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Subcooled Pool Boiling Experiments on Horizontal Heaters Coated With Carbon Nanotubes

Journal of heat transfer, 2009-07, Vol.131 (7), p.10-10

2009

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Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-09, Vol.1 (9), p.1336-1344

2011

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Progress on the Design and Fabrication of the MICE Focusing Magnets

IEEE transactions on applied superconductivity, 2010-06, Vol.20 (3), p.308-311

2010

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The Physical Connection and Magnetic Coupling of the MICE Cooling Channel Magnets and the Magnet Forces for Various MICE Operating Modes

IEEE transactions on applied superconductivity, 2007-06, Vol.17 (2), p.1225-1228

2007

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Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.299-309

2011

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Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.279-290

2011

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A piezoelectric micro-actuator with extended base-plate for HDD

Microsystem technologies, 2005-08, Vol.11 (8-10), p.598-605

2005

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Numerical simulation of slider air bearings based on a mesh-free method for HDD applications

Microsystem technologies, 2005-08, Vol.11 (8-10), p.797-804

2005

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Structure for an LHC 90 mm Nb3Sn quadrupole magnet

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.1444-1447

2005

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The mechanical and thermal design for the MICE coupling solenoid magnet

IEEE transactions on applied superconductivity, 2005-06, Vol.15 (2), p.1279-1282

2005

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Race-free clocking of CMOS pipelines using a single global clock

IEEE journal of solid-state circuits, 1990-06, Vol.25 (3), p.766-769

1990

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Multichannel millimeter wave subcarrier transmission by resonant modulation of monolithic semiconductor lasers

IEEE photonics technology letters, 1995-04, Vol.7 (4), p.431-433

1995

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Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1563-1569 Vol.2

2004

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An ultra-high-speed ECL-BiCMOS technology with silicon fillet self-aligned contacts

IEEE transactions on electron devices, 1994-09, Vol.41 (9), p.1546-1555

1994

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Stable picosecond pulse generation at 46GHz by modelocking of a semiconductor laser operating in an optoelectronic phaselocked loop

Electronics letters, 1994-01, Vol.30 (1), p.69-71

1994

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Submicrometer thin gate oxide P-channel transistors with P+polysilicon gates for VLSI applications

IEEE electron device letters, 1986-01, Vol.7 (1), p.49-52, Article 49

1986

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Demonstration of Direct Coupled Optical/Electrical Circuit Board

IEEE transactions on advanced packaging, 2009-05, Vol.32 (2), p.509-516

2009

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Subcooled Pool Boiling Experiments on Horizontal Heaters Coated With Carbon Nanotubes

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Progress on the Design and Fabrication of the MICE Focusing Magnets

The Physical Connection and Magnetic Coupling of the MICE Cooling Channel Magnets and the Magnet Forces for Various MICE Operating Modes

Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

A piezoelectric micro-actuator with extended base-plate for HDD

Numerical simulation of slider air bearings based on a mesh-free method for HDD applications

Structure for an LHC 90 mm Nb3Sn quadrupole magnet

The mechanical and thermal design for the MICE coupling solenoid magnet

Race-free clocking of CMOS pipelines using a single global clock

Multichannel millimeter wave subcarrier transmission by resonant modulation of monolithic semiconductor lasers

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

An ultra-high-speed ECL-BiCMOS technology with silicon fillet self-aligned contacts

Stable picosecond pulse generation at 46GHz by modelocking of a semiconductor laser operating in an optoelectronic phaselocked loop

Submicrometer thin gate oxide P-channel transistors with P+polysilicon gates for VLSI applications

Demonstration of Direct Coupled Optical/Electrical Circuit Board

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