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Design of a Four-Band and Polarization-Insensitive Terahertz Metamaterial Absorber

IEEE photonics journal, 2015-02, Vol.7 (1), p.1-8

2015

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Unified characterisation of in-plane and out-of-plane constraint based on crack-tip equivalent plastic strain

Fatigue & fracture of engineering materials & structures, 2013-06, Vol.36 (6), p.504-514

2013

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Relations between fatigue strength and other mechanical properties of metallic materials

Fatigue & fracture of engineering materials & structures, 2014-09, Vol.37 (9), p.958-976

2014

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The effect of groove-textured surface on friction and wear and friction-induced vibration and noise

Wear, 2013-04, Vol.301 (1-2), p.671-681

2013

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Unified correlation of in‐plane and out‐of‐plane constraints with fracture toughness

Fatigue & fracture of engineering materials & structures, 2014-02, Vol.37 (2), p.132-145

2014

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Effect of two-stage dehydration on retention of characteristic flavor components of flue-cured tobacco in rotary dryer

Drying technology, 2016-10, Vol.34 (13), p.1621-1629

2016

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Improvement of FFD parametric approach in the application of a lifting body

Aeronautical journal, 2023-08, Vol.127 (1314), p.1353-1379

2023

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Three-dimensional numerical analysis of out-of-plane creep crack-tip constraint in compact tension specimens

The International journal of pressure vessels and piping, 2012-08, Vol.96-97, p.78-89

2012

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Optimization of multi-pass milling using parallel genetic algorithm and parallel genetic simulated annealing

International journal of machine tools & manufacture, 2005-12, Vol.45 (15), p.1726-1734

2005

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Design and development of a micro polycrystalline diamond ball end mill for micro/nano freeform machining of hard and brittle materials

Journal of micromechanics and microengineering, 2009-11, Vol.19 (11), p.115022-115022 (10)

2009

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Fault detection of linear discrete-time periodic systems

IEEE transactions on automatic control, 2005-02, Vol.50 (2), p.239-244

2005

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Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

Journal of electronic packaging, 2001-09, Vol.123 (3), p.247-253

2001

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High-speed milling of titanium alloys using binderless CBN tools

International journal of machine tools & manufacture, 2005, Vol.45 (1), p.105-114

2005

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Tool wear characteristics of binderless CBN tools used in high-speed milling of titanium alloys

Wear, 2005-02, Vol.258 (5), p.752-758

2005

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Correlation of creep crack-tip constraint between axially cracked pipelines and test specimens

The International journal of pressure vessels and piping, 2012-10, Vol.98, p.16-25

2012

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On the Plastic Wave Propagation Along the Specimen Length in SHPB Test

Experimental mechanics, 2010-09, Vol.50 (7), p.1061-1074

2010

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Geometrical imperfection and adiabatic shear banding

International journal of impact engineering, 2008-11, Vol.35 (11), p.1280-1292

2008

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Broadly Tunable Grating-Coupled External Cavity Laser With Quantum-Dot Active Region

IEEE photonics technology letters, 2010-12, Vol.22 (24), p.1799-1801

2010

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High-performance quantum-dot superluminescent diodes

IEEE photonics technology letters, 2004-01, Vol.16 (1), p.27-29

2004

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Axial form-factor and induced pseudoscalar form-factor of the nucleons

The European physical journal. C, Particles and fields, 2006-08, Vol.47 (2), p.375-384

2006

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A model for scattering due to interface roughness in finite quantum wells

Semiconductor science and technology, 2005-12, Vol.20 (12), p.1207-1212

2005

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New method to get fundamental Gaussian beam’s perturbation solution and its global property

Applied physics. B, Lasers and optics, 2008-11, Vol.93 (2-3), p.345-348

2008

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Dynamic analysis and field investigation of a fluidized landslide in Guanling, Guizhou, China

Engineering geology, 2014-10, Vol.181, p.1-14

2014

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Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

Journal of materials science. Materials in electronics, 2013, Vol.24 (1), p.211-216

2013

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InAs/GaAs quantum-dot superluminescent diodes with 110 nm bandwidth

Electronics letters, 2005-12, Vol.41 (25), p.1400-1402

2005

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Design of a Four-Band and Polarization-Insensitive Terahertz Metamaterial Absorber

Unified characterisation of in-plane and out-of-plane constraint based on crack-tip equivalent plastic strain

Relations between fatigue strength and other mechanical properties of metallic materials

The effect of groove-textured surface on friction and wear and friction-induced vibration and noise

Unified correlation of in‐plane and out‐of‐plane constraints with fracture toughness

Effect of two-stage dehydration on retention of characteristic flavor components of flue-cured tobacco in rotary dryer

Improvement of FFD parametric approach in the application of a lifting body

Three-dimensional numerical analysis of out-of-plane creep crack-tip constraint in compact tension specimens

Optimization of multi-pass milling using parallel genetic algorithm and parallel genetic simulated annealing

Design and development of a micro polycrystalline diamond ball end mill for micro/nano freeform machining of hard and brittle materials

Fault detection of linear discrete-time periodic systems

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

High-speed milling of titanium alloys using binderless CBN tools

Tool wear characteristics of binderless CBN tools used in high-speed milling of titanium alloys

Correlation of creep crack-tip constraint between axially cracked pipelines and test specimens

On the Plastic Wave Propagation Along the Specimen Length in SHPB Test

Geometrical imperfection and adiabatic shear banding

Broadly Tunable Grating-Coupled External Cavity Laser With Quantum-Dot Active Region

High-performance quantum-dot superluminescent diodes

Axial form-factor and induced pseudoscalar form-factor of the nucleons

A model for scattering due to interface roughness in finite quantum wells

New method to get fundamental Gaussian beam’s perturbation solution and its global property

Dynamic analysis and field investigation of a fluidized landslide in Guanling, Guizhou, China

Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

InAs/GaAs quantum-dot superluminescent diodes with 110 nm bandwidth

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