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IEEE signal processing letters, 2020, Vol.27, p.91-95
2020
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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4
2015
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2014 15th International Conference on Electronic Packaging Technology, 2014, p.1177-1180
2014
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2014 15th International Conference on Electronic Packaging Technology, 2014, p.363-368
2014
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- Bonding
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- After-Reflow Misalignment
- Artificial Neural Networks
- Bonding Pad Design
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- Covariance Matrices
- Covariance Matrix
- Deep Neural Network
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