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Synthetic strategies for highly transparent and colorless polyimide film

Journal of applied polymer science, 2022-07, Vol.139 (28), p.n/a

2022

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Design, synthesis, and characterization of intrinsic black polyimide with complete absorption of visible light and low coefficient of thermal expansion

Polymer (Guilford), 2024-10, Vol.311, p.127501, Article 127501

2024

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Synthesis of colorless transparent poly(amide-imide) with high modulus and low thermal expansion coefficient and its performance study

Polymer (Guilford), 2024-02, Vol.293, p.126691, Article 126691

2024

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A review on thermomechanical properties of polymers and fibers reinforced polymer composites

Journal of Industrial and Engineering Chemistry, 2018, 67(0), , pp.1-11

2018

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Synthesis of highly thermoplastic polyamide-imides with high transparency and low coefficient of thermal expansion

Polymer (Guilford), 2023-08, Vol.282, p.126093, Article 126093

2023

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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Microelectronic engineering, 2015-04, Vol.137, p.101-104

2015

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Synergistically program thermal expansional and mechanical performances in 3D metamaterials: Design-Architecture-Performance

Journal of the mechanics and physics of solids, 2022-12, Vol.169, p.105064, Article 105064

2022

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Superheat-resistant polymers with low coefficients of thermal expansion

Polymer (Guilford), 2017-02, Vol.111, p.91-102

2017

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High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite

Carbon (New York), 2020-10, Vol.168, p.553-563

2020

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Colorless Polyamide–Imide films with tunable coefficient of thermal expansion and their application in flexible display devices

Polymer (Guilford), 2024-02, Vol.294, p.126712, Article 126712

2024

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Ultra-low dielectric constant polyimides: Combined efforts of fluorination and micro-branched crosslink structure

European polymer journal, 2021-01, Vol.143, p.110206, Article 110206

2021

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Improvement of thermal properties of Al/Cu/SiC composites by tailoring the reinforcement microstructure and comparison to thermoelastic models

Journal of alloys and compounds, 2021-02, Vol.853, p.156794, Article 156794

2021

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Preparation and characterization of low CTE thermoplastic copolyimide resins based on the structural design of block sequence

European polymer journal, 2023-08, Vol.195, p.112249, Article 112249

2023

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Breaking the mutual restraint between low permittivity and low thermal expansion in polyimide films via a branched crosslink structure

Polymer (Guilford), 2019-01, Vol.162, p.116-120

2019

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Negative axial thermal expansion coefficient of carbon nanotubes: Experimental determination based on measurements of coefficient of thermal expansion for aligned carbon nanotube reinforced epoxy composites

Carbon (New York), 2015-12, Vol.95 (C), p.904-909

2015

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Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field

European polymer journal, 2024-06, Vol.214, p.113136, Article 113136

2024

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Enhancing the mechanical and dielectric properties of high thermally stable polyimides via a crosslinkable bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride monomer

Polymer (Guilford), 2024-01, Vol.290, p.126495, Article 126495

2024

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Effect of graphene addition on thermal behavior of 3D printed graphene/AlSi10Mg composite

Journal of alloys and compounds, 2022-01, Vol.890, p.161725, Article 161725

2022

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Negative thermal expansion property of β-Cu2V2O7

Solid state ionics, 2019-12, Vol.343, p.115086, Article 115086

2019

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Synthesis and properties of transparent random and multi-block polyamide-imide films with high modulus and low CTE

European polymer journal, 2021-06, Vol.153, p.110512, Article 110512

2021

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Advanced characterization methods for wear resistant hard coatings: A review on recent progress

Surface & coatings technology, 2016-01, Vol.285, p.31-46

2016

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Growth and characterization of thermal properties of single crystals of solid solutions MnxFe1-xIn2S4

Journal of crystal growth, 2024-08, Vol.640, p.127763, Article 127763

2024

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Structural and thermal characterization of novel Ni(II)(L-threoninato)2(H2O)2 crystal

Journal of solid state chemistry, 2024-03, Vol.331, p.124502, Article 124502

2024

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Microstructures and properties of Cu/Fe/Kovar composites prepared with cu-coated Kovar alloy powders

Materials letters, 2024-05, Vol.362, p.136218, Article 136218

2024

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Mechanical and thermal expansion behavior of hybrid aluminum matrix composites reinforced with SiC particles and short carbon fibers

Journal of alloys and compounds, 2023-06, Vol.947, p.169550, Article 169550

2023

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Synthetic strategies for highly transparent and colorless polyimide film

Design, synthesis, and characterization of intrinsic black polyimide with complete absorption of visible light and low coefficient of thermal expansion

Synthesis of colorless transparent poly(amide-imide) with high modulus and low thermal expansion coefficient and its performance study

A review on thermomechanical properties of polymers and fibers reinforced polymer composites

Synthesis of highly thermoplastic polyamide-imides with high transparency and low coefficient of thermal expansion

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Synergistically program thermal expansional and mechanical performances in 3D metamaterials: Design-Architecture-Performance

Superheat-resistant polymers with low coefficients of thermal expansion

High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite

Colorless Polyamide–Imide films with tunable coefficient of thermal expansion and their application in flexible display devices

Ultra-low dielectric constant polyimides: Combined efforts of fluorination and micro-branched crosslink structure

Improvement of thermal properties of Al/Cu/SiC composites by tailoring the reinforcement microstructure and comparison to thermoelastic models

Preparation and characterization of low CTE thermoplastic copolyimide resins based on the structural design of block sequence

Breaking the mutual restraint between low permittivity and low thermal expansion in polyimide films via a branched crosslink structure

Negative axial thermal expansion coefficient of carbon nanotubes: Experimental determination based on measurements of coefficient of thermal expansion for aligned carbon nanotube reinforced epoxy composites

Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field

Enhancing the mechanical and dielectric properties of high thermally stable polyimides via a crosslinkable bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride monomer

Effect of graphene addition on thermal behavior of 3D printed graphene/AlSi10Mg composite

Negative thermal expansion property of β-Cu2V2O7

Synthesis and properties of transparent random and multi-block polyamide-imide films with high modulus and low CTE

Advanced characterization methods for wear resistant hard coatings: A review on recent progress

Growth and characterization of thermal properties of single crystals of solid solutions MnxFe1-xIn2S4

Structural and thermal characterization of novel Ni(II)(L-threoninato)2(H2O)2 crystal

Microstructures and properties of Cu/Fe/Kovar composites prepared with cu-coated Kovar alloy powders

Mechanical and thermal expansion behavior of hybrid aluminum matrix composites reinforced with SiC particles and short carbon fibers

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