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Sol-gel synthesis of cerium dioxide nanoparticles coated with stimuli-responsive components and the application for conversion of d-(−)-fructose into platform molecules

Journal of sol-gel science and technology, 2018-10, Vol.88 (1), p.141-162

2018

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Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled

Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17143-17153

2021

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Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

Journal of materials science. Materials in electronics, 2021-09, Vol.32 (17), p.22372-22386

2021

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Correction: Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

Journal of materials science. Materials in electronics, 2024-03, Vol.35 (9), p.666, Article 666

2024

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Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

Journal of materials science. Materials in electronics, 2024-02, Vol.35 (4), p.297, Article 297

2024

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Fabrication and characterization of nano-ZnO/CNTs/PDMS flexible pressure sensor

Journal of materials science. Materials in electronics, 2023-07, Vol.34 (21), p.1600, Article 1600

2023

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Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB

Journal of materials science. Materials in electronics, 2019-09, Vol.30 (17), p.16226-16233

2019

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Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

Journal of materials science. Materials in electronics, 2016-09, Vol.27 (9), p.9186-9190

2016

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Sol-gel synthesis of cerium dioxide nanoparticles coated with stimuli-responsive components and the application for conversion of d-(−)-fructose into platform molecules

Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled

Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

Correction: Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

Fabrication and characterization of nano-ZnO/CNTs/PDMS flexible pressure sensor

Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

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