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Process of new negative photo-dielectric polymer ALX with high reliability

2010 12th Electronics Packaging Technology Conference, 2010, p.832-834

2010

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Automated antenna detection and correction methodology in VLSI designs

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.158-161

2003

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A general concept for monitoring plasma induced charging damage

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.36-39

2003

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Plasma induced substrate damage in high dose implant resist strip process

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.73-76

2003

Volltextzugriff (PDF)

Backend dielectric etch induced wafer arcing mechanism and solution

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.178-181

2003

Volltextzugriff (PDF)

Metal contamination monitoring in ion implantation technology

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.81-84

2003

Volltextzugriff (PDF)

Impacts of HF etching on ultra-thin core gate oxide integrity in dual gate oxide CMOS technology

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.77-80

2003

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Effect of the process flow on negative-bias-temperature-instability

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.142-145

2003

Volltextzugriff (PDF)

Plasma-induced charging in two bit per cell SONOS memories

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.61-64

2003

Volltextzugriff (PDF)

Effects of plasma-induced damage to ultrathin (/spl les/1.5 nm) gate dielectric on equivalent oxide thickness downscaling using plasma nitridation process

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.130-133

2003

Volltextzugriff (PDF)

The effect of fluorine in an advanced CMOS process with triple (1.6/2.2/5.2 nm) nitrided gate oxide

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.150-153

2003

Volltextzugriff (PDF)

Critical issues in plasma etching processes involved in the gate etch fabrication of CMOS devices

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.12-15

2003

Volltextzugriff (PDF)

Interaction between ILD-process and metal-etch induced gate charging effect

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.16-19

2003

Volltextzugriff (PDF)

Process induced damages from various integrated circuit interconnection designs - limitations of antenna rule under practical integrated circuit layout practice

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.162-167

2003

Volltextzugriff (PDF)

Physical characterization of ultrathin high k dielectrics

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.40-50

2003

Volltextzugriff (PDF)

Effects of gate notching profile defect on characteristic of cell NMOSFET in low-power SRAM device

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.146-149

2003

Volltextzugriff (PDF)

Process induced damage: what challenges lie ahead?

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.51-55

Dao, T.

2003

Volltextzugriff (PDF)

Charging damage during contact etch triggered by increased borderless nitride conductivity

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.20-23

2003

Volltextzugriff (PDF)

Plasma damage reduction by using ISSG gate oxides

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.65-68

2003

Volltextzugriff (PDF)

Metal gate and high-k integration for advanced CMOS devices

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.56-60

2003

Volltextzugriff (PDF)

Comprehending scaling effects on plasma damage

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.28-31

2003

Volltextzugriff (PDF)

Recent trends in 300-mm plasma equipment

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.168-173

Vinogradov, G.Y.

2003

Volltextzugriff (PDF)

Investigation of electron-shading effects during high-current ion implants

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.182-185

2003

Volltextzugriff (PDF)

Reduction of plasma-radiation-induced interface states for plasma processes of charge-coupled-device image sensors using pulse-time-modulated plasma

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.154-157

2003

Volltextzugriff (PDF)

Direct measurement of gate oxide damage from plasma nitridation process

2003 8th International Symposium Plasma- and Process-Induced Damage, 2003, p.126-129

2003

Volltextzugriff (PDF)

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Process of new negative photo-dielectric polymer ALX with high reliability

Automated antenna detection and correction methodology in VLSI designs

A general concept for monitoring plasma induced charging damage

Plasma induced substrate damage in high dose implant resist strip process

Backend dielectric etch induced wafer arcing mechanism and solution

Metal contamination monitoring in ion implantation technology

Impacts of HF etching on ultra-thin core gate oxide integrity in dual gate oxide CMOS technology

Effect of the process flow on negative-bias-temperature-instability

Plasma-induced charging in two bit per cell SONOS memories

Effects of plasma-induced damage to ultrathin (/spl les/1.5 nm) gate dielectric on equivalent oxide thickness downscaling using plasma nitridation process

The effect of fluorine in an advanced CMOS process with triple (1.6/2.2/5.2 nm) nitrided gate oxide

Critical issues in plasma etching processes involved in the gate etch fabrication of CMOS devices

Interaction between ILD-process and metal-etch induced gate charging effect

Process induced damages from various integrated circuit interconnection designs - limitations of antenna rule under practical integrated circuit layout practice

Physical characterization of ultrathin high k dielectrics

Effects of gate notching profile defect on characteristic of cell NMOSFET in low-power SRAM device

Process induced damage: what challenges lie ahead?

Charging damage during contact etch triggered by increased borderless nitride conductivity

Plasma damage reduction by using ISSG gate oxides

Metal gate and high-k integration for advanced CMOS devices

Comprehending scaling effects on plasma damage

Recent trends in 300-mm plasma equipment

Investigation of electron-shading effects during high-current ion implants

Reduction of plasma-radiation-induced interface states for plasma processes of charge-coupled-device image sensors using pulse-time-modulated plasma

Direct measurement of gate oxide damage from plasma nitridation process

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