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2022 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV), 2022, p.1322-1331
2022
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IEEE transactions on magnetics, 2014, Vol.50 (4)
2014
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IEEE transactions on magnetics, 2014, Vol.50 (1)
2014
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IEEE transactions on magnetics, 2014, Vol.50 (6)
2014
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IEEE transactions on magnetics, 2014, Vol.50 (1)
2014
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IEEE transactions on magnetics, 2012, Vol.48 (11), p.3753-3756
2012
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IEEE transactions on magnetics, 2012, Vol.48 (11), p.4018-4021
2012
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IEEE transactions on magnetics, 2012, Vol.48 (4), p.1293-1296
2012
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IEEE transactions on magnetics, 2011, Vol.47 (10), p.2693-2696
2011
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IEEE transactions on magnetics, 2012, Vol.48 (4), p.1381-1384
2012
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2012 IEEE 18th Real Time and Embedded Technology and Applications Symposium, 2012, p.13-22
2012
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2013 IEEE 19th Real-Time and Embedded Technology and Applications Symposium (RTAS), 2013, p.217-226
2013
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2013 IEEE 29th International Conference on Data Engineering Workshops (ICDEW), 2013, p.272-278
2013
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2011 17th IEEE Real-Time and Embedded Technology and Applications Symposium, 2011, p.81-90
2011
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2013 IEEE 19th Real-Time and Embedded Technology and Applications Symposium (RTAS), 2013, p.237-246
2013
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2011 IEEE 17th International Conference on Embedded and Real-Time Computing Systems and Applications, 2011, Vol.2, p.67-73
2011
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2011 IEEE 17th International Conference on Embedded and Real-Time Computing Systems and Applications, 2011, Vol.1, p.319-328
2011
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2011 Proceedings of the 14th International Conference on Compilers, Architectures and Synthesis for Embedded Systems (CASES), 2011, p.237-238
2011
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Proceedings of 1995 IEEE International Conference on Robotics and Automation, 1995, Vol.2, p.1259-1264 vol.2
1995
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2007 IEEE International Electron Devices Meeting, 2007, p.411-414
2007
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TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, 2007, p.1479-1482
2007
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2008 IEEE 21st International Conference on Micro Electro Mechanical Systems, 2008, p.1024-1027
2008
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2008 IEEE 21st International Conference on Micro Electro Mechanical Systems, 2008, p.1028-1031
2008
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Wafer level encapsulation technology for MEMS devices using an HF-permeable PECVD SIOC capping layer
2008
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2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, 2007, p.1366-1369
2007
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