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Optical Polymer Waveguides: From the Design to the Final 3D-Opto Mechatronic Integrated Device

1, 2022

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Determination of Melting and Solidification Temperatures of Sn-Ag-Cu Solder Spheres by Infrared Thermography

Thermochimica acta, 2022-08, Vol.714, p.179245, Article 179245

2022

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Nanosensor-Based Real-Time Monitoring of Stress Biomarkers in Human Saliva Using a Portable Measurement System

ACS sensors, 2020-12, Vol.5 (12), p.4081-4091

2020

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Asymmetric Optical Bus Coupler for Interruption-Free Short-Range Connections on Board and Module Level

Journal of lightwave technology, 2017-09, Vol.35 (18), p.4033-4039

2017

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Does El Niño intensity matter for California precipitation?

Geophysical research letters, 2016-01, Vol.43 (2), p.819-825

2016

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Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-01, Vol.10 (1), p.18-29

2020

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MONITORING AND UNDERSTANDING TRENDS IN EXTREME STORMS: State of Knowledge

Bulletin of the American Meteorological Society, 2013-04, Vol.94 (4), p.499-514

2013

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Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems

Microelectronics and reliability, 2018-05, Vol.84, p.121-126

2018

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Approach for the production chain of printed polymer optical waveguides–an overview

Applied optics (2004), 2017-11, Vol.56 (31), p.8607

2017

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Biocompatibility study of three distinct carbon pastes for application as electrode material in neural stimulations and recordings

Journal of materials science. Materials in medicine, 2017-02, Vol.28 (2), p.30-30, Article 30

2017

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Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking

Microelectronics and reliability, 2019-11, Vol.102, p.113296, Article 113296

2019

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Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Microelectronic engineering, 2014-04, Vol.117, p.26-34

2014

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Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging

1. Aufl., 2012

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Simulation-based optimization vs. mathematical programming: A hybrid approach for optimizing scheduling problems

Robotics and computer-integrated manufacturing, 2009-12, Vol.25 (6), p.917-925

2009

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Multi-method attribution analysis of extreme precipitation in Boulder, Colorado

Environmental research letters, 2016-12, Vol.11 (12), p.124009

2016

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Anthropogenic Contributions to the Intensity of the 2017 United States Northern Great Plains Drought

Bulletin of the American Meteorological Society, 2019-01, Vol.100 (1), p.S19-S24

2019

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Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Journal of materials research, 2011-08, Vol.26 (16), p.2103-2116

2011

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Carbon Nanotube Composites for Electronic Packaging Applications : A Review

Journal of nanotechnology, 2013-01, Vol.2013 (2013), p.1-6

2013

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Mechanical Characterization of Thin Films by Use of Atomic Force Acoustic Microscopy

Advanced engineering materials, 2011-04, Vol.13 (4), p.312-318

2011

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El Niño/Southern Oscillation behaviour since 1871 as diagnosed in an extended multivariate ENSO index (MEI.ext)

International journal of climatology, 2011-06, Vol.31 (7), p.1074-1087

2011

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Measuring the strength of ENSO events: How does 1997/98 rank?

Weather, 1998-09, Vol.53 (9), p.315-324

1998

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Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers

Journal of microelectronics and electronic packaging, 2017-01, Vol.14 (1), p.1-10

2017

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How Unusual was the Cold Winter of 2013/14 in the Upper Midwest?

Bulletin of the American Meteorological Society, 2015-12, Vol.96 (12), p.S10-S14

2015

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Was the 2003 European summer heat wave unusual in a global context?

Geophysical research letters, 2006-12, Vol.33 (23), p.L23709-n/a

2006

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Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

Circuit world, 2009-05, Vol.35 (2), p.37-44

2009

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Optical Polymer Waveguides: From the Design to the Final 3D-Opto Mechatronic Integrated Device

Determination of Melting and Solidification Temperatures of Sn-Ag-Cu Solder Spheres by Infrared Thermography

Nanosensor-Based Real-Time Monitoring of Stress Biomarkers in Human Saliva Using a Portable Measurement System

Asymmetric Optical Bus Coupler for Interruption-Free Short-Range Connections on Board and Module Level

Does El Niño intensity matter for California precipitation?

Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls

MONITORING AND UNDERSTANDING TRENDS IN EXTREME STORMS: State of Knowledge

Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems

Approach for the production chain of printed polymer optical waveguides–an overview

Biocompatibility study of three distinct carbon pastes for application as electrode material in neural stimulations and recordings

Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging

Simulation-based optimization vs. mathematical programming: A hybrid approach for optimizing scheduling problems

Multi-method attribution analysis of extreme precipitation in Boulder, Colorado

Anthropogenic Contributions to the Intensity of the 2017 United States Northern Great Plains Drought

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Carbon Nanotube Composites for Electronic Packaging Applications : A Review

Mechanical Characterization of Thin Films by Use of Atomic Force Acoustic Microscopy

El Niño/Southern Oscillation behaviour since 1871 as diagnosed in an extended multivariate ENSO index (MEI.ext)

Measuring the strength of ENSO events: How does 1997/98 rank?

Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers

How Unusual was the Cold Winter of 2013/14 in the Upper Midwest?

Was the 2003 European summer heat wave unusual in a global context?

Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

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