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Electric Field Impact on Lateral Charge Diffusivity in Charge Trapping 3D NAND Flash Memory

2022 IEEE International Reliability Physics Symposium (IRPS), 2022, p.P29-1-P29-5

2022

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3D-MAPS: 3D Massively parallel processor with stacked memory

2012 IEEE International Solid-State Circuits Conference, 2012, p.188-190

2012

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CMOS Platform TEG for Development of High Performance Synaptic Devices

2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS), 2022, p.1-4

2022

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On-Chip Nano Pulse Test Element Group for Analysis of Synaptic Devices

2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS), 2022, p.1-3

2022

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Parallel Processing Simulator for Separate Sensor of WSN Simulator with GPU

2015 IEEE 29th International Conference on Advanced Information Networking and Applications, 2015, p.255-262

2015

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Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory

2022 IEEE International Reliability Physics Symposium (IRPS), 2022, p.P40-1-P40-4

2022

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6.10 A 1/1.56-inch 50Mpixel CMOS Image Sensor with 0.5μm pitch Quad Photodiode Separated by Front Deep Trench Isolation

2024 IEEE International Solid-State Circuits Conference (ISSCC), 2024, Vol.67, p.118-120

2024

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A Study of insulation design on extra high voltage spacer of Eco-friendly material with built in E-CVT

2022 6th International Conference on Electric Power Equipment - Switching Technology (ICEPE-ST), 2022, p.249-252

2022

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Band offset FinFET-based URAM (Unified-RAM) built on SiC for multi-functioning NVM and capacitorless 1T-DRAM

2008 Symposium on VLSI Technology, 2008, p.200-201

2008

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Design and development of bio-mimetic soft robotic hand with shape memory alloy

2015 IEEE International Conference on Robotics and Biomimetics (ROBIO), 2015, p.2330-2334

2015

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2-Dimensional Controlled Large Lateral Grain Growth on the Floating Amorphous Silicon Film by Excimer Laser Recrystallization

MRS proceedings, 2003, Vol.762, Article A17.9

2003

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Multistage fusion and dissimilarity regularization for deep learning

2017 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI), 2017, p.586-591

2017

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A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems

2020 IEEE Symposium on VLSI Circuits, 2020, p.1-2

2020

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Improved Location Acquisition Algorithms for the Location-Based Alert Service

Advances in Information Security and Assurance, p.461-470

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Energy-efficient two-dimensional skyline query processing in wireless sensor networks

2013 IEEE 10th Consumer Communications and Networking Conference (CCNC), 2013, p.294-301

2013

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Development of impact-based piezoelectric road energy harvester for practical application

2016 IEEE International Conference on Renewable Energy Research and Applications (ICRERA), 2016, p.375-378

2016

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A survey of communication network paradigms for substation automation

2008 IEEE International Symposium on Power Line Communications and Its Applications, 2008, p.310-315

2008

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A Communication Architecture for Inter-substation Communication

2008 IEEE 8th International Conference on Computer and Information Technology Workshops, 2008, p.577-582

2008

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Energy band engineered unified-RAM (URAM) for multi-functioning 1T-DRAM and NVM

2008 IEEE International Electron Devices Meeting, 2008, p.1-4

2008

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Excimer laser recrystallization of selectively floating a-Si thin film

Journal of non-crystalline solids, 2002, Vol.299302, p.721-725

2002

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Auto defect repair algorithm for LCD panel review & repair machine

2008 SICE Annual Conference, 2008, p.2200-2203

2008

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1/spl times/4 thermo-optic switch based on the 4-branch waveguide

Technical Digest. CLEO/Pacific Rim '99. Pacific Rim Conference on Lasers and Electro-Optics (Cat. No.99TH8464), 1999, Vol.2, p.262-263 vol.2

1999

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Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations

IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest, 2005, p.315-318

2005

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Cost-effective "BARC/resist-via-fill free" integration technology for 0.13 /spl mu/m Cu/low-k

Digest. International Electron Devices Meeting, 2002, p.591-594

2002

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Alleviating electromigration through re-engineering the interface between Cu & dielectric-diffusion-barrier in 90 nm Cu/SiOC (k=2.9) device

IEEE International Electron Devices Meeting 2003, 2003, p.21.7.1-21.7.4

2003

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Electric Field Impact on Lateral Charge Diffusivity in Charge Trapping 3D NAND Flash Memory

3D-MAPS: 3D Massively parallel processor with stacked memory

CMOS Platform TEG for Development of High Performance Synaptic Devices

On-Chip Nano Pulse Test Element Group for Analysis of Synaptic Devices

Parallel Processing Simulator for Separate Sensor of WSN Simulator with GPU

Novel Electrical Detection Method for Random Defects on Peripheral Circuits in NAND Flash Memory

6.10 A 1/1.56-inch 50Mpixel CMOS Image Sensor with 0.5μm pitch Quad Photodiode Separated by Front Deep Trench Isolation

A Study of insulation design on extra high voltage spacer of Eco-friendly material with built in E-CVT

Band offset FinFET-based URAM (Unified-RAM) built on SiC for multi-functioning NVM and capacitorless 1T-DRAM

Design and development of bio-mimetic soft robotic hand with shape memory alloy

2-Dimensional Controlled Large Lateral Grain Growth on the Floating Amorphous Silicon Film by Excimer Laser Recrystallization

Multistage fusion and dissimilarity regularization for deep learning

A 1.8 Gb/s/pin 16Tb NAND Flash Memory Multi-Chip Package with F-Chip of Toggle 4.0 Specification for High Performance and High Capacity Storage Systems

Improved Location Acquisition Algorithms for the Location-Based Alert Service

Energy-efficient two-dimensional skyline query processing in wireless sensor networks

Development of impact-based piezoelectric road energy harvester for practical application

A survey of communication network paradigms for substation automation

A Communication Architecture for Inter-substation Communication

Energy band engineered unified-RAM (URAM) for multi-functioning 1T-DRAM and NVM

Excimer laser recrystallization of selectively floating a-Si thin film

Auto defect repair algorithm for LCD panel review & repair machine

1/spl times/4 thermo-optic switch based on the 4-branch waveguide

Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations

Cost-effective "BARC/resist-via-fill free" integration technology for 0.13 /spl mu/m Cu/low-k

Alleviating electromigration through re-engineering the interface between Cu & dielectric-diffusion-barrier in 90 nm Cu/SiOC (k=2.9) device

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