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Effect of interface states on sub-threshold response of III–V MOSFETs, MOS HEMTs and tunnel FETs

Solid-state electronics, 2010-12, Vol.54 (12), p.1665-1668

2010

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Real-time image fusion and adaptive exposure control for smart surveillance systems

Electronics letters, 2007-08, Vol.43 (18), p.975-976

KAO, W.-C

2007

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Biosorption of nickel, chromium and zinc by MerP-expressing recombinant Escherichia coli

Journal of hazardous materials, 2008-10, Vol.158 (1), p.100-106

2008

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Cadmium biosorption by polyvinyl alcohol immobilized recombinant Escherichia coli

Journal of hazardous materials, 2009-09, Vol.169 (1), p.651-658

2009

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Information transmission and market interactions across the Atlantic — an empirical study on the natural gas market

Energy economics, 2009, Vol.31 (1), p.152-161

2009

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Exploring multi-metal biosorption by indigenous metal-hyperresistant Enterobacter sp. J1 using experimental design methodologies

Journal of hazardous materials, 2008-05, Vol.153 (1), p.372-381

2008

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Outage and coverage considerations for microcellular mobile radio systems in a shadowed-Rician/shadowed-Nakagami environment

IEEE transactions on vehicular technology, 1999-01, Vol.48 (1), p.66-75

1999

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A novel algal toxicity testing technique for assessing the toxicity of both metallic and organic toxicants

Water research (Oxford), 2005-05, Vol.39 (9), p.1869-1877

2005

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Cross point assignment with global rerouting for general-architecture designs

IEEE transactions on computer-aided design of integrated circuits and systems, 1995-03, Vol.14 (3), p.337-348

1995

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Decomposition Methods for Linear Support Vector Machines

Neural computation, 2004-08, Vol.16 (8), p.1689-1704

2004

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Transition of tensile deformation behaviors in ultrafine-grained aluminum

Acta materialia, 2005-09, Vol.53 (15), p.4019-4028

2005

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Cyclic deformation of ultrafine-grained aluminum

Acta materialia, 2007, Vol.55 (2), p.715-725

2007

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Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Journal of alloys and compounds, 2009-06, Vol.478 (1), p.121-127

2009

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Arsenic removal from real arsenic-bearing groundwater by adsorption on iron-oxide-coated natural rock (IOCNR)

Desalination, 2011-10, Vol.280 (1), p.72-79

2011

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Particle-reinforced aluminum matrix composites produced from powder mixtures via friction stir processing

Composites science and technology, 2011-03, Vol.71 (5), p.693-698

2011

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Effects of Ti addition to Sn–Ag and Sn–Cu solders

Journal of alloys and compounds, 2012-04, Vol.520, p.244-249

2012

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The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Journal of alloys and compounds, 2010-03, Vol.492 (1), p.99-104

2010

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Enhanced anaerobic biodegradation of OCDD-contaminated soils by Pseudomonas mendocina NSYSU: Microcosm, pilot-scale, and gene studies

Journal of hazardous materials, 2014-08, Vol.278, p.433-443

2014

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Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

Journal of alloys and compounds, 2014-08, Vol.605, p.193-198

2014

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Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Journal of alloys and compounds, 2009-06, Vol.478 (1-2), p.L1-L4

2009

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Ultrafine-grained Al-Al2cu composite produced in situ by friction stir processing

Scripta materialia, 2005-08, Vol.53 (3), p.341-345

2005

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Evolution of microstructure during annealing of a severely deformed aluminum

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2004-02, Vol.366 (2), p.310-317

2004

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The effect of strain path and temperature on the microstructure developed in copper processed by ECAE

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2004-02, Vol.366 (2), p.221-228

2004

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Mechanical properties of submicron-grained aluminum

Scripta materialia, 2005-03, Vol.52 (5), p.359-363

2005

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Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

Acta materialia, 2012-03, Vol.60 (5), p.2082-2090

2012

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Effect of interface states on sub-threshold response of III–V MOSFETs, MOS HEMTs and tunnel FETs

Real-time image fusion and adaptive exposure control for smart surveillance systems

Biosorption of nickel, chromium and zinc by MerP-expressing recombinant Escherichia coli

Cadmium biosorption by polyvinyl alcohol immobilized recombinant Escherichia coli

Information transmission and market interactions across the Atlantic — an empirical study on the natural gas market

Exploring multi-metal biosorption by indigenous metal-hyperresistant Enterobacter sp. J1 using experimental design methodologies

Outage and coverage considerations for microcellular mobile radio systems in a shadowed-Rician/shadowed-Nakagami environment

A novel algal toxicity testing technique for assessing the toxicity of both metallic and organic toxicants

Cross point assignment with global rerouting for general-architecture designs

Decomposition Methods for Linear Support Vector Machines

Transition of tensile deformation behaviors in ultrafine-grained aluminum

Cyclic deformation of ultrafine-grained aluminum

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

Arsenic removal from real arsenic-bearing groundwater by adsorption on iron-oxide-coated natural rock (IOCNR)

Particle-reinforced aluminum matrix composites produced from powder mixtures via friction stir processing

Effects of Ti addition to Sn–Ag and Sn–Cu solders

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Enhanced anaerobic biodegradation of OCDD-contaminated soils by Pseudomonas mendocina NSYSU: Microcosm, pilot-scale, and gene studies

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

Minimum effective Ni addition to SnAgCu solders for retarding Cu3Sn growth

Ultrafine-grained Al-Al2cu composite produced in situ by friction stir processing

Evolution of microstructure during annealing of a severely deformed aluminum

The effect of strain path and temperature on the microstructure developed in copper processed by ECAE

Mechanical properties of submicron-grained aluminum

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

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