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Journal of electronic materials, 2016-01, Vol.45 (1), p.473-485
2016
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Journal of micromechanics and microengineering, 2012-02, Vol.22 (2), p.25014-10
2012
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Microelectronics and reliability, 2012-07, Vol.52 (7), p.1454-1463
2012
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Microelectronics and reliability, 2008-03, Vol.48 (3), p.455-470
2008
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Microelectronics and reliability, 2006-02, Vol.46 (2), p.574-588
2006
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-05, Vol.1 (5), p.695-704
2011
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IEEE transactions on advanced packaging, 2006-11, Vol.29 (4), p.690-700
2006
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IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 1997-01, Vol.44 (1), p.102-107
1997
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IEEE transactions on advanced packaging, 2007-11, Vol.30 (4), p.695-704
2007
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IEEE transactions on advanced packaging, 2007-11, Vol.30 (4), p.681-694
2007
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IEEE transactions on advanced packaging, 2005-11, Vol.28 (4), p.704-712
2005
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IEEE transactions on device and materials reliability, 2016-09, Vol.16 (3), p.345-359
2016
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IEEE transactions on components and packaging technologies, 1999-09, Vol.22 (3), p.414-420
1999
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1996 IEEE Ultrasonics Symposium. Proceedings, 1996, Vol.1, p.757-760 vol.1
1996
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1995 IEEE Ultrasonics Symposium. Proceedings. An International Symposium, 1995, Vol.1, p.775-778 vol.1
1995
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- Ieee Transactions On Advanced Packaging
- Microelectronics And Reliability
- Ieee Transactions On Components And Packaging Technologies
- Ieee Transactions On Components, Packaging, And Manufacturing Technology
- Ieee Transactions On Device And Materials Reliability
- Ieee Transactions On Ultrasonics, Ferroelectrics, And Frequency Control
- Journal Of Electronic Materials
- Journal Of Micromechanics And Microengineering