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Microstructure and Mechanical Behavior of 17-4 Precipitation Hardenable Steel Processed by Selective Laser Melting

Journal of materials engineering and performance, 2014-12, Vol.23 (12), p.4421-4428

2014

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Progress in Ostwald ripening theories and their applications to nickel-base superalloys. Part I : Ostwald ripening theories

Journal of materials science, 2002-06, Vol.37 (11), p.2171-2202

BALDAN, A

2002

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Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Journal of materials science. Materials in electronics, 2013-10, Vol.24 (10), p.3905-3913

2013

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Automating first-principles phase diagram calculations

Journal of Phase Equilibria, 2002-08, Vol.23 (4), p.348-359

2002

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Interface Phenomena and Bonding Mechanism in Magnetic Pulse Welding

Journal of materials engineering and performance, 2014-10, Vol.23 (10), p.3449-3458

2014

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Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

Journal of electronic materials, 2013-03, Vol.42 (3), p.470-484

2013

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Grain refinement induced by electromagnetic stirring: A dendrite fragmentation criterion

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2004-10, Vol.35 (10), p.3201-3210

2004

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A quantitative dendrite growth model and analysis of stability concepts

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2004-08, Vol.35 (8), p.2471-2485

2004

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Cooling rate dependence of undercooling of pure Sn single drop by fast scanning calorimetry

Applied physics. A, Materials science & processing, 2011-07, Vol.104 (1), p.189-196

2011

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Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Journal of electronic materials, 2000-10, Vol.29 (10), p.1122-1136

2000

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The relationship between chromium nitride and secondary austenite precipitation in duplex stainless steels

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2003-08, Vol.34 (8), p.1575-1597

2003

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Electronic structure and transport measurements of amorphous transition-metal oxides: observation of Fermi glass behavior

Applied physics. A, Materials science & processing, 2012-04, Vol.107 (1), p.1-11

2012

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The Mechanism of η Phase Precipitation in A286 Superalloy During Heat Treatment

Journal of materials engineering and performance, 2013-10, Vol.22 (10), p.3063-3069

2013

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Recent advances on Sn–Cu solders with alloying elements: review

Journal of materials science. Materials in electronics, 2011-06, Vol.22 (6), p.565-578

2011

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A cellular automaton model for the solidification of a pure substance

Applied physics. A, Materials science & processing, 2011-04, Vol.103 (1), p.123-133

2011

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Modeling of Directional Solidification of Columnar Grain Structure in CMSX-4 Nickel-Based Superalloy Castings

Journal of materials engineering and performance, 2014-03, Vol.23 (3), p.1088-1095

2014

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Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification

Journal of electronic materials, 2014-07, Vol.43 (7), p.2467-2478

2014

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Effect of Copper and Nickel on the Transformation Kinetics of Austempered Ductile Iron

Journal of materials engineering and performance, 2014-10, Vol.23 (10), p.3505-3510

2014

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Noise-induced pattern formation in system of point defects subjected to irradiation

The European physical journal. B, Condensed matter physics, 2012-11, Vol.85 (11), Article 383

2012

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Directional solidification of Al–Cu–Ag alloy

Applied physics. A, Materials science & processing, 2009-06, Vol.95 (3), p.923-932

2009

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Raman spectroscopic study of femtosecond laser-induced phase transformation associated with ripple formation on single-crystal SiC

Applied physics. A, Materials science & processing, 2010-04, Vol.99 (1), p.23-27

2010

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A solutal interaction mechanism for the columnar-to-equiaxed transition in alloy solidification

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2003-08, Vol.34 (8), p.1657-1674

2003

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Microstructural characterization of Hadfield austenitic manganese steel

Journal of materials science, 2008-08, Vol.43 (16), p.5654-5658

2008

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Color tunable Sr2SiO4:Eu2+ phosphors through the modification of crystal structure

Journal of materials science. Materials in electronics, 2013-11, Vol.24 (11), p.4516-4521

2013

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Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys

Journal of electronic materials, 2014-05, Vol.43 (5), p.1347-1361

2014

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Microstructure and Mechanical Behavior of 17-4 Precipitation Hardenable Steel Processed by Selective Laser Melting

Progress in Ostwald ripening theories and their applications to nickel-base superalloys. Part I : Ostwald ripening theories

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

Automating first-principles phase diagram calculations

Interface Phenomena and Bonding Mechanism in Magnetic Pulse Welding

Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

Grain refinement induced by electromagnetic stirring: A dendrite fragmentation criterion

A quantitative dendrite growth model and analysis of stability concepts

Cooling rate dependence of undercooling of pure Sn single drop by fast scanning calorimetry

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

The relationship between chromium nitride and secondary austenite precipitation in duplex stainless steels

Electronic structure and transport measurements of amorphous transition-metal oxides: observation of Fermi glass behavior

The Mechanism of η Phase Precipitation in A286 Superalloy During Heat Treatment

Recent advances on Sn–Cu solders with alloying elements: review

A cellular automaton model for the solidification of a pure substance

Modeling of Directional Solidification of Columnar Grain Structure in CMSX-4 Nickel-Based Superalloy Castings

Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification

Effect of Copper and Nickel on the Transformation Kinetics of Austempered Ductile Iron

Noise-induced pattern formation in system of point defects subjected to irradiation

Directional solidification of Al–Cu–Ag alloy

Raman spectroscopic study of femtosecond laser-induced phase transformation associated with ripple formation on single-crystal SiC

A solutal interaction mechanism for the columnar-to-equiaxed transition in alloy solidification

Microstructural characterization of Hadfield austenitic manganese steel

Color tunable Sr2SiO4:Eu2+ phosphors through the modification of crystal structure

Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys

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