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AIP Conference Proceedings, 2023, Vol.2685 (1)
2023
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2023 9th International Conference on Applied System Innovation (ICASI), 2023, p.226-228
2023
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2023 IEEE 3rd International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB), 2023, p.487-490
2023
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IEEE transactions on device and materials reliability, 2005-06, Vol.5 (2), p.168-176
2005
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IEEE transactions on device and materials reliability, 2005-06, Vol.5 (2), p.168
2005
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Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004, 2004, Vol.1, p.399-402 vol.1
2004
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IEEE transactions on wireless communications, 2022-06, Vol.21 (6), p.4310-4324
2022
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IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society, 2007, p.46-51
2007
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IEEE transactions on magnetics, 2017-11, Vol.53 (11), p.1-4
2017
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IEEE internet of things journal, 2023-08, Vol.10 (16), p.1-1
2023
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IEEE communications letters, 2013-12, Vol.17 (12), p.2300-2303
2013
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IEEE transactions on robotics, 2015-02, Vol.31 (1), p.40-54
2015
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-04, Vol.11 (4), p.573-578
2021
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IEEE transactions on broadcasting, 2016-12, Vol.62 (4), p.903-917
2016
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IEEE access, 2020, Vol.8, p.84753-84768
2020
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IEEE transactions on wireless communications, 2015-06, Vol.14 (6), p.3143-3156
2015
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-08, Vol.10 (8), p.1296-1303
2020
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-09, Vol.7 (9), p.1560-1566
2017
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ICC 2020 - 2020 IEEE International Conference on Communications (ICC), 2020, p.1-7
2020
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IEEE electron device letters, 2009-10, Vol.30 (10), p.1039-1041
2009
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IEEE transactions on magnetics, 2009-10, Vol.45 (10), p.4391-4394
2009
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IEEE transactions on electron devices, 2024-07, p.1-8
2024
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IEEE sensors journal, 2024-07, p.1-1
2024
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2009 Tenth International Conference on Mobile Data Management: Systems, Services and Middleware, 2009, p.393-394
2009
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2022 International Electron Devices Meeting (IEDM), 2022, p.7.2.1-7.2.4
2022
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