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Electronics letters, 2008, Vol.44 (8), p.520-521
2008
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IEEE journal on selected areas in communications, 2012-10, Vol.30 (9), p.1738-1745
2012
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Journal of construction engineering and management, 2023-02, Vol.149 (2)
2023
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Chemical engineering transactions, 2015-12, Vol.46
2015
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Applied energy, 2015-01, Vol.137, p.677-691
2015
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2019 International Vacuum Electronics Conference (IVEC), 2019, p.1-2
2019
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IEEE transactions on geoscience and remote sensing, 2006-05, Vol.44 (5), p.1075-1092
- Waters, J.W.
- Froidevaux, L.
- Harwood, R.S.
- Jarnot, R.F.
- Pickett, H.M.
- Read, W.G.
- Siegel, P.H.
- Cofield, R.E.
- Filipiak, M.J.
- Flower, D.A.
- Holden, J.R.
- Lau, G.K.
- Livesey, N.J.
- Manney, G.L.
- Pumphrey, H.C.
- Santee, M.L.
- Wu, D.L.
- Cuddy, D.T.
- Lay, R.R.
- Loo, M.S.
- Perun, V.S.
- Schwartz, M.J.
- Stek, P.C.
- Thurstans, R.P.
- Boyles, M.A.
- Chandra, K.M.
- Chavez, M.C.
- Gun-Shing Chen
- Chudasama, B.V.
- Dodge, R.
- Fuller, R.A.
- Girard, M.A.
- Jiang, J.H.
- Yibo Jiang
- Knosp, B.W.
- LaBelle, R.C.
- Lam, J.C.
- Lee, K.A.
- Miller, D.
- Oswald, J.E.
- Patel, N.C.
- Pukala, D.M.
- Quintero, O.
- Scaff, D.M.
- Van Snyder, W.
- Tope, M.C.
- Wagner, P.A.
- Walch, M.J.
2006
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Microelectronic engineering, 2007-09, Vol.84 (9), p.2014-2017
2007
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Journal of lightwave technology, 1992-11, Vol.10 (11), p.1766-1772
1992
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Water research (Oxford), 2009-07, Vol.43 (12), p.3029-3036
2009
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Journal of management in engineering, 2012-07, Vol.28 (3), p.330-337
2012
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Radioengineering, 2013-12, Vol.22 (4), p.1194-1201
2013
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International Electron Devices Meeting. Technical Digest, 1996, p.679-682
1996
- Link zum Volltext
2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC), 2019, p.1-1
2019
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IEEE electron device letters, 2009-04, Vol.30 (4), p.392-394
2009
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IEEE transactions on wireless communications, 2007-06, Vol.6 (6), p.2017-2021
2007
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IEEE transactions on broadcasting, 2007-09, Vol.53 (3), p.719-724
2007
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Journal of lightwave technology, 2005-01, Vol.23 (1), p.95-103
2005
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Ocean engineering, 2018-02, Vol.149, p.325-340
2018
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