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First-principles calculations on wetting interface between Ag-Cu-Ti filler metal and SiC ceramic: Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface

Applied surface science, 2018-12, Vol.462, p.55-64

2018

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Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging

Journal of electronic materials, 2021-12, Vol.50 (12), p.7283-7292

2021

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Gigantic suppression of recombination rate in 3D lead-halide perovskites for enhanced photodetector performance

Nature photonics, 2023-03, Vol.17 (3), p.236-243

2023

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First-principles calculations on Ni/W interfaces in Steel/Ni/W hot isostatic pressure diffusion bonding layer

Applied surface science, 2019-05, Vol.475, p.906-916

2019

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Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder

Surface & coatings technology, 2022-11, Vol.450, p.129014, Article 129014

2022

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Influence of interfacial reaction on reactive wettability of molten Ag-Cu-X wt.%Ti ﬁller metal on SiC ceramic substrate and mechanism analysis

Applied surface science, 2018-04, Vol.436, p.768-778

2018

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Study on MIG-TIG double-sided arc welding-brazing of aluminum and stainless steel

Materials letters, 2016-06, Vol.172, p.146-148

2016

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Behavior and mechanism for Boron atom diffusing across tungsten grain boundary in the preparation of WB coating: A first-principles calculation

Applied surface science, 2021-03, Vol.543, p.148778, Article 148778

2021

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Influence of applied electric field on atom diffusion behavior and mechanism for W/NiFe interface in diffusion bonding of Steel/NiFe interlayer/W by spark plasma sintering

Applied surface science, 2021-03, Vol.541, p.148516, Article 148516

2021

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A novel Zn-Al-Si corrosion resistant filler metal for Cu/Al brazing

Materials letters, 2017-11, Vol.206, p.201-204

2017

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The nature of the high thermoelectric properties of CuInX2 (X = S, Se and Te): First-principles study

Applied surface science, 2018-11, Vol.458, p.564-571

2018

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The effect of (Ni2+ + Sr2+) co-doping on structure and dielectric properties of Bi1.5MgNb1.5O7 pyrochlores

Materials science & engineering. B, Solid-state materials for advanced technology, 2022-03, Vol.277, p.115571, Article 115571

2022

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Engineering surface strain for site-selective island growth of Au on anisotropic Au nanostructures

Nano research, 2023-04, Vol.16 (4), p.5873-5879

2023

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Microstructure and mechanical properties of copper/al interlayer/graphite joint prepared utilizing “two-stage method” vacuum diffusion bonding

Vacuum, 2024-09, Vol.227, p.113414, Article 113414

2024

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Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging

Journal of materials science. Materials in electronics, 2022-12, Vol.33 (34), p.25753-25767

2022

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Interfacial microstructure and strengthening mechanism of W/steel diffusion bonding joint using a porous NiFeWss interlayer prepared by in-situ reduction

Materials letters, 2022-03, Vol.310, p.131501, Article 131501

2022

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A novel high efficiency low heat input welding method: High frequency electric cooperated arc welding

Materials letters, 2019-10, Vol.252, p.142-145

2019

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An optimized Ni P seed layer coating method for through glass via (TGV)

Microelectronic engineering, 2022-03, Vol.257, p.111735, Article 111735

2022

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Mechanical test and fractal analysis on anisotropic fracture of cortical bone

Applied surface science, 2015-12, Vol.357, p.2063-2068

2015

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Influence of interfacial structure on bonding strength and thermoelectric transport properties of Cu6Sn5/Cu interface

Surfaces and interfaces, 2022-07, Vol.31, p.102027, Article 102027

2022

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Influence of interfacial configuration on bonding properties and thermal conductivity of heterogeneous interface in Al/Graphite composite used for electronic packaging

Surfaces and interfaces, 2022-12, Vol.35, p.102452, Article 102452

2022

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Effects of semi-solid extrusion and heat treatment on the microstructure, mechanics, and wear resistance of SiC/High aluminum zinc-base alloy composites

Modern physics letters. B, Condensed matter physics, statistical physics, applied physics, 2020-09, Vol.34 (25), p.2050261

2020

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Strength and Toughness Mechanisms of Nanometer Scale and Vortical Structure of Thighbone

Journal of nanoscience and nanotechnology, 2016-07, Vol.16 (7), p.7251-7256

2016

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Herringbone Structure of Nanometer Aragonite Sheets of Chamidae Shell

Journal of nanoscience and nanotechnology, 2016-07, Vol.16 (7), p.7175-7180

2016

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Compound Method to Disperse CaCO3 Nanoparticles to Nano-Size in Water

Journal of nanoscience and nanotechnology, 2015-12, Vol.15 (12), p.9488-9493

2015

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First-principles calculations on wetting interface between Ag-Cu-Ti filler metal and SiC ceramic: Ag (1 1 1)/SiC (1 1 1) interface and Ag (1 1 1)/TiC (1 1 1) interface

Transient Liquid-Phase Sintering Bonding Based on Cu40Sn60 (wt.%) Core/Shell Particles for High-Temperature Power Device Packaging

Gigantic suppression of recombination rate in 3D lead-halide perovskites for enhanced photodetector performance

First-principles calculations on Ni/W interfaces in Steel/Ni/W hot isostatic pressure diffusion bonding layer

Magnetron sputtering preparation of Cu6Sn5 preferred-orientation coating and its influence on wettability of Sn-based lead-free solder

Influence of interfacial reaction on reactive wettability of molten Ag-Cu-X wt.%Ti ﬁller metal on SiC ceramic substrate and mechanism analysis

Study on MIG-TIG double-sided arc welding-brazing of aluminum and stainless steel

Behavior and mechanism for Boron atom diffusing across tungsten grain boundary in the preparation of WB coating: A first-principles calculation

Influence of applied electric field on atom diffusion behavior and mechanism for W/NiFe interface in diffusion bonding of Steel/NiFe interlayer/W by spark plasma sintering

A novel Zn-Al-Si corrosion resistant filler metal for Cu/Al brazing

The nature of the high thermoelectric properties of CuInX2 (X = S, Se and Te): First-principles study

The effect of (Ni2+ + Sr2+) co-doping on structure and dielectric properties of Bi1.5MgNb1.5O7 pyrochlores

Engineering surface strain for site-selective island growth of Au on anisotropic Au nanostructures

Microstructure and mechanical properties of copper/al interlayer/graphite joint prepared utilizing “two-stage method” vacuum diffusion bonding

Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging

Interfacial microstructure and strengthening mechanism of W/steel diffusion bonding joint using a porous NiFeWss interlayer prepared by in-situ reduction

A novel high efficiency low heat input welding method: High frequency electric cooperated arc welding

An optimized Ni P seed layer coating method for through glass via (TGV)

Mechanical test and fractal analysis on anisotropic fracture of cortical bone

Influence of interfacial structure on bonding strength and thermoelectric transport properties of Cu6Sn5/Cu interface

Influence of interfacial configuration on bonding properties and thermal conductivity of heterogeneous interface in Al/Graphite composite used for electronic packaging

Effects of semi-solid extrusion and heat treatment on the microstructure, mechanics, and wear resistance of SiC/High aluminum zinc-base alloy composites

Strength and Toughness Mechanisms of Nanometer Scale and Vortical Structure of Thighbone

Herringbone Structure of Nanometer Aragonite Sheets of Chamidae Shell

Compound Method to Disperse CaCO3 Nanoparticles to Nano-Size in Water

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