Sortiert nach
Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method
2002
- Link zum Volltext
56th Electronic Components and Technology Conference 2006, 2006, p.7 pp.
2006
- Link zum Volltext
IEEE transactions on components and packaging technologies, 2004-12, Vol.27 (4), p.651-658
2004
- Link zum Volltext
Aktive Filter
Suchergebnisse filtern
Filter anzeigenNur zeigen
Publikationsform
Sprache
Erscheinungsjahr
n.n
n.n
Thema
- Engineering
- Science & Technology
- Technology
- Computer Simulation
- Electronics Packaging
- Engineering, Electrical & Electronic
- Finite Element Methods
- Materials Science
- Materials Science, Multidisciplinary
- Mathematical Models
- Acoustic Testing
- Actuators
- Applied Sciences
- Business
- Chip Scale Packaging
- Commercialization
- Delaminating
- Delamination
- Design And Test For Reliability
Kollektion