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Electronics letters, 2017-06, Vol.53 (12), p.772-773
2017
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Journal of hazardous materials, 2005-12, Vol.127 (1), p.187-195
2005
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IEEE transactions on applied superconductivity, 2023-08, Vol.33 (5), p.1-5
2023
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Journal of biomedical materials research. Part A, 2014-05, Vol.102 (5), p.1458-1466
2014
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Electronics letters, 2014-08, Vol.50 (18), p.1320-1322
2014
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Electronics letters, 2009, Vol.45 (4), p.201-202
2009
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MATEC Web of Conferences, 2016, Vol.78, p.1106
2016
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Journal of hazardous materials, 2009-10, Vol.170 (1), p.144-150
2009
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Electronics letters, 2012-07, Vol.48 (14), p.850-851
2012
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IEEE transactions on magnetics, 2009-11, Vol.45 (11), p.5088-5093
2009
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MATEC Web of Conferences, 2016, Vol.78, p.1107
2016
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IEEE transactions on applied superconductivity, 2009-06, Vol.19 (3), p.2399-2402
2009
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IEEE transactions on applied superconductivity, 2011-06, Vol.21 (3), p.2012-2015
2011
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IEEE transactions on information theory, 2005-04, Vol.51 (4), p.1424-1431
2005
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International journal of satellite communications and networking, 2013-09, Vol.31 (5), p.249-262
2013
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CIRP annals, 2002, Vol.51 (1), p.79-82
2002
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IEEE transactions on semiconductor manufacturing, 2008-05, Vol.21 (2), p.297-304
2008
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ACS sustainable chemistry & engineering, 2023-02, Vol.11 (5), p.1846-1856
2023
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2012 IEEE International Symposium on Electromagnetic Compatibility, 2012, p.173-178
2012
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Sensors (Basel, Switzerland), 2013-04, Vol.13 (4), p.4146-4156
2013
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Engineering failure analysis, 2014-07, Vol.42, p.87-99
2014
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Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2005-05, Vol.23 (3), p.1308-1312
2005
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2019 Optical Fiber Communications Conference and Exhibition (OFC), 2019, p.1-2
2019
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Reliability engineering & system safety, 1997-06, Vol.56 (3), p.265-272
1997
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