UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

IEEE transactions on electromagnetic compatibility, 2006-05, Vol.48 (2), p.319-330

2006

Volltextzugriff (PDF)

Design and Analysis of a Novel Compact High Permittivity Dielectric Resonator Antenna

IEEE transactions on magnetics, 2009-03, Vol.45 (3), p.1052-1055

2009

Volltextzugriff (PDF)

Managing clinical terminology data while requirements are changing

2009 IEEE Pacific Rim Conference on Communications, Computers and Signal Processing, 2009, p.407-412

Georgescu, M.D.

2009

Volltextzugriff (PDF)

A Compact Integrated ISM Bandpass Filter Based on Combline Structures on Organic Substrate

2006 1st Electronic Systemintegration Technology Conference, 2006, Vol.2, p.802-804

2006

Volltextzugriff (PDF)

Three-dimensional system-in-package using stacked silicon platform technology

IEEE transactions on advanced packaging, 2005-08, Vol.28 (3), p.377-386

2005

Volltextzugriff (PDF)

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

IEEE transactions on advanced packaging, 2005-05, Vol.28 (2), p.298-309

2005

Volltextzugriff (PDF)

A compact and low cost multilayered balun designed for SiP applications

2006 8th Electronics Packaging Technology Conference, 2006, p.82-84

2006

Volltextzugriff (PDF)

A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

IEEE transactions on advanced packaging, 2007-08, Vol.30 (3), p.439-447

2007

Volltextzugriff (PDF)

Coupling of simultaneous switching noise to interconnecting lines in high-speed systems

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.568-574 Vol.1

2004

Volltextzugriff (PDF)

Coaxial probe dielectric measurements in the presence of airgaps

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.496-498

2004

Volltextzugriff (PDF)

Via and reference discontinuity impact on high-speed signal integrity

2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), 2004, Vol.2, p.583-587 vol.2

2004

Volltextzugriff (PDF)

Improved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.510-515

2004

Volltextzugriff (PDF)

Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1589-1593

2003

Volltextzugriff (PDF)

1 – 13 von 13

Menü

Weitere Dienste

Einstellungen

Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

Design and Analysis of a Novel Compact High Permittivity Dielectric Resonator Antenna

Managing clinical terminology data while requirements are changing

A Compact Integrated ISM Bandpass Filter Based on Combline Structures on Organic Substrate

Three-dimensional system-in-package using stacked silicon platform technology

Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs

A compact and low cost multilayered balun designed for SiP applications

A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices

Coupling of simultaneous switching noise to interconnecting lines in high-speed systems

Coaxial probe dielectric measurements in the presence of airgaps

Via and reference discontinuity impact on high-speed signal integrity

Improved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique

Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

Aktive Filter

Suchergebnisse filtern