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Journal of microelectromechanical systems, 2012-02, Vol.21 (1), p.100-109
2012
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-6
2023
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-5
2023
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2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.1339-1346
2019
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, p.1-4
2020
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.157-163
2024
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.793-800
2020
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.756-763
2018
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.470-475
2017
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2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, p.1-4
2017
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1105-1111
2016
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2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, p.1-5
2018
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.774-781
2016
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2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.7.3.1-7.3.4
2015
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1774-1780
2018
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2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016, p.1-6
2016
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2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016, p.1-5
2016
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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-7
2015
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014, p.426-431
2014
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2008 58th Electronic Components and Technology Conference, 2008, p.1181-1186
2008
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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011, p.1/6-6/6
2011
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2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010, p.1-6
2010
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2008 58th Electronic Components and Technology Conference, 2008, p.2149-2155
2008
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2008 58th Electronic Components and Technology Conference, 2008, p.1751-1754
2008
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2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010, p.1-9
2010
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