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Ultrabright X-ray laser scattering for dynamic warm dense matter physics

Nature photonics, 2015-03, Vol.9 (4), p.274-279

2015

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Ideal charge-density-wave order in the high-field state of superconducting YBCO

Proceedings of the National Academy of Sciences - PNAS, 2016-12, Vol.113 (51), p.14645-14650

2016

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Highly uniform microfluidic electroless interconnections for chip stacking applications

Electrochimica acta, 2021-04, Vol.376, p.138032, Article 138032

2021

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A large-scale, high-resolution hydrological model parameter data set for climate change impact assessment for the conterminous US

Hydrology and earth system sciences, 2014-01, Vol.18 (1), p.67-84

2014

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Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling

Materials, 2023-04, Vol.16 (9), p.3290

2023

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TRITON: A Multi-GPU open source 2D hydrodynamic flood model

Environmental modelling & software : with environment data news, 2021-07, Vol.141, p.105034, Article 105034

2021

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Foldable Kirigami Paper Electronics

Physica status solidi. A, Applications and materials science, 2020-05, Vol.217 (9), p.n/a

2020

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Poly(amidoamine) dendrimers: covalent and supramolecular synthesis

Materials today chemistry, 2019-09, Vol.13, p.34-48

2019

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Micromechanisms of fracture from acoustic emission

International journal of rock mechanics and mining sciences (Oxford, England : 1997), 2011-06, Vol.48 (4), p.666-673

2011

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Classification of US Hydropower Dams by their Modes of Operation

River research and applications, 2016-09, Vol.32 (7), p.1450-1468

2016

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Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

Materials, 2022-11, Vol.15 (21), p.7783

2022

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Au–Sn bonding material for the assembly of power integrated circuit module

Journal of alloys and compounds, 2016-06, Vol.671, p.340-345

2016

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The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance

IEEE transactions on electron devices, 2020-05, Vol.67 (5), p.2205-2207

2020

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Effects of Ti addition to Sn–Ag and Sn–Cu solders

Journal of alloys and compounds, 2012-04, Vol.520, p.244-249

2012

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Evaluation of non-point source pollution and river water quality using a multimedia two-model system

Journal of hydrology (Amsterdam), 2011-11, Vol.409 (3), p.583-595

2011

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In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

Journal of applied physics, 2011-12, Vol.110 (12), p.123525-123525-9

2011

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Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Journal of alloys and compounds, 2009-06, Vol.478 (1), p.121-127

2009

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The Complete Optical Spectrum of Liquid Water Measured by Inelastic X-Ray Scattering

Proceedings of the National Academy of Sciences - PNAS, 2000-06, Vol.97 (12), p.6264-6266

2000

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Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.155-174

2007

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A silicon photo-multiplier signal readout using strip-line and waveform sampling for Positron Emission Tomography

Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 2016-09, Vol.830, p.119-129

2016

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Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution

Electrochimica acta, 2022-09, Vol.425, p.140710, Article 140710

2022

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Solid-phase dendrimer synthesis: a promising approach to transform dendrimer construction

Materials today chemistry, 2023-01, Vol.27, p.101285, Article 101285

2023

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Nanoparticle-Templated Assembly of Viral Protein Cages

Nano letters, 2006-04, Vol.6 (4), p.611-615

2006

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Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System

Materials, 2024-02, Vol.17 (4), p.883

2024

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Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate

Materials, 2023-09, Vol.16 (18), p.6263

2023

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Ultrabright X-ray laser scattering for dynamic warm dense matter physics

Ideal charge-density-wave order in the high-field state of superconducting YBCO

Highly uniform microfluidic electroless interconnections for chip stacking applications

A large-scale, high-resolution hydrological model parameter data set for climate change impact assessment for the conterminous US

Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling

TRITON: A Multi-GPU open source 2D hydrodynamic flood model

Foldable Kirigami Paper Electronics

Poly(amidoamine) dendrimers: covalent and supramolecular synthesis

Micromechanisms of fracture from acoustic emission

Classification of US Hydropower Dams by their Modes of Operation

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration

Au–Sn bonding material for the assembly of power integrated circuit module

The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance

Effects of Ti addition to Sn–Ag and Sn–Cu solders

Evaluation of non-point source pollution and river water quality using a multimedia two-model system

In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

The Complete Optical Spectrum of Liquid Water Measured by Inelastic X-Ray Scattering

Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders

A silicon photo-multiplier signal readout using strip-line and waveform sampling for Positron Emission Tomography

Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution

Solid-phase dendrimer synthesis: a promising approach to transform dendrimer construction

Nanoparticle-Templated Assembly of Viral Protein Cages

Phase Equilibria Related to NiGa5 in the Binary Ni-Ga System

Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate

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