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Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-08, Vol.11 (8), p.1223-1234
2021
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Journal of cleaner production, 2021-01, Vol.278, p.123043, Article 123043
2021
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Dyes and pigments, 2021-11, Vol.195, p.109692, Article 109692
2021
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Energy sources. Part A, Recovery, utilization, and environmental effects, 2024-12, Vol.ahead-of-print (ahead-of-print), p.1-12
2024
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Energy sources. Part A, Recovery, utilization, and environmental effects, 2019-12, Vol.41 (23), p.2906-2916
2019
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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.1083-1092
2016
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2019 IEEE Global Humanitarian Technology Conference (GHTC), 2019, p.1-5
2019
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2019 IEEE Global Humanitarian Technology Conference (GHTC), 2019, p.1-5
2019
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Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2002, p.35-41
2002
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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-9
2010
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2017 IEEE Technological Innovations in ICT for Agriculture and Rural Development (TIAR), 2017, p.36-41
2017
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2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-9
2010
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The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004, Vol.1, p.635-640 Vol.1
2004
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Journal of membrane science, 2011-09, Vol.380 (1), p.13-20
2011
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Journal of materials science. Materials in electronics, 2015-01, Vol.26 (1), p.49-58
2015
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Journal of materials science. Materials in electronics, 2017-11, Vol.28 (22), p.17297-17307
2017
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Journal of materials science. Materials in electronics, 2023-07, Vol.34 (21), p.1566, Article 1566
2023
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Composites. Part B, Engineering, 2019-06, Vol.167, p.44-50
2019
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Journal of materials science. Materials in electronics, 2019-06, Vol.30 (11), p.10934-10943
2019
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Journal of electronic materials, 2022, Vol.51 (1), p.8-16
2022
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IEEE access, 2024, Vol.12, p.54608-54649
2024
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Journal of ambient intelligence and humanized computing, 2022-09, Vol.13 (9), p.4159-4173
2022
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Healthcare technology letters, 2018-08, Vol.5 (4), p.107-112
2018
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Applied physics. B, Lasers and optics, 2024, Vol.130 (9), p.166, Article 166
- Rosen, Joseph
- Alford, Simon
- Allan, Blake
- Anand, Vijayakumar
- Arnon, Shlomi
- Arockiaraj, Francis Gracy
- Art, Jonathan
- Bai, Bijie
- Balasubramaniam, Ganesh M.
- Birnbaum, Tobias
- Bisht, Nandan S.
- Blinder, David
- Cao, Liangcai
- Chen, Qian
- Chen, Ziyang
- Dubey, Vishesh
- Egiazarian, Karen
- Ercan, Mert
- Forbes, Andrew
- Gopakumar, G.
- Gao, Yunhui
- Gigan, Sylvain
- Gocłowski, Paweł
- Gopinath, Shivasubramanian
- Greenbaum, Alon
- Horisaki, Ryoichi
- Ierodiaconou, Daniel
- Juodkazis, Saulius
- Karmakar, Tanushree
- Katkovnik, Vladimir
- Khonina, Svetlana N.
- Kner, Peter
- Kravets, Vladislav
- Kumar, Ravi
- Lai, Yingming
- Li, Chen
- Li, Jiaji
- Li, Shaoheng
- Li, Yuzhu
- Liang, Jinyang
- Manavalan, Gokul
- Mandal, Aditya Chandra
- Manisha, Manisha
- Mann, Christopher
- Marzejon, Marcin J.
- Moodley, Chané
- Morikawa, Junko
- Muniraj, Inbarasan
- Narbutis, Donatas
- Ng, Soon Hock
- Nothlawala, Fazilah
- Oh, Jeonghun
- Ozcan, Aydogan
- Park, YongKeun
- Porfirev, Alexey P.
- Potcoava, Mariana
- Prabhakar, Shashi
- Pu, Jixiong
- Rai, Mani Ratnam
- Rogalski, Mikołaj
- Ryu, Meguya
- Choudhary, Sakshi
- Salla, Gangi Reddy
- Schelkens, Peter
- Şener, Sarp Feykun
- Shevkunov, Igor
- Shimobaba, Tomoyoshi
- Singh, Rakesh K.
- Singh, Ravindra P.
- Stern, Adrian
- Sun, Jiasong
- Zhou, Shun
- Zuo, Chao
- Zurawski, Zack
- Tahara, Tatsuki
- Tiwari, Vipin
- Trusiak, Maciej
- Vinu, R. V.
- Volotovskiy, Sergey G.
- Yılmaz, Hasan
- De Aguiar, Hilton Barbosa
- Ahluwalia, Balpreet S.
- Ahmad, Azeem
2024
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Journal of electrostatics, 2017-06, Vol.87, p.19-25
2017
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