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74‐4: Development of Flexible Full‐Color Mini‐LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology
SID International Symposium Digest of technical papers, 2022-06, Vol.53 (1), p.1005-1008
2022
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91‐2: Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology
SID International Symposium Digest of technical papers, 2024-06, Vol.55 (1), p.1278-1281
2024
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Characterization of transmission lines with through-silicon-vias and bump joints on high-resistivity Si interposers for RF three-dimensional modules
Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S3), p.6-06JC01
2016
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Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-4
2023
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Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-4
2023
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Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1309-1314
2020
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Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.197-203
2019
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Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-5
2019
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Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1567-1573
2018
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Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1031-1036
2020
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Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.28-30
2022
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Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.687-692
2021
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Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
2019 International 3D Systems Integration Conference (3DIC), 2019, p.1-3
2019
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