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Communication—Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance

Journal of the Electrochemical Society, 2016, Vol.163 (5), p.D185-D187

2016

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The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling

Journal of the Electrochemical Society, 2016, Vol.163 (8), p.D434-D441

2016

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Defect Engineering of Metal Halide Perovskite Nanocrystals via Spontaneous Diffusion of Ag Nanocrystals

Small (Weinheim an der Bergstrasse, Germany), 2024-06, Vol.20 (23), p.e2307032-n/a

2024

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Communication—Acceleration of TSV Filling by Adding Thiourea to PEG-PPG-SPS-I

Journal of the Electrochemical Society, 2018, Vol.165 (3), p.D91-D93

2018

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Electrodeposition of Cu-Ag films in ammonia-based electrolyte

Journal of alloys and compounds, 2019-02, Vol.775, p.639-646

2019

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Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling

Journal of the Electrochemical Society, 2013, Vol.160 (12), p.D3179-D3185

2013

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Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths

Journal of the Electrochemical Society, 2015-01, Vol.162 (4), p.H294-H300

2015

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Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition—Its Interaction with Cuprous Ion from Comproportionation

Journal of the Electrochemical Society, 2016, Vol.163 (8), p.D428-D433

2016

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Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films

Thin solid films, 2014-01, Vol.550, p.421-427

2014

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High Accuracy Concentration Analysis of Accelerator Components in Acidic Cu Superfilling Bath

Journal of the Electrochemical Society, 2016-01, Vol.163 (2), p.D33-D39

2016

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Electrochemical Behavior of Citric Acid and Its Influence on Cu Electrodeposition for Damascene Metallization

Journal of the Electrochemical Society, 2015-01, Vol.162 (8), p.D354-D359

2015

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Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor

Journal of the Electrochemical Society, 2013, Vol.160 (12), p.D3221-D3227

2013

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Focused-Laser-Enabled p–n Junctions in Graphene Field-Effect Transistors

ACS nano, 2013-07, Vol.7 (7), p.5850-5857

2013

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Three-Dimensional Branched Nanowire Heterostructures as Efficient Light-Extraction Layer in Light-Emitting Diodes

Advanced functional materials, 2014-06, Vol.24 (22), p.3384-3391

2014

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Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives

Journal of the Electrochemical Society, 2015-01, Vol.162 (3), p.D109-D114

2015

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Alloyed 2D Metal–Semiconductor Atomic Layer Junctions

Nano letters, 2016-03, Vol.16 (3), p.1890-1895

2016

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Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization

Journal of the Electrochemical Society, 2014, Vol.161 (14), p.D749-D755

2014

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Osteogenesis induced by a bone forming peptide from the prodomain region of BMP-7

Biomaterials, 2012-10, Vol.33 (29), p.7057-7063

2012

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Preparation and application of chelating polymer–mesoporous carbon composite for copper-ion adsorption

Carbon (New York), 2009-04, Vol.47 (4), p.1043-1049

2009

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Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling

Journal of the Electrochemical Society, 2013-01, Vol.160 (4), p.D202-D205

2013

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Investigation on newly designed low resistivity polyimide-type alignment layer for reducing DC image sticking of in-plane switching liquid crystal display

Liquid crystals, 2017-03, Vol.44 (4), p.738-747

2017

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Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition

ECS electrochemistry letters, 2015-08, Vol.4 (10), p.D31-D34

2015

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Preparation of polypyrrole-incorporated mesoporous carbon-based composites for confinement of Eu(iii) within mesopores

Journal of materials chemistry, 2010-06, Vol.20 (22), p.4663-4668

2010

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Communication—Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance

The Influences of Iodide Ion on Cu Electrodeposition and TSV Filling

Defect Engineering of Metal Halide Perovskite Nanocrystals via Spontaneous Diffusion of Ag Nanocrystals

Communication—Acceleration of TSV Filling by Adding Thiourea to PEG-PPG-SPS-I

Electrodeposition of Cu-Ag films in ammonia-based electrolyte

Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling

Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths

Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition—Its Interaction with Cuprous Ion from Comproportionation

Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films

High Accuracy Concentration Analysis of Accelerator Components in Acidic Cu Superfilling Bath

Electrochemical Behavior of Citric Acid and Its Influence on Cu Electrodeposition for Damascene Metallization

Cu Bottom-Up Filling for Through Silicon Vias with Growing Surface Established by the Modulation of Leveler and Suppressor

Focused-Laser-Enabled p–n Junctions in Graphene Field-Effect Transistors

Three-Dimensional Branched Nanowire Heterostructures as Efficient Light-Extraction Layer in Light-Emitting Diodes

Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives

Alloyed 2D Metal–Semiconductor Atomic Layer Junctions

Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization

Osteogenesis induced by a bone forming peptide from the prodomain region of BMP-7

Preparation and application of chelating polymer–mesoporous carbon composite for copper-ion adsorption

Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling

Investigation on newly designed low resistivity polyimide-type alignment layer for reducing DC image sticking of in-plane switching liquid crystal display

Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition

Preparation of polypyrrole-incorporated mesoporous carbon-based composites for confinement of Eu(iii) within mesopores

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