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Assembly of an aperture plate system for projection mask-less lithography

Microelectronic engineering, 2006-04, Vol.83 (4), p.980-983

2006

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Mechanical characterization of membrane like microelectronic components

Microelectronic engineering, 2006-04, Vol.83 (4), p.1036-1042

2006

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Finite element simulation of ion-beam lithography mask fabrication

Microelectronic engineering, 1999, Vol.46 (1), p.485-488

1999

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Stress relief structures for ion-beam projection lithography masks

Microelectronic engineering, 1999, Vol.46 (1), p.481-484

1999

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A new penalty function element for thin shell analysis

International journal for numerical methods in engineering, 1982-06, Vol.18 (6), p.845-861

Haugeneder, E.

1982

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High-speed data storage and processing for projection mask-less lithography systems

Microelectronic engineering, 2006-04, Vol.83 (4), p.976-979

2006

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Strain inhomogeneity mapping in single-crystal layers and membranes by X-ray diffractometry

Journal of applied crystallography, 2002-02, Vol.35 (1), p.17-20

2002

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A preprocessor for the finite element program SAP IV

International journal for numerical methods in engineering, 1981-12, Vol.17 (12), p.1779-1789

1981

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Influence of Silicon on Insulator Wafer Stress Properties on Placement Accuracy of Stencil Masks

Japanese Journal of Applied Physics, 2002, Vol.41 (Part 1, No. 6B), p.4146-4149, Article 4146

2002

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Thermal emissivity of carbon coated p-doped silicon stencil masks for ion projection lithography

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2003-01, Vol.21 (1), p.123-126

2003

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On an Improper Modification of a Variational Principle for Finite Element Plate Analysis

Zeitschrift für angewandte Mathematik und Mechanik, 1979, Vol.59 (11), p.637-640

1979

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Influence of SOI wafer stress properties on placement accuracy of stencil masks

Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468), 2001, p.44

2001

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Optimization of the temperature distribution across stencil mask membranes under ion beam exposure

Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 1998-11, Vol.16 (6), p.3602-3605

1998

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Experimental evaluation of an optimized radiation cooling geometry for ion projection lithography masks

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2000-11, Vol.18 (6), p.3207-3209

2000

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Comparison of silicon stencil mask distortion measurements with finite element analysis

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1999-11, Vol.17 (6), p.3107-3111

1999

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Directly sputtered stress-compensated carbon protective layer for silicon stencil masks

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1999-11, Vol.17 (6), p.3127-3131

1999

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p-n junction-based wafer flow process for stencil mask fabrication

Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 1998-11, Vol.16 (6), p.3592-3598

1998

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Admissible and Inadmissible Simplifications of Variational Methods in Finite Element Analysis

Variational Methods in the Mechanics of Solids, 1980, p.187-198

1980

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The High-resolution Intermediate Complexity Atmospheric Research (HICAR v1.1) model enables fast dynamic downscaling to the hectometer scale

Geoscientific Model Development, 2023-09, Vol.16 (17), p.5049-5068

2023

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Exciton diffusion and dissociation in conjugated polymer/fullerene blends and heterostructures

Physical review. B, Condensed matter, 1999-06, Vol.59 (23), p.15346-15351

1999

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Control of electron transfer in conjugated polymer/fullerene heterostructures

Synthetic metals, 1999-05, Vol.101 (1-3), p.285-286

1999

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Assembly of an aperture plate system for projection mask-less lithography

Mechanical characterization of membrane like microelectronic components

Finite element simulation of ion-beam lithography mask fabrication

Stress relief structures for ion-beam projection lithography masks

A new penalty function element for thin shell analysis

High-speed data storage and processing for projection mask-less lithography systems

Strain inhomogeneity mapping in single-crystal layers and membranes by X-ray diffractometry

A preprocessor for the finite element program SAP IV

Influence of Silicon on Insulator Wafer Stress Properties on Placement Accuracy of Stencil Masks

Thermal emissivity of carbon coated p-doped silicon stencil masks for ion projection lithography

On an Improper Modification of a Variational Principle for Finite Element Plate Analysis

Influence of SOI wafer stress properties on placement accuracy of stencil masks

Optimization of the temperature distribution across stencil mask membranes under ion beam exposure

Experimental evaluation of an optimized radiation cooling geometry for ion projection lithography masks

Comparison of silicon stencil mask distortion measurements with finite element analysis

Directly sputtered stress-compensated carbon protective layer for silicon stencil masks

p-n junction-based wafer flow process for stencil mask fabrication

Admissible and Inadmissible Simplifications of Variational Methods in Finite Element Analysis

The High-resolution Intermediate Complexity Atmospheric Research (HICAR v1.1) model enables fast dynamic downscaling to the hectometer scale

Exciton diffusion and dissociation in conjugated polymer/fullerene blends and heterostructures

Control of electron transfer in conjugated polymer/fullerene heterostructures

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