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Journal of alloys and compounds, 2012-01, Vol.510 (1), p.107-113
2012
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Current Applied Physics, 2020, 20(7), , pp.866-870
2020
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Current Applied Physics, 2013, 13(8), , pp.1743-1745
2013
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Materials letters, 2016-03, Vol.166, p.192-195
2016
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Physical chemistry chemical physics : PCCP, 2016, Vol.18 (32), p.22364-22372
2016
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Experimental thermal and fluid science, 1997-02, Vol.14 (2), p.174-186
1997
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IEEE transactions on magnetics, 2008-07, Vol.44 (7), p.1935-1940
2008
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IEEE transactions on dielectrics and electrical insulation, 2014-02, Vol.21 (1), p.5-15
2014
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Journal of alloys and compounds, 2014-12, Vol.617, p.850-854
2014
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Materials letters, 2022-07, Vol.318, p.132213, Article 132213
2022
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Materials letters, 2019-11, Vol.254, p.419-422
2019
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Thin solid films, 2004-12, Vol.468 (1-2), p.75-78
2004
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Materials letters, 2017-08, Vol.200, p.51-54
2017
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Mechanical systems and signal processing, 2012-07, Vol.30, p.103-122
2012
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Solid state communications, 2014-02, Vol.179, p.29-33
2014
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Materials letters, 2012-12, Vol.89, p.153-155
2012
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Materials letters, 2016-10, Vol.180, p.256-259
2016
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Surface & coatings technology, 2018-01, Vol.334, p.182-188
2018
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Journal of alloys and compounds, 2011-10, Vol.509 (42), p.10222-10229
2011
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Advanced materials (Weinheim), 2003-10, Vol.15 (20), p.1729-1732
2003
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Journal of chemical information and modeling, 2013-04, Vol.53 (4), p.879-886
2013
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Journal of alloys and compounds, 2014-12, Vol.616, p.577-580
2014
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Applied physics. A, Materials science & processing, 2004-05, Vol.78 (8), p.1193-1196
2004
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Physics letters. B, 2008-08, Vol.666 (1), p.16-22
- Hayasaka, K.
- Abe, K.
- Adachi, I.
- Anipko, D.
- Aulchenko, V.
- Bakich, A.M.
- Bedny, I.
- Belous, K.
- Bitenc, U.
- Bondar, A.
- Bozek, A.
- Brodzicka, J.
- Chao, Y.
- Chistov, R.
- Choi, Y.
- Dalseno, J.
- Danilov, M.
- Dash, M.
- Drutskoy, A.
- Eidelman, S.
- Fratina, S.
- Go, A.
- Golob, B.
- Ha, H.
- Hara, T.
- Hayashii, H.
- Heffernan, D.
- Hoshi, Y.
- Hou, S.
- Hou, W.-S.
- Iijima, T.
- Ikado, K.
- Imoto, A.
- Inami, K.
- Ishikawa, A.
- Itoh, R.
- Iwasaki, Y.
- Kang, J.H.
- Kawai, H.
- Kawasaki, T.
- Khan, H.R.
- Kozakai, Y.
- Kulasiri, R.
- Kumar, R.
- Kuo, C.C.
- Kuzmin, A.
- Kwon, Y.-J.
- Lee, S.E.
- Lesiak, T.
- Liventsev, D.
- Mandl, F.
- Miyake, H.
- Nagasaka, Y.
- Natkaniec, Z.
- Nishida, S.
- Ohshima, T.
- Okuno, S.
- Olsen, S.L.
- Ozaki, H.
- Pakhlova, G.
- Park, H.
- Peak, L.S.
- Piilonen, L.E.
- Poluektov, A.
- Sahoo, H.
- Sakai, Y.
- Schietinger, T.
- Schneider, O.
- Schwartz, A.J.
- Senyo, K.
- Shapkin, M.
- Singh, J.B.
- Sokolov, A.
- Somov, A.
- Stanič, S.
- Sumiyoshi, T.
- Tamai, K.
- Tamura, N.
- Tanaka, M.
- Taylor, G.N.
- Teramoto, Y.
- Tian, X.C.
- Tsuboyama, T.
- Tsukamoto, T.
- Uehara, S.
- Ueno, K.
- Uglov, T.
- Usov, Y.
- Varner, G.
- Vinokurova, A.
- Wang, C.C.
- Watanabe, Y.
- Won, E.
- Xie, Q.L.
- Yabsley, B.D.
- Yamaguchi, A.
- Yamauchi, M.
- Zhang, Z.P.
- Zhulanov, V.
- Zupanc, A.
2008
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Vacuum, 2015-09, Vol.119, p.1-6
2015
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