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CPIPS: Learning to Preserve Perceptual Distances in End-to-End Image Compression

2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC), 2023, p.1705-1711

2023

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IEEE_Xplore

JQF: Optimal JPEG Quantization Table Fusion by Simulated Annealing on Texture Images and Predicting Textures

2021 Data Compression Conference (DCC), 2021, p.344-344

2021

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An enhanced treatment and evaluation system for myofascial pain syndrome

2015 7th Computer Science and Electronic Engineering Conference (CEEC), 2015, p.146-151

2015

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A programmable sanding box rehabilitation and evaluation system

The 5th 2012 Biomedical Engineering International Conference, 2012, p.1-7

2012

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IEEE_Xplore

A musical-driven video summarization system using content-aware mechanisms

2005 IEEE International Symposium on Circuits and Systems (ISCAS), 2005, p.2711-2714 Vol. 3

2005

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IEEE_Xplore

User-oriented approach in spatial and temporal domain video coding

Fourth International Conference on Information, Communications and Signal Processing, 2003 and the Fourth Pacific Rim Conference on Multimedia. Proceedings of the 2003 Joint, 2003, Vol.3, p.1341-1345 vol.3

2003

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IEEE_Xplore

Enabling monolithic 3D image sensor using large-area monolayer transition metal dichalcogenide and logic/memory hybrid 3D+IC

2016 IEEE Symposium on VLSI Technology, 2016, p.1-2

2016

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IEEE_Xplore

Advanced Inspection Methodology for the Maximum Extension of Nitride Test Wafer Recycling

2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2020, p.1-5

2020

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IEEE_Xplore

A Content Analysis of Mobile Learning on Constructivism Theory

Advances in Intelligent Information Hiding and Multimedia Signal Processing, p.62-67

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TSV-free FinFET-based Monolithic 3D+-IC with computing-in-memory SRAM cell for intelligent IoT devices

2017 IEEE International Electron Devices Meeting (IEDM), 2017, p.12.6.1-12.6.4

2017

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IEEE_Xplore

Monolithic 3D SRAM-CIM Macro Fabricated with BEOL Gate-All-Around MOSFETs

2019 IEEE International Electron Devices Meeting (IEDM), 2019, p.3.3.1-3.3.4

2019

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IEEE_Xplore

An Independence Mechanism Design for the Software Defined Device

Advances in Intelligent Information Hiding and Multimedia Signal Processing, p.68-73

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High performance poly Si junctionless transistors with sub-5nm conformally doped layers by molecular monolayer doping and microwave incorporating CO2 laser annealing for 3D stacked ICs applications

2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.6.2.1-6.2.4

2015

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IEEE_Xplore

Asymmetry hybrid bonding using Cu/Sn bonding with polyimide for 3D heterogeneous integration applications

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017, p.187-190

2017

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IEEE_Xplore

Ultra-Low Power 3D NC-FinFET-based Monolithic 3D+ -IC with Computing-in-Memory for Intelligent IoT Devices

2018 IEEE International Electron Devices Meeting (IEDM), 2018, p.15.1.1-15.1.4

2018

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IEEE_Xplore

Development and investigation of ultra-thin buffer layers used in symmetric Cu/Sn bonding and asymmetric Cu/Sn-Cu bonding for advanced 3D integration applications

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017, p.85-88

2017

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IEEE_Xplore

Pedestrian activity detection in a multi-floor environment by a smart phone

2012 IEEE Sensors, 2012, p.1-2

2012

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IEEE_Xplore

Sub-fM DNA sensitivity by self-aligned maskless thin-film transistor-based SoC bioelectronics

2012 Symposium on VLSI Technology (VLSIT), 2012, p.127-128

2012

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IEEE_Xplore

FinFET-based Monolithic 3D+ with RRAM Array and Computing in Memory SRAM for Intelligent IoT Chip Application

2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018, p.1-3

2018

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First Demonstration of Interface-Enhanced SAF Enabling 400°C-Robust 42 nm p-SOT-MTJ Cells with STT-Assisted Field-Free Switching and Composite Channels

2021 Symposium on VLSI Technology, 2021, p.1-2

2021

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IEEE_Xplore

Enabling low power BEOL compatible monolithic 3D+ nanoelectronics for IoTs using local and selective far-infrared ray laser anneal technology

2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.8.7.1-8.7.4

2015

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IEEE_Xplore

A CMOS SoC for 56/18/16 CD/DVD-dual/RAM applications

Annual ACM IEEE Design Automation Conference: Proceedings of the 43rd annual conference on Design automation; 24-28 July 2006, 2006, p.290-291

2006

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A CMOS SoC for 56/18/16 CD/DVD-dual/RAM applications

2006 43rd ACM/IEEE Design Automation Conference, 2006, p.290-291

2006

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IEEE_Xplore

First fully functionalized monolithic 3D+ IoT chip with 0.5 V light-electricity power management, 6.8 GHz wireless-communication VCO, and 4-layer vertical ReRAM

2016 IEEE International Electron Devices Meeting (IEDM), 2016, p.2.3.1-2.3.4

2016

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IEEE_Xplore

Towards Efficient Neural Network on Edge Devices via Statistical Weight Pruning

2020 IEEE 9th Global Conference on Consumer Electronics (GCCE), 2020, p.192-193

2020

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CPIPS: Learning to Preserve Perceptual Distances in End-to-End Image Compression

JQF: Optimal JPEG Quantization Table Fusion by Simulated Annealing on Texture Images and Predicting Textures

An enhanced treatment and evaluation system for myofascial pain syndrome

A programmable sanding box rehabilitation and evaluation system

A musical-driven video summarization system using content-aware mechanisms

User-oriented approach in spatial and temporal domain video coding

Enabling monolithic 3D image sensor using large-area monolayer transition metal dichalcogenide and logic/memory hybrid 3D+IC

Advanced Inspection Methodology for the Maximum Extension of Nitride Test Wafer Recycling

A Content Analysis of Mobile Learning on Constructivism Theory

TSV-free FinFET-based Monolithic 3D+-IC with computing-in-memory SRAM cell for intelligent IoT devices

Monolithic 3D SRAM-CIM Macro Fabricated with BEOL Gate-All-Around MOSFETs

An Independence Mechanism Design for the Software Defined Device

High performance poly Si junctionless transistors with sub-5nm conformally doped layers by molecular monolayer doping and microwave incorporating CO2 laser annealing for 3D stacked ICs applications

Asymmetry hybrid bonding using Cu/Sn bonding with polyimide for 3D heterogeneous integration applications

Ultra-Low Power 3D NC-FinFET-based Monolithic 3D+ -IC with Computing-in-Memory for Intelligent IoT Devices

Development and investigation of ultra-thin buffer layers used in symmetric Cu/Sn bonding and asymmetric Cu/Sn-Cu bonding for advanced 3D integration applications

Pedestrian activity detection in a multi-floor environment by a smart phone

Sub-fM DNA sensitivity by self-aligned maskless thin-film transistor-based SoC bioelectronics

FinFET-based Monolithic 3D+ with RRAM Array and Computing in Memory SRAM for Intelligent IoT Chip Application

First Demonstration of Interface-Enhanced SAF Enabling 400°C-Robust 42 nm p-SOT-MTJ Cells with STT-Assisted Field-Free Switching and Composite Channels

Enabling low power BEOL compatible monolithic 3D+ nanoelectronics for IoTs using local and selective far-infrared ray laser anneal technology

A CMOS SoC for 56/18/16 CD/DVD-dual/RAM applications

A CMOS SoC for 56/18/16 CD/DVD-dual/RAM applications

First fully functionalized monolithic 3D+ IoT chip with 0.5 V light-electricity power management, 6.8 GHz wireless-communication VCO, and 4-layer vertical ReRAM

Towards Efficient Neural Network on Edge Devices via Statistical Weight Pruning

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