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Channel Estimation via Orthogonal Matching Pursuit for Hybrid MIMO Systems in Millimeter Wave Communications

IEEE transactions on communications, 2016-06, Vol.64 (6), p.2370-2386

2016

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Early Detection of Parkinson's Disease Using Deep Learning and Machine Learning

IEEE access, 2020-01, Vol.8, p.1-1

2020

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Wind Power Prediction Using Ensemble Learning-Based Models

IEEE access, 2020, Vol.8, p.61517-61527

2020

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A Schiff Base Fluorescence Enhancement Probe for Fe(III) and Its Sensing Applications in Cancer Cells

Sensors (Basel, Switzerland), 2019-05, Vol.19 (11), p.2500

2019

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Spatial Multiplexing of OFDM Signals With QPSK Modulation Over ESPAR

IEEE transactions on vehicular technology, 2017-06, Vol.66 (6), p.4914-4923

2017

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Design of Thin RC Absorbers Using a Silver Nanowire Resistive Screen

Journal of Electromagnetic Engineering and Science, 2016, 16(2), , pp.106-111

2016

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High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.181-195

2011

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Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer With Arbitrary Power-Supply Voltage Fluctuations

IEEE transactions on circuits and systems. I, Regular papers, 2014-07, Vol.61 (7), p.2022-2033

2014

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.220-233

2011

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Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

IEEE microwave and wireless components letters, 2006-09, Vol.16 (9), p.481-483

2006

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High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-04, Vol.4 (4), p.697-707

2014

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Detection and analysis of shaft misalignment in application of production and logistics systems using motor current signature analysis

Expert systems with applications, 2023-05, Vol.217, p.119463, Article 119463

2023

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PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-02, Vol.1 (2), p.208-219

2011

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Effective bass enhancement using second-order adaptive notch filter

IEEE transactions on consumer electronics, 2008-05, Vol.54 (2), p.663-668

2008

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High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

IEEE microwave and wireless components letters, 2005-08, Vol.15 (8), p.505-507

2005

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Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-11, Vol.3 (11), p.1891-1906

2013

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Exploiting spatial sparsity for estimating channels of hybrid MIMO systems in millimeter wave communications

2014 IEEE Global Communications Conference, 2014, p.3326-3331

2014

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Measurement and Analysis of a High-Speed TSV Channel

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-10, Vol.2 (10), p.1672-1685

2012

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Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-12, Vol.2 (12), p.2057-2070

2012

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Empirical mode decomposition and Hilbert–Huang transform-based eccentricity fault detection and classification with demagnetization in 120 kW interior permanent magnet synchronous motors

Expert systems with applications, 2024-05, Vol.241, p.122515, Article 122515

2024

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A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-01, Vol.5 (1), p.28-39

2015

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A Measurement of Modal Gain Profile and Its Effect on the Lasing Performance in Vertical-External-Cavity Surface-Emitting Lasers

IEEE photonics technology letters, 2006-12, Vol.18 (23), p.2496-2498

2006

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Practical Routing Algorithm Using a Congestion Monitoring System in Semiconductor Manufacturing

IEEE transactions on semiconductor manufacturing, 2018-11, Vol.31 (4), p.475-485

2018

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MCW-Net: Single image deraining with multi-level connections and wide regional non-local blocks

Signal processing. Image communication, 2022-07, Vol.105, p.116701, Article 116701

2022

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A Multi-Server Authentication Protocol Achieving Privacy Protection and Traceability for 5G Mobile Edge Computing

2021 IEEE International Conference on Consumer Electronics (ICCE), 2021, p.1-4

2021

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Channel Estimation via Orthogonal Matching Pursuit for Hybrid MIMO Systems in Millimeter Wave Communications

Early Detection of Parkinson's Disease Using Deep Learning and Machine Learning

Wind Power Prediction Using Ensemble Learning-Based Models

A Schiff Base Fluorescence Enhancement Probe for Fe(III) and Its Sensing Applications in Cancer Cells

Spatial Multiplexing of OFDM Signals With QPSK Modulation Over ESPAR

Design of Thin RC Absorbers Using a Silver Nanowire Resistive Screen

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Analytical Probability Density Calculation for Step Pulse Response of a Single-Ended Buffer With Arbitrary Power-Supply Voltage Fluctuations

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications

High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via

Detection and analysis of shaft misalignment in application of production and logistics systems using motor current signature analysis

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Effective bass enhancement using second-order adaptive notch filter

High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions

Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Exploiting spatial sparsity for estimating channels of hybrid MIMO systems in millimeter wave communications

Measurement and Analysis of a High-Speed TSV Channel

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Empirical mode decomposition and Hilbert–Huang transform-based eccentricity fault detection and classification with demagnetization in 120 kW interior permanent magnet synchronous motors

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

A Measurement of Modal Gain Profile and Its Effect on the Lasing Performance in Vertical-External-Cavity Surface-Emitting Lasers

Practical Routing Algorithm Using a Congestion Monitoring System in Semiconductor Manufacturing

MCW-Net: Single image deraining with multi-level connections and wide regional non-local blocks

A Multi-Server Authentication Protocol Achieving Privacy Protection and Traceability for 5G Mobile Edge Computing

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