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Vertical Pattern of Interconnects to Bypass High Strain Near a Hard Die on a Flexible Substrate Under Mechanical Bending

Electronic Materials Letters, 2024, 20(2), , pp.122-130

2024

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Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Electronic materials letters, 2018-07, Vol.14 (4), p.387-404

2018

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Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates

Journal of materials research, 2014-12, Vol.29 (23), p.2827-2834

2014

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Operation Range-Optimized Silver Nanowire Through Junction Treatment

Electronic Materials Letters, 2020, 16(5), , pp.491-497

2020

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Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate

Journal of electronic materials, 2019-07, Vol.48 (7), p.4582-4588

2019

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Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate

Journal of materials research, 2018-01, Vol.33 (2), p.138-148

2018

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Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Journal of electronic materials, 2009-11, Vol.38 (11), p.2228-2233

2009

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Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

Journal of electronic materials, 2010-10, Vol.39 (10), p.2281-2285

2010

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Efficacy and safety of Lenzumestrocel (Neuronata-R® inj.) in patients with amyotrophic lateral sclerosis (ALSUMMIT study): study protocol for a multicentre, randomized, double-blind, parallel-group, sham procedure-controlled, phase III trial

Trials, 2022-05, Vol.23 (1), p.415-415, Article 415

2022

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Idiopathic third and sixth cranial nerve neuritis

Japanese journal of ophthalmology, 2019-07, Vol.63 (4), p.337-343

2019

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Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Journal of electronic materials, 2012-04, Vol.41 (4), p.712-719

2012

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Prior treatment status: impact on the efficacy and safety of teriflunomide in multiple sclerosis

BMC neurology, 2020-10, Vol.20 (1), p.364-364, Article 364

2020

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Microstructure evolution in Cu pillar/eutectic SnPb solder system during isothermal annealing

Metals and Materials International, 2009, 15(5), , pp.815-818

2009

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Leber's hereditary optic neuropathy following unilateral painful optic neuritis: a case report

BMC ophthalmology, 2020-05, Vol.20 (1), p.195-195, Article 195

2020

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Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits

Journal of electronic materials, 2012-02, Vol.41 (2), p.232-240

2012

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Subclinical diabetic neuropathy with normal conventional electrophysiological study

Journal of neurology, 2007, Vol.254 (1), p.53-59

2007

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Early detection of cardiac involvement in Miyoshi myopathy: 2D strain echocardiography and late gadolinium enhancement cardiovascular magnetic resonance

Journal of cardiovascular magnetic resonance, 2010-05, Vol.12 (1), p.31-31, Article 31

2010

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Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

Journal of electronic materials, 2010-11, Vol.39 (11), p.2368-2374

2010

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Effect of isothermal aging on intermetallic compounds and Kirkendall void growth kinetics of Au stud bumps

Metals and Materials International, 2009, 15(5), , pp.819-823

2009

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A comprehensive overview of AL amyloidosis disease characteristics accumulated over two decades at a single referral center in Korea

International journal of hematology, 2023-05, Vol.117 (5), p.706-717

2023

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Efficacy and safety of Lenzumestrocel : study protocol for a multicentre, randomized, double-blind, parallel-group, sham procedure-controlled, phase III trial

Trials, 2022-05, Vol.23 (1)

2022

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TREX1 Deficiency Induces ER Stress-Mediated Neuronal Cell Death by Disrupting Ca2+ Homeostasis

Molecular neurobiology, 2022-03, Vol.59 (3), p.1398-1418

2022

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The IL-10-producing regulatory B cells (B10 cells) and regulatory T cell subsets in neuromyelitis optica spectrum disorder

Neurological sciences, 2018-03, Vol.39 (3), p.543-549

2018

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TREX1 Deficiency Induces ER Stress-Mediated Neuronal Cell Death by Disrupting Ca 2+ Homeostasis

Molecular neurobiology, 2022-03, Vol.59 (3), p.1398

2022

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Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps : Phase Stability, phase transformation and reactive phase formation in electronic materials

Journal of electronic materials, 2010, Vol.39 (11), p.2368-2374

2010

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Vertical Pattern of Interconnects to Bypass High Strain Near a Hard Die on a Flexible Substrate Under Mechanical Bending

Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Effect of film thickness on the stretchability and fatigue resistance of Cu films on polymer substrates

Operation Range-Optimized Silver Nanowire Through Junction Treatment

Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate

Effect of twisting fatigue on the electrical reliability of a metal interconnect on a flexible substrate

Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps

Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

Efficacy and safety of Lenzumestrocel (Neuronata-R® inj.) in patients with amyotrophic lateral sclerosis (ALSUMMIT study): study protocol for a multicentre, randomized, double-blind, parallel-group, sham procedure-controlled, phase III trial

Idiopathic third and sixth cranial nerve neuritis

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Prior treatment status: impact on the efficacy and safety of teriflunomide in multiple sclerosis

Microstructure evolution in Cu pillar/eutectic SnPb solder system during isothermal annealing

Leber's hereditary optic neuropathy following unilateral painful optic neuritis: a case report

Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits

Subclinical diabetic neuropathy with normal conventional electrophysiological study

Early detection of cardiac involvement in Miyoshi myopathy: 2D strain echocardiography and late gadolinium enhancement cardiovascular magnetic resonance

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

Effect of isothermal aging on intermetallic compounds and Kirkendall void growth kinetics of Au stud bumps

A comprehensive overview of AL amyloidosis disease characteristics accumulated over two decades at a single referral center in Korea

Efficacy and safety of Lenzumestrocel : study protocol for a multicentre, randomized, double-blind, parallel-group, sham procedure-controlled, phase III trial

TREX1 Deficiency Induces ER Stress-Mediated Neuronal Cell Death by Disrupting Ca2+ Homeostasis

The IL-10-producing regulatory B cells (B10 cells) and regulatory T cell subsets in neuromyelitis optica spectrum disorder

TREX1 Deficiency Induces ER Stress-Mediated Neuronal Cell Death by Disrupting Ca 2+ Homeostasis

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps : Phase Stability, phase transformation and reactive phase formation in electronic materials

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