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Development of an ytterbium optical lattice clock at KRISS

2008 Conference on Precision Electromagnetic Measurements Digest, 2008, p.618-619

2008

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Optical frequency comb comparison between optical clock configuration and optical frequency synthesizer

2008 Conference on Precision Electromagnetic Measurements Digest, 2008, p.310-311

2008

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Development of an Yb optical lattice clock at KRISS

CPEM 2010, 2010, p.440-441

2010

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Auxiliary Switch Control of a Bidirectional Soft-Switching DC/DC Converter

IEEE transactions on power electronics, 2013-12, Vol.28 (12), p.5446-5457

2013

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Spin Up-Down Asymmetry in the Excitation of Kr 5p[]2 by Polarized Electrons

Ionization, Correlation, and Polarization in Atomic Collisions, 2006, Vol.811, p.185-190

2006

Volltextzugriff (PDF)

Visualization of Cascade Effects on Integrated Stokes Parameters Using a Pulsed Polarized Electron Beam Technique

AIP Conference Proceedings, 2003, Vol.697, p.188-192

2003

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Spin dependent interactions in the excitations of atoms and molecules

AIP Conference Proceedings, 2002, p.244-249

2002

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Characterization and modeling of edge direct tunneling (EDT) leakage in ultrathin gate oxide MOSFETs

IEEE transactions on electron devices, 2001-06, Vol.48 (6), p.1159-1164

2001

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Submicrometer salicide CMOS devices with self-aligned shallow/deep junctions

IEEE electron device letters, 1989-11, Vol.10 (11), p.487-489

1989

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Edge hole direct tunneling leakage in ultrathin gate oxide p-channel MOSFETs

IEEE transactions on electron devices, 2001-12, Vol.48 (12), p.2790-2795

2001

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Temporal and spatial variations of grassland desertification in Lingwu and Yanchi of Ningxia, China

2013 Second International Conference on Agro-Geoinformatics (Agro-Geoinformatics), 2013, p.356-360

2013

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Aboveground biomass and their changes in the eastern Inner Mongolia grasslands during 2001-2011

2012 First International Conference on Agro- Geoinformatics (Agro-Geoinformatics), 2012, p.1-4

2012

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To optimize electrical properties of the ultrathin (1.6 nm) nitride/oxide gate stacks with bottom oxide materials and post-deposition treatment

IEEE transactions on electron devices, 2001-12, Vol.48 (12), p.2769-2776, Article 2769

2001

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High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

2012 International Electron Devices Meeting, 2012, p.14.1.1-14.1.4

2012

Volltextzugriff (PDF)

Image shadow removal using pulse coupled neural network

IEEE transactions on neural networks, 2005-05, Vol.16 (3), p.692-698

2005

Volltextzugriff (PDF)

High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

2010 International Electron Devices Meeting, 2010, p.2.1.1-2.1.4

2010

Volltextzugriff (PDF)

Inverted thin-film transistors with a simple self-aligned lightly doped drain structure

IEEE transactions on electron devices, 1992-12, Vol.39 (12), p.2803-2809

1992

Volltextzugriff (PDF)

Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.634-638

2011

Volltextzugriff (PDF)

Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.706-710

2011

Volltextzugriff (PDF)

Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.346-350

2011

Volltextzugriff (PDF)

General design approach to unit-linking PCNN for image processing

Proceedings. 2005 IEEE International Joint Conference on Neural Networks, 2005, 2005, Vol.3, p.1836-1841 vol. 3

2005

Volltextzugriff (PDF)

Advanced flip-chip package solution for 28nm Si node and beyond

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.436-438

2012

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Dynamic Modeling and Interaction of Hybrid Natural Gas and Electricity Supply System in Microgrid

IEEE transactions on power systems, 2015-05, Vol.30 (3), p.1212-1221

2015

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Orthotropic stress field induced by TSV and its impact on device performance

2011 IEEE International Interconnect Technology Conference, 2011, p.1-3

2011

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A new approach for automated image segmentation based on unit-linking PCNN

Proceedings. International Conference on Machine Learning and Cybernetics, 2002, Vol.1, p.175-178 vol.1

2002

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Development of an ytterbium optical lattice clock at KRISS

Optical frequency comb comparison between optical clock configuration and optical frequency synthesizer

Development of an Yb optical lattice clock at KRISS

Auxiliary Switch Control of a Bidirectional Soft-Switching DC/DC Converter

Spin Up-Down Asymmetry in the Excitation of Kr 5p[]2 by Polarized Electrons

Visualization of Cascade Effects on Integrated Stokes Parameters Using a Pulsed Polarized Electron Beam Technique

Spin dependent interactions in the excitations of atoms and molecules

Characterization and modeling of edge direct tunneling (EDT) leakage in ultrathin gate oxide MOSFETs

Submicrometer salicide CMOS devices with self-aligned shallow/deep junctions

Edge hole direct tunneling leakage in ultrathin gate oxide p-channel MOSFETs

Temporal and spatial variations of grassland desertification in Lingwu and Yanchi of Ningxia, China

Aboveground biomass and their changes in the eastern Inner Mongolia grasslands during 2001-2011

To optimize electrical properties of the ultrathin (1.6 nm) nitride/oxide gate stacks with bottom oxide materials and post-deposition treatment

High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Image shadow removal using pulse coupled neural network

High density 3D integration using CMOS foundry technologies for 28 nm node and beyond

Inverted thin-film transistors with a simple self-aligned lightly doped drain structure

Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications

Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps

Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond

General design approach to unit-linking PCNN for image processing

Advanced flip-chip package solution for 28nm Si node and beyond

Dynamic Modeling and Interaction of Hybrid Natural Gas and Electricity Supply System in Microgrid

Orthotropic stress field induced by TSV and its impact on device performance

A new approach for automated image segmentation based on unit-linking PCNN

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