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Highly Luminescent and Photostable Quantum Dot–Silica Monolith and Its Application to Light-Emitting Diodes

ACS nano, 2013-02, Vol.7 (2), p.1472-1477

2013

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Microstructure, mechanical property and Hall-Petch relationship of a light-weight refractory Al0.1CrNbVMo high entropy alloy fabricated by powder metallurgical process

Journal of alloys and compounds, 2018-10, Vol.767, p.1012-1021

2018

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Enhanced Minor Ginsenoside Contents of Nano-Sized Black Korean Ginseng through Hot Melt Extrusion

Materials, 2024-09, Vol.17 (18), p.4612

2024

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Bright and Uniform Green Light Emitting InP/ZnSe/ZnS Quantum Dots for Wide Color Gamut Displays

ACS applied nano materials, 2019-03, Vol.2 (3), p.1496-1504

2019

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Large Thermoelectric Figure-of-Merits from SiGe Nanowires by Simultaneously Measuring Electrical and Thermal Transport Properties

Nano letters, 2012-06, Vol.12 (6), p.2918-2923

2012

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A light-driven supramolecular nanowire actuator

Nanoscale, 2015-04, Vol.7 (15), p.6457-6461

2015

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Low cycle fatigue behavior of alloy 690 in simulated PWR water—Effects of dynamic strain aging and hydrogen

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2014-08, Vol.611, p.37-44

2014

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High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.181-195

2011

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Microstructural evolution and thermal stability of Al–Zn–Mg–Cu–Si–Zr alloy fabricated via spark plasma sintering

Journal of materials research and technology, 2024-07, Vol.31, p.205-212

2024

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Enhanced mechanical properties of spark plasma sintered NiTi composites reinforced with carbon nanotubes

Journal of alloys and compounds, 2014-12, Vol.617, p.505-510

2014

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Nanoparticle migration on the microchannel wall surface in low-Reynolds-number nanofluids

AIP advances, 2024-06, Vol.14 (6), p.065038-065038-9

2024

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Scalable and Isotropic Expansion of Tissues with Simply Tunable Expansion Ratio

Advanced science, 2019-11, Vol.6 (22), p.1901673-n/a

2019

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Lotus Root Type Nickel Oxide-Carbon Nanofibers: A Hybrid Supercapacitor Electrode Material

Applied sciences, 2024-04, Vol.14 (7), p.2977

2024

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.220-233

2011

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Surface‐modified Ag@Ru‐P25 for photocatalytic CO2 conversion with high selectivity over CH4 formation at the solid–gas interface

Carbon energy, 2024-01, Vol.6 (1), p.n/a

2024

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Photopatternable Quantum Dots Forming Quasi-Ordered Arrays

Nano letters, 2010-07, Vol.10 (7), p.2310-2317

2010

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High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-04, Vol.4 (4), p.697-707

2014

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PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.208-219

2011

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Ultra-high strength WNbMoTaV high-entropy alloys with fine grain structure fabricated by powder metallurgical process

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2018-01, Vol.712, p.616-624

2018

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Synergistic outstanding strengthening behavior of graphene/copper nanocomposites

Composites. Part B, Engineering, 2019-11, Vol.176, p.107235, Article 107235

2019

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Effects of particle size and surface modification of SiC on the wear behavior of high volume fraction Al/SiCp composites

Journal of alloys and compounds, 2020-08, Vol.831, p.154647, Article 154647

2020

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Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-11, Vol.3 (11), p.1891-1906

2013

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Measurement and Analysis of a High-Speed TSV Channel

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-10, Vol.2 (10), p.1672-1685

2012

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The effect of Ti on the sintering and mechanical properties of refractory high-entropy alloy TixWTaVCr fabricated via spark plasma sintering for fusion plasma-facing materials

Materials chemistry and physics, 2018-05, Vol.210, p.87-94

2018

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Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-12, Vol.2 (12), p.2057-2070

2012

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Highly Luminescent and Photostable Quantum Dot–Silica Monolith and Its Application to Light-Emitting Diodes

Microstructure, mechanical property and Hall-Petch relationship of a light-weight refractory Al0.1CrNbVMo high entropy alloy fabricated by powder metallurgical process

Enhanced Minor Ginsenoside Contents of Nano-Sized Black Korean Ginseng through Hot Melt Extrusion

Bright and Uniform Green Light Emitting InP/ZnSe/ZnS Quantum Dots for Wide Color Gamut Displays

Large Thermoelectric Figure-of-Merits from SiGe Nanowires by Simultaneously Measuring Electrical and Thermal Transport Properties

A light-driven supramolecular nanowire actuator

Low cycle fatigue behavior of alloy 690 in simulated PWR water—Effects of dynamic strain aging and hydrogen

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Microstructural evolution and thermal stability of Al–Zn–Mg–Cu–Si–Zr alloy fabricated via spark plasma sintering

Enhanced mechanical properties of spark plasma sintered NiTi composites reinforced with carbon nanotubes

Nanoparticle migration on the microchannel wall surface in low-Reynolds-number nanofluids

Scalable and Isotropic Expansion of Tissues with Simply Tunable Expansion Ratio

Lotus Root Type Nickel Oxide-Carbon Nanofibers: A Hybrid Supercapacitor Electrode Material

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Surface‐modified Ag@Ru‐P25 for photocatalytic CO2 conversion with high selectivity over CH4 formation at the solid–gas interface

Photopatternable Quantum Dots Forming Quasi-Ordered Arrays

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Ultra-high strength WNbMoTaV high-entropy alloys with fine grain structure fabricated by powder metallurgical process

Synergistic outstanding strengthening behavior of graphene/copper nanocomposites

Effects of particle size and surface modification of SiC on the wear behavior of high volume fraction Al/SiCp composites

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Measurement and Analysis of a High-Speed TSV Channel

The effect of Ti on the sintering and mechanical properties of refractory high-entropy alloy TixWTaVCr fabricated via spark plasma sintering for fusion plasma-facing materials

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

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