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The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy

Journal of adhesion science and technology, 2016-08, Vol.30 (15), p.1662-1670

2016

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Reliability issues of lead-free solder joints in electronic devices

Science and technology of advanced materials, 2019-12, Vol.20 (1), p.876-901

2019

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Using carbon nanotubes to enhance creep performance of lead free solder

Materials science and technology, 2008-04, Vol.24 (4), p.443-448

2008

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Interfacial reactions of Sn-Zn-Ag-Cu alloy on soldered Al/Cu and Al/Al joints

Science and technology of welding and joining, 2018-10, Vol.23 (7), p.558-567

2018

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Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

Materials science and technology, 2023-06, Vol.39 (9), p.1090-1099

2023

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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

Science and technology of advanced materials, 2015-06, Vol.16 (3), p.033505-33522

2015

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Characterisation of Sn-3.5Ag solder/Cu joint under various reflow conditions

Materials science and technology, 2022-05, Vol.38 (8), p.458-468

2022

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Effect of Ni on the microstructure and properties of Sn-6.5Zn-3.0Bi solders

Philosophical magazine (Abingdon, England), 2022-12, Vol.102 (24), p.2539-2553

2022

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The microstructure, melting properties and wettability of Sn-3.5Ag-0.7Cu-xIn lead-free solder alloys

Philosophical magazine (Abingdon, England), 2022-02, Vol.102 (4), p.321-339

2022

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Interrelation of wettability-microstructure-tensile strength of lead-free Sn-Ag and Sn-Bi solder alloys

Science and technology of welding and joining, 2016-08, Vol.21 (6), p.429-437

2016

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Effect of alloying elements on microstructural and electrical property in Sn-Cu-Bi lead-free solder alloys

Welding international, 2024-03, Vol.38 (3), p.211-224

2024

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Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

Materials science and technology, 2013-04, Vol.29 (4), p.464-473

2013

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Influence of bismuth (Bi) addition on the structure and properties of annealed Sn-9Zn eutectic binary solder alloy

Advances in materials and processing technologies (Abingdon, England), 2022-01, Vol.8 (1), p.977-988

2022

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Estimation of the viscosities of melt for Sn-based ternary lead-free solder alloys

Philosophical magazine (Abingdon, England), 2019-10, Vol.99 (20), p.2531-2544

2019

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Interrelationship between Interphase Boundaries and Phase Contents near the Critical Compositions of Lead-Free Ferroelectric (Na^sub 0.5^Bi^sub 0.5^)TiO^sub 3^-BaTiO^sub 3

Ferroelectrics, 2015-01, Vol.482 (1), p.22

2015

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Structural, Electrical and Magnetic Properties of (1-x)Bi^sub 0.9^La^sub 0.1^FeO^sub 3^-xBa^sub 0.85^Ca^sub 0.15^Zr^sub 0.1^Ti^sub 0.9^O^sub 3^ Ceramics

Ferroelectrics, 2015-01, Vol.489 (1), p.96

2015

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Microstructure development during directional solidification of Sn-Ag-Cu ternary alloys

International journal of cast metals research (Online), 2018-03, Vol.31 (2), p.118-124

2018

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Computation of infinite dilute activity coefficients for Ga-X (X= In, Tl) and thermodynamic activities of all components in liquid Ga-In-Tl alloys

Physics and chemistry of liquids, 2022-05, Vol.60 (3), p.427-435

2022

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Solder joint reliability of Sn-0·7Cu and Sn-0·3Ag-0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Materials science and technology, 2013-12, Vol.29 (12), p.1430-1440

2013

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Reliability of Pb-free solders for harsh environment electronic assemblies

Materials Science and Technology, 2012-03, Vol.28 (3), p.257-273

Desmarest, S Godard

2012

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Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates

Materials science and technology, 2011-07, Vol.27 (7), p.1157-1162

2011

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Effect of La Substitution on Structural, Electrical and Magnetic Properties in BF-BCZT Ceramics

Ferroelectrics, 2015-11, Vol.489 (1), p.88-95

2015

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Evaluation of Elastic Constants in Piezoelectric Ceramics by Measuring Acoustic Wave Velocities

Ferroelectrics, 2015-08, Vol.484 (1), p.14-24

2015

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Interfacial reaction of Bi-Ag and Bi-Sb solders on copper substrate with multiple reflow number

Materials research innovations, 2014-12, Vol.18 (sup6), p.S6-318-S6-321

2014

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Properties of new gold based multicomponent alloys as innovative lead-free solder material

Materials research innovations, 2015-02, Vol.19 (2), p.145-149

2015

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The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy

Reliability issues of lead-free solder joints in electronic devices

Using carbon nanotubes to enhance creep performance of lead free solder

Interfacial reactions of Sn-Zn-Ag-Cu alloy on soldered Al/Cu and Al/Al joints

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions

Characterisation of Sn-3.5Ag solder/Cu joint under various reflow conditions

Effect of Ni on the microstructure and properties of Sn-6.5Zn-3.0Bi solders

The microstructure, melting properties and wettability of Sn-3.5Ag-0.7Cu-xIn lead-free solder alloys

Interrelation of wettability-microstructure-tensile strength of lead-free Sn-Ag and Sn-Bi solder alloys

Effect of alloying elements on microstructural and electrical property in Sn-Cu-Bi lead-free solder alloys

Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate

Influence of bismuth (Bi) addition on the structure and properties of annealed Sn-9Zn eutectic binary solder alloy

Estimation of the viscosities of melt for Sn-based ternary lead-free solder alloys

Interrelationship between Interphase Boundaries and Phase Contents near the Critical Compositions of Lead-Free Ferroelectric (Na^sub 0.5^Bi^sub 0.5^)TiO^sub 3^-BaTiO^sub 3

Structural, Electrical and Magnetic Properties of (1-x)Bi^sub 0.9^La^sub 0.1^FeO^sub 3^-xBa^sub 0.85^Ca^sub 0.15^Zr^sub 0.1^Ti^sub 0.9^O^sub 3^ Ceramics

Microstructure development during directional solidification of Sn-Ag-Cu ternary alloys

Computation of infinite dilute activity coefficients for Ga-X (X= In, Tl) and thermodynamic activities of all components in liquid Ga-In-Tl alloys

Solder joint reliability of Sn-0·7Cu and Sn-0·3Ag-0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Reliability of Pb-free solders for harsh environment electronic assemblies

Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates

Effect of La Substitution on Structural, Electrical and Magnetic Properties in BF-BCZT Ceramics

Evaluation of Elastic Constants in Piezoelectric Ceramics by Measuring Acoustic Wave Velocities

Interfacial reaction of Bi-Ag and Bi-Sb solders on copper substrate with multiple reflow number

Properties of new gold based multicomponent alloys as innovative lead-free solder material

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