on FeNi alloys

Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates

Microvoid Formation at Solder–Copper Interfaces During Annealing: a Systematic Study of the Root Cause

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder

Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate

Low-cycle fatigue properties of eutectic solders at high temperatures

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

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