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Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...IEEE transactions on circuits and systems. I, Regular papers, 2020-04, Vol.67 (4), p.1319-1332
2020
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IEEE transactions on computer-aided design of integrated circuits and systems, 2016-09, Vol.35 (9), p.1546-1556
2016
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Chronic diseases and translational medicine, 2018-05, Vol.12 (3), p.69-79
2018
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2019 IEEE International Symposium on Circuits and Systems (ISCAS), 2019, p.1-5
2019
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-09, Vol.11 (9), p.1435-1441
2021
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2022 7th International Conference on Integrated Circuits and Microsystems (ICICM), 2022, p.578-583
2022
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IEEE Custom Integrated Circuits Conference 2006, 2006, p.555-562
2006
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2019 IEEE 2nd International Conference on Electronics and Communication Engineering (ICECE), 2019, p.226-229
2019
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2016 International Conference on Electronics Packaging (ICEP), 2016, p.473-478
2016
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2017 32nd Symposium on Microelectronics Technology and Devices (SBMicro), 2017, p.1-4
2017
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2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.367-371
2018
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2018 31st Symposium on Integrated Circuits and Systems Design (SBCCI), 2018, p.1-6
2018
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2019 Latin American Electron Devices Conference (LAEDC), 2019, Vol.1, p.1-4
2019
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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.847-856
2016
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2016 31st Symposium on Microelectronics Technology and Devices (SBMicro), 2016, p.1-4
2016
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2018 33rd Symposium on Microelectronics Technology and Devices (SBMicro), 2018, p.1-4
2018
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IEEE transactions on electronics packaging manufacturing, 2006-04, Vol.29 (2), p.119-133
2006
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IET microwaves, antennas & propagation, 2015-11, Vol.9 (14), p.1632-1637
2015
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2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), 2018, p.1-2
2018
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IEEE transactions on electronics packaging manufacturing, 2001-10, Vol.24 (4), p.300-306
2001
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2012 IEEE Fifth International Conference on Utility and Cloud Computing, 2012, p.359-366
2012
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1148-1153
2016
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2004 IEEE International Reliability Physics Symposium. Proceedings, 2004, p.316-319
- Edelstein, D.
- Rathore, H.
- Davis, C.
- Clevenger, L.
- Cowley, A.
- Nogami, T.
- Agarwala, B.
- Arai, S.
- Carbone, A.
- Chanda, K.
- Chen, F.
- Cohen, S.
- Cote, W.
- Cullinan, M.
- Dalton, T.
- Das, S.
- Davis, P.
- Demarest, J.
- Dunn, D.
- Dziobkowski, C.
- Filippi, R.
- Fitzsimmons, J.
- Flaitz, P.
- Gates, S.
- Gill, J.
- Grill, A.
- Hawken, D.
- Ida, K.
- Klaus, D.
- Klymko, N.
- Lane, M.
- Lane, S.
- Lee, J.
- Landers, W.
- Li, W.-K.
- Lin, Y.-H.
- Liniger, E.
- Liu, X.-H.
- Madan, A.
- Malhotra, S.
- Martin, J.
- Molis, S.
- Muzzy, C.
- Nguyen, D.
- Nguyen, S.
- Ono, M.
- Parks, C.
- Questad, D.
- Restaino, D.
- Sakamoto, A.
- Shaw, T.
- Shimooka, Y.
- Simon, A.
- Simonyi, E.
- Swift, A.
- Van Kleeck, T.
- Vogt, S.
- Wang, Y.-Y.
- Wille, W.
- Wright, J.
- Yang, C.-C.
- Yoon, M.
- Ivers, T.
2004
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1359-1364
2018
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2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.105-109
2007
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