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A blind flow fingerprinting and correlation method against disturbed anonymous traffic based on pattern reconstruction

Computer networks (Amsterdam, Netherlands : 1999), 2024-12, Vol.254, p.110831, Article 110831

2024

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ACTSS: Input Detection Defense against Backdoor Attacks via Activation Subset Scanning

2022 International Joint Conference on Neural Networks (IJCNN), 2022, p.1-8

2022

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Improvement of bluetooth technology scheduling algorithm for wireless personal area network

2017 IEEE 2nd Information Technology, Networking, Electronic and Automation Control Conference (ITNEC), 2017, p.408-411

2017

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Family of the Coupled-Inductor Multiplier Voltage Rectifier Quasi-Z-Source Inverters

IEEE transactions on industrial electronics (1982), 2021-06, Vol.68 (6), p.4903-4915

2021

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Enhancement of a 12/4 Hybrid-Excitation Switched Reluctance Machine With Both Segmented-Stator and -Rotor

IEEE transactions on industrial electronics (1982), 2021-10, Vol.68 (10), p.9229-9241

2021

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Expectation-Maximization Based Disturbance Identification and Velocity Tracking for Gimbal Servo Systems With Dynamic Imbalance

IEEE transactions on circuits and systems. I, Regular papers, 2024-07, Vol.71 (7), p.3357-3367

2024

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Accurate Respiration Monitoring for Mobile Users With Commercial RFID Devices

IEEE journal on selected areas in communications, 2021-02, Vol.39 (2), p.513-525

2021

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OKRA: optimal task and resource allocation for energy minimization in mobile edge computing systems

Wireless networks, 2019-07, Vol.25 (5), p.2851-2867

2019

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A novel multiple moving objects recognition and segmentation based on dense optical flow and K-means clustering

Signal, image and video processing, 2024, Vol.18 (12), p.9275-9284

2024

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A polymer trench filling based silicon isolation technique and its application to two-axis scanning comb-drive micromirrors

Sensors and actuators. A. Physical., 2024-05, Vol.370, p.115256, Article 115256

2024

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DEPICTER: A Design-Principle Guided and Heuristic-Rule Constrained Software Refactoring Approach

IEEE transactions on reliability, 2022-06, Vol.71 (2), p.698-715

2022

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Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs With Polyimide Liner Considering Diffusion Creep Behavior

IEEE transactions on electron devices, 2023-02, Vol.70 (2), p.695-701

2023

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A Modified Switched-Coupled-Inductor Quasi-Z-Source Inverter

IEEE journal of emerging and selected topics in power electronics, 2021-06, Vol.9 (3), p.3634-3646

2021

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Electrical Characterization of Coaxial Silicon-Insulator-Silicon Through-Silicon Vias: Theoretical Analysis and Experiments

IEEE transactions on electron devices, 2016-12, Vol.63 (12), p.4880-4887

2016

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Extensible Z-Source Inverter Architecture: Modular Construction and Analysis

IEEE transactions on power electronics, 2021-02, Vol.36 (2), p.1742-1763

2021

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Ultra-Deep Annular Cu Through-Silicon-Vias Fabricated Using Single-Sided Process

IEEE electron device letters, 2022-03, Vol.43 (3), p.426-429

2022

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Duplex mode tilt measurements based on a MEMS biaxial resonant accelerometer

Sensors and actuators. A. Physical., 2019-09, Vol.296, p.222-234

2019

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Single-switch boost converter with extremely high step-up voltage gain

Journal of Power Electronics, 2020, 20(6), , pp.1375-1385

2020

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Study and Implementation of 600-V High-Voltage Gate Driver IC With the Common-Mode Dual-Interlock Technique for GaN Devices

IEEE transactions on industrial electronics (1982), 2021-02, Vol.68 (2), p.1506-1514

2021

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Wideband Capacitance Evaluation of Silicon-Insulator-Silicon Through-Silicon-Vias for 3D Integration Applications

IEEE electron device letters, 2016-02, Vol.37 (2), p.216-219

2016

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High step-up three-level DC–DC converter with three-winding coupled-inductor

Journal of Power Electronics, 2020, 20(1), , pp.53-64

2020

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Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner

Microelectronics and reliability, 2014-06, Vol.54 (6-7), p.1384-1391

2014

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Research on Torque Characteristics of Vehicle Motor under Multisource Excitation

Electronics (Basel), 2024-06, Vol.13 (11), p.2019

2024

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Dynamic Trajectory Planning of Autonomous Lane Change at Medium and Low Speeds Based on Elastic Soft Constraint of the Safety Domain

Automotive Innovation, 2020-03, Vol.3 (1), p.73-87

2020

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Impact of polyimide liner on high-aspect-ratio through-silicon-vias (TSVs): electrical characteristics and copper protrusion

Microsystem technologies : sensors, actuators, systems integration, 2017-08, Vol.23 (8), p.3757-3764

2017

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A blind flow fingerprinting and correlation method against disturbed anonymous traffic based on pattern reconstruction

ACTSS: Input Detection Defense against Backdoor Attacks via Activation Subset Scanning

Improvement of bluetooth technology scheduling algorithm for wireless personal area network

Family of the Coupled-Inductor Multiplier Voltage Rectifier Quasi-Z-Source Inverters

Enhancement of a 12/4 Hybrid-Excitation Switched Reluctance Machine With Both Segmented-Stator and -Rotor

Expectation-Maximization Based Disturbance Identification and Velocity Tracking for Gimbal Servo Systems With Dynamic Imbalance

Accurate Respiration Monitoring for Mobile Users With Commercial RFID Devices

OKRA: optimal task and resource allocation for energy minimization in mobile edge computing systems

A novel multiple moving objects recognition and segmentation based on dense optical flow and K-means clustering

A polymer trench filling based silicon isolation technique and its application to two-axis scanning comb-drive micromirrors

DEPICTER: A Design-Principle Guided and Heuristic-Rule Constrained Software Refactoring Approach

Modeling and Characterization of Annealing-Induced Cu Protrusion of TSVs With Polyimide Liner Considering Diffusion Creep Behavior

A Modified Switched-Coupled-Inductor Quasi-Z-Source Inverter

Electrical Characterization of Coaxial Silicon-Insulator-Silicon Through-Silicon Vias: Theoretical Analysis and Experiments

Extensible Z-Source Inverter Architecture: Modular Construction and Analysis

Ultra-Deep Annular Cu Through-Silicon-Vias Fabricated Using Single-Sided Process

Duplex mode tilt measurements based on a MEMS biaxial resonant accelerometer

Single-switch boost converter with extremely high step-up voltage gain

Study and Implementation of 600-V High-Voltage Gate Driver IC With the Common-Mode Dual-Interlock Technique for GaN Devices

Wideband Capacitance Evaluation of Silicon-Insulator-Silicon Through-Silicon-Vias for 3D Integration Applications

High step-up three-level DC–DC converter with three-winding coupled-inductor

Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner

Research on Torque Characteristics of Vehicle Motor under Multisource Excitation

Dynamic Trajectory Planning of Autonomous Lane Change at Medium and Low Speeds Based on Elastic Soft Constraint of the Safety Domain

Impact of polyimide liner on high-aspect-ratio through-silicon-vias (TSVs): electrical characteristics and copper protrusion

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