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Electrochemical dissolution behavior of Ti6Al4V alloy: Effect of microstructure and processing method

Journal of materials processing technology, 2022-09, Vol.307, p.117646, Article 117646

2022

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The enhancement of damage tolerance of 3D-printed high strength architected metallic glasses by unit cell shape design

Additive manufacturing, 2024-04, Vol.85, p.104125, Article 104125

2024

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Strong yet ductile refractory high entropy alloy fabricated via additive manufacturing

Additive manufacturing, 2024-02, Vol.81, p.104009, Article 104009

2024

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Revealing thermal behavior, cracking behavior, phase and microstructure formation of a ternary equiatomic alloy additively manufactured using directed energy deposition

Additive manufacturing, 2023-09, Vol.78, p.103897, Article 103897

2023

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Study of under bump metallisation barrier layer for lead-free solder

Soldering & surface mount technology, 2003-08, Vol.15 (2), p.46-52

2003

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Theoretical analysis of springback in bending of integrated circuit leadframes

Journal of materials processing technology, 1999-06, Vol.91 (1), p.111-115

1999

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Surface characterization in ultra-precision machining of Al/SiC metal matrix composites using data dependent systems analysis

Journal of materials processing technology, 2003-09, Vol.140 (1-3), p.141-146

2003

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Laser bending of leadframe materials

Journal of materials processing technology, 1998-10, Vol.82 (1), p.117-121

1998

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Deformation behaviour of chromium sheets in mechanical and laser bending

Journal of materials processing technology, 2002-03, Vol.122 (2), p.272-277

2002

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Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package

IEEE transactions on components and packaging technologies, 2009-12, Vol.32 (4), p.838-848

2009

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Influence of spike current in different shaped waveforms on the hardness and grain size of nickel electroforms

Journal of materials processing technology, 2001-11, Vol.117 (1), p.97-104

2001

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Innovation and new technology for the new millenium

Journal of materials processing technology, 2003-07, Vol.138 (1), p.1-1

2003

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The effect of a coating on the springback of integrated circuit leadframes

Journal of materials processing technology, 2001-10, Vol.116 (2), p.231-234

2001

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Microstructure and phase decomposition of quasi-crystal Zn60Mg30Y10 alloy

Journal of materials processing technology, 2002-04, Vol.123 (2), p.245-250

2002

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An analysis of the plane-strain bending of an orthotropic sheet in the elastic/plastic range

Journal of materials processing technology, 2000-08, Vol.104 (1), p.48-52

2000

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A damage model for fracture prediction of superplastic aluminium composite sheet

Journal of materials processing technology, 2002-02, Vol.121 (2), p.301-307

2002

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Effect of reverse pulse current on the internal stress of electroformed nickel

Journal of materials processing technology, 1997, Vol.63 (1), p.819-822

1997

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A new theoretical model for predicting limit strains in the punch stretching of sheet metals

Journal of materials processing technology, 1999-06, Vol.91 (1), p.257-263

1999

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Processing and Mechanical Properties of Biphasic Calcium-Phosphate/Poly-L-Lactide Composite Biomaterials

Materials science forum, 2004-01, Vol.471-472, p.273-277

2004

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High temperature deformation behavior of Al 2124-SiCp composite

Journal of materials processing technology, 1997-01, Vol.63 (1-3), p.395-398

1997

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On the susceptibility to localized necking of defect-free metal sheets under biaxial stretching

Journal of materials processing technology, 1996-03, Vol.58 (2), p.251-255

1996

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Springback in the roller forming of integrated circuit leadframes

Journal of materials processing technology, 1997-04, Vol.66 (1), p.107-111

1997

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Numerical analysis of an inside-out tube inversion process

Journal of materials processing technology, 1997-04, Vol.66 (1), p.130-136

1997

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Development of joint electroforming technology

Journal of materials processing technology, 1997, Vol.63 (1), p.844-847

1997

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Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package

2008 10th Electronics Packaging Technology Conference, 2008, p.613-619

2008

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IEEE_Xplore

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Electrochemical dissolution behavior of Ti6Al4V alloy: Effect of microstructure and processing method

The enhancement of damage tolerance of 3D-printed high strength architected metallic glasses by unit cell shape design

Strong yet ductile refractory high entropy alloy fabricated via additive manufacturing

Revealing thermal behavior, cracking behavior, phase and microstructure formation of a ternary equiatomic alloy additively manufactured using directed energy deposition

Study of under bump metallisation barrier layer for lead-free solder

Theoretical analysis of springback in bending of integrated circuit leadframes

Surface characterization in ultra-precision machining of Al/SiC metal matrix composites using data dependent systems analysis

Laser bending of leadframe materials

Deformation behaviour of chromium sheets in mechanical and laser bending

Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low- k Large-Die Flip Chip Package

Influence of spike current in different shaped waveforms on the hardness and grain size of nickel electroforms

Innovation and new technology for the new millenium

The effect of a coating on the springback of integrated circuit leadframes

Microstructure and phase decomposition of quasi-crystal Zn60Mg30Y10 alloy

An analysis of the plane-strain bending of an orthotropic sheet in the elastic/plastic range

A damage model for fracture prediction of superplastic aluminium composite sheet

Effect of reverse pulse current on the internal stress of electroformed nickel

A new theoretical model for predicting limit strains in the punch stretching of sheet metals

Processing and Mechanical Properties of Biphasic Calcium-Phosphate/Poly-L-Lactide Composite Biomaterials

High temperature deformation behavior of Al 2124-SiCp composite

On the susceptibility to localized necking of defect-free metal sheets under biaxial stretching

Springback in the roller forming of integrated circuit leadframes

Numerical analysis of an inside-out tube inversion process

Development of joint electroforming technology

Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package

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