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Analysis of the transient radiation damage effects on electronics using irradiation experiment and model simulation

2013 IEEE Nuclear Science Symposium and Medical Imaging Conference (2013 NSS/MIC), 2013, p.1-3

2013

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Effect of mechanical strength and residual stress of dielectric capping layer on electromigration performance in Cu/low-k interconnects

IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, p.957-960

2004

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50nm gate length logic technology with 9-layer Cu interconnects for 90nm node SoC applications

Digest. International Electron Devices Meeting, 2002, p.69-72

2002

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Manufacturable embedded CMOS 6T-SRAM technology with high-k gate dielectric device for system-on-chip applications

Digest. International Electron Devices Meeting, 2002, p.423-426

2002

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The interface formation and adhesion of metals (Cu, Ta, and Ti) and low dielectric constant polymer-like organic thin films deposited by plasma-enhanced chemical vapor deposition using para-xylene precursor

Thin solid films, 2000, Vol.377-78, p.122-128

2000

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Microwave surface impedance and nonlinear properties of MgB2films

IEEE transactions on applied superconductivity, 2003, Vol.13 (2), p.3590-3593

2003

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Advanced Cu/low-k (k = 2.2) multilevel interconnect for 0.10/0.07μm generation

2002

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Large scale integration and reliability consideration of triple gate transistors

IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, p.647-650

2004

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Flux technology for lead-free alloys and its impact on cleaning

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.1484-1490

2002

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HCI and BTI characteristics of ALD HfSiO(N) gate dielectrics as the compositions and the post treatment conditions

IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, p.125-128

2004

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Practical next generation solution for stand-alone and embedded DRAM capacitor

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303), 2002, p.114-115

2002

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Highly controllable cyclic selective epitaxial growth (CySEG) for 65nm CMOS technology and beyond

IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, p.1051-1054

2004

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Improved current performance of CMOSFETs with nitrogen incorporated HfO2-Al2O3 laminate gate dielectric

Digest. International Electron Devices Meeting, 2002, p.853-856

2002

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Poly-Si gate CMOSFETs with HfO2-Al2O3 laminate gate dielectric for low power applications

2002

Volltextzugriff (PDF)

A new double-layered structure for mass-production-worthy CMOSFETs with poly-SiGe gate

2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303), 2002, p.126-127

2002

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A new simple method of fabricating micro/nano-scale polymer optical wire on a copper plate

Microelectronic engineering, 2010, Vol.87 (5-8), p.1328-1330

2010

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Enhanced charge generation of the ZnO nanowires/PZT hetero-junction based nanogenerator : Nanofabrication 2012

Microelectronic engineering, 2013, Vol.110, p.282-287

2013

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Microchamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing : Nanofabrication 2012

Microelectronic engineering, 2013, Vol.110, p.340-345

2013

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Carrier transport mechanism in La-incorporated high-κ dielectric/metal gate stack MOSFETs

Microelectronic engineering, 2011, Vol.88 (12), p.3399-3403

2011

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Influence of plasma edge damage on erase characteristics of NOR flash EEPROM using channel erase method

2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320), 2002, p.354-358

2002

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Structure and kinetics of Sn whisker growth on Pb-free solder finish

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.628-633

2002

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Design and implementation of the POWER5 microprocessor

First edition, 2004

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Status and outlook of emerging nonvolatile memory technologies

IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004, 2004, p.567-570

2004

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Analysis of the transient radiation damage effects on electronics using irradiation experiment and model simulation

Effect of mechanical strength and residual stress of dielectric capping layer on electromigration performance in Cu/low-k interconnects

Characteristics of ALD HfSiOx using new Si precursors for gate dielectric applications

50nm gate length logic technology with 9-layer Cu interconnects for 90nm node SoC applications

Manufacturable embedded CMOS 6T-SRAM technology with high-k gate dielectric device for system-on-chip applications

Mass production worthy HfO2-Al2O3 laminate capacitor technology using Hf liquid precursor for sub-100nm DRAMs

The interface formation and adhesion of metals (Cu, Ta, and Ti) and low dielectric constant polymer-like organic thin films deposited by plasma-enhanced chemical vapor deposition using para-xylene precursor

Microwave surface impedance and nonlinear properties of MgB2films

Advanced Cu/low-k (k = 2.2) multilevel interconnect for 0.10/0.07μm generation

Large scale integration and reliability consideration of triple gate transistors

Flux technology for lead-free alloys and its impact on cleaning

HCI and BTI characteristics of ALD HfSiO(N) gate dielectrics as the compositions and the post treatment conditions

Practical next generation solution for stand-alone and embedded DRAM capacitor

Highly controllable cyclic selective epitaxial growth (CySEG) for 65nm CMOS technology and beyond

Improved current performance of CMOSFETs with nitrogen incorporated HfO2-Al2O3 laminate gate dielectric

Poly-Si gate CMOSFETs with HfO2-Al2O3 laminate gate dielectric for low power applications

A new double-layered structure for mass-production-worthy CMOSFETs with poly-SiGe gate

A new simple method of fabricating micro/nano-scale polymer optical wire on a copper plate

Enhanced charge generation of the ZnO nanowires/PZT hetero-junction based nanogenerator : Nanofabrication 2012

Microchamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing : Nanofabrication 2012

Carrier transport mechanism in La-incorporated high-κ dielectric/metal gate stack MOSFETs

Influence of plasma edge damage on erase characteristics of NOR flash EEPROM using channel erase method

Structure and kinetics of Sn whisker growth on Pb-free solder finish

Design and implementation of the POWER5 microprocessor

Status and outlook of emerging nonvolatile memory technologies

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