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Hydrothermal stability of CuSSZ13 for reducing NOx by NH3

Journal of catalysis, 2014-03, Vol.311, p.447-457

2014

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Reduced restenosis and enhanced re-endothelialization of functional biodegradable vascular scaffolds by everolimus and magnesium hydroxide

생체재료학회지, 2023, 27(00), , pp.251-267

2022

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Multi-modulation of immune-inflammatory response using bioactive molecule-integrated PLGA composite for spinal fusion

Materials today bio, 2023-04, Vol.19, p.100611-100611, Article 100611

2023

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Efficient Recovery of Silver from Crystalline Silicon Solar Cells by Controlling the Viscosity of Electrolyte Solvent in an Electrochemical Process

Applied sciences, 2018-11, Vol.8 (11), p.2131

2018

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Injectable Microparticle-containing hydrogel with controlled release of bioactive molecules for facial rejuvenation

Materials today bio, 2024-02, Vol.24, p.100890-100890, Article 100890

2024

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Magnetostrictive patch sensor system for battery-less real-time measurement of torsional vibrations of rotating shafts

Journal of sound and vibration, 2018-02, Vol.414, p.245-258

2018

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Degradation analysis of mixed ionic-electronic conductor-supported iron-oxide oxygen carriers for chemical-looping conversion of methane

Applied energy, 2019-04, Vol.239, p.644-657

2019

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Surface Patterning of Metal Zinc Electrode with an In-Region Zincophilic Interface for High-Rate and Long-Cycle-Life Zinc Metal Anode

Nano-micro letters, 2024-12, Vol.16 (1), p.112-18, Article 112

2024

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Correction: Surface Patterning of Metal Zinc Electrode with an In-Region Zincophilic Interface for High-Rate and Long-Cycle-Life Zinc Metal Anode

Nano-micro letters, 2024-12, Vol.16 (1), p.137-2, Article 137

2024

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Multifunctional vitamin D-incorporated PLGA scaffold with BMP/VEGF-overexpressed tonsil-derived MSC via CRISPR/Cas9 for bone tissue regeneration

Materials today bio, 2024-10, Vol.28, p.101254, Article 101254

2024

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Iron-substituted TNU-9, TNU-10, and IM-5 zeolites and their steam-activated analogs as catalysts for direct N₂O decomposition

Journal of catalysis, 2011-11, Vol.284 (1), p.23-33

2011

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Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

IEEE transactions on electronics packaging manufacturing, 2007-07, Vol.30 (3), p.221-227

2007

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Stable dendrite-free Zn electrodeposition triggered by hydrophobic-zincophilic and elastic interface for highly reversible Zn battery anode

Chemical engineering journal (Lausanne, Switzerland : 1996), 2024-08, Vol.493, p.152577, Article 152577

2024

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Simultaneous and Continuous Production of Carbon Nanotubes and Hydrogen by Catalytic CH4 Decomposition in a Pressurized Fluidized-Bed Reactor

Industrial & engineering chemistry research, 2024-01, Vol.63 (2), p.930-941

2024

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ROMA: Run-Time Object Detection To Maximize Real-Time Accuracy

2023 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV), 2023, p.6394-6403

2023

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Increased Leverage of Transprecision Computing for Machine Vision Applications at the Edge

Journal of signal processing systems, 2022-10, Vol.94 (10), p.1101-1118

2022

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Subwavelength elastic joints connecting torsional waveguides to maximize the power transmission coefficient

Journal of sound and vibration, 2017-03, Vol.392, p.154-169

2017

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Fan Out Package: Performance and Scalability Perspective

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1194-1199

2018

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Development on integrated passive devices using wafer level package technologies

2010 12th Electronics Packaging Technology Conference, 2010, p.691-695

2010

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Improvement of drop shock and TC reliability for large die Wafer Level Packages in mobile application

2009 11th Electronics Packaging Technology Conference, 2009, p.673-678

2009

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Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.864-871

2007

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Studies on double-layered metal bumps for fine pitch flip chip applications

2005 International Symposium on Electronics Materials and Packaging, 2005, p.95-100

2005

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Three-Dimensional Integrated Circuit (3D-IC) Package Using Fan-Out Technology

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.35-40

2019

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Hardware accelerated Scalable Parallel Random Number Generators for Monte Carlo methods

2008 51st Midwest Symposium on Circuits and Systems, 2008, p.177-180

2008

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CiB(Chip in Board) Optical Engine Module Using Advanced Fan-Out Package Technology

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.563-568

2019

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Hydrothermal stability of CuSSZ13 for reducing NOx by NH3

Reduced restenosis and enhanced re-endothelialization of functional biodegradable vascular scaffolds by everolimus and magnesium hydroxide

Multi-modulation of immune-inflammatory response using bioactive molecule-integrated PLGA composite for spinal fusion

Efficient Recovery of Silver from Crystalline Silicon Solar Cells by Controlling the Viscosity of Electrolyte Solvent in an Electrochemical Process

Injectable Microparticle-containing hydrogel with controlled release of bioactive molecules for facial rejuvenation

Magnetostrictive patch sensor system for battery-less real-time measurement of torsional vibrations of rotating shafts

Degradation analysis of mixed ionic-electronic conductor-supported iron-oxide oxygen carriers for chemical-looping conversion of methane

Surface Patterning of Metal Zinc Electrode with an In-Region Zincophilic Interface for High-Rate and Long-Cycle-Life Zinc Metal Anode

Correction: Surface Patterning of Metal Zinc Electrode with an In-Region Zincophilic Interface for High-Rate and Long-Cycle-Life Zinc Metal Anode

Multifunctional vitamin D-incorporated PLGA scaffold with BMP/VEGF-overexpressed tonsil-derived MSC via CRISPR/Cas9 for bone tissue regeneration

Iron-substituted TNU-9, TNU-10, and IM-5 zeolites and their steam-activated analogs as catalysts for direct N₂O decomposition

Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

Stable dendrite-free Zn electrodeposition triggered by hydrophobic-zincophilic and elastic interface for highly reversible Zn battery anode

Simultaneous and Continuous Production of Carbon Nanotubes and Hydrogen by Catalytic CH4 Decomposition in a Pressurized Fluidized-Bed Reactor

ROMA: Run-Time Object Detection To Maximize Real-Time Accuracy

Increased Leverage of Transprecision Computing for Machine Vision Applications at the Edge

Subwavelength elastic joints connecting torsional waveguides to maximize the power transmission coefficient

Fan Out Package: Performance and Scalability Perspective

Development on integrated passive devices using wafer level package technologies

Improvement of drop shock and TC reliability for large die Wafer Level Packages in mobile application

Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch Applications

Studies on double-layered metal bumps for fine pitch flip chip applications

Three-Dimensional Integrated Circuit (3D-IC) Package Using Fan-Out Technology

Hardware accelerated Scalable Parallel Random Number Generators for Monte Carlo methods

CiB(Chip in Board) Optical Engine Module Using Advanced Fan-Out Package Technology

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