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2018
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AIP conference proceedings, 2006, Vol.AIP Conference Proceedings 828 (1), p.473-478
2006
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AIP conference proceedings, 2006, Vol.AIP Conference Proceedings 828 (1), p.321-326
2006
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2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014, p.1-2
- Seo, K.-I
- Haran, B.
- Gupta, D.
- Guo, D.
- Standaert, T.
- Xie, R.
- Shang, H.
- Alptekin, E.
- Bae, D.-I
- Bae, G.
- Boye, C.
- Cai, H.
- Chanemougame, D.
- Chao, R.
- Cheng, K.
- Cho, J.
- Choi, K.
- Hamieh, B.
- Hong, J. G.
- Hook, T.
- Jang, L.
- Jung, J.
- Jung, R.
- Lee, D.
- Lherron, B.
- Kambhampati, R.
- Kim, B.
- Kim, H.
- Kim, K.
- Kim, T. S.
- Ko, S.-B
- Lie, F. L.
- Liu, D.
- Mallela, H.
- Mclellan, E.
- Mehta, S.
- Montanini, P.
- Mottura, M.
- Nam, J.
- Nam, S.
- Nelson, F.
- Ok, I.
- Park, C.
- Park, Y.
- Paul, A.
- Prindle, C.
- Ramachandran, R.
- Sankarapandian, M.
- Sardesai, V.
- Scholze, A.
- Seo, S.-C
- Shearer, J.
- Southwick, R.
- Sreenivasan, R.
- Stieg, S.
- Strane, J.
- Sun, X.
- Sung, M. G.
- Surisetty, C.
- Tsutsui, G.
- Tripathi, N.
- Vega, R.
- Waskiewicz, C.
- Weybright, M.
- Yeh, C.-C
- Bu, H.
- Burns, S.
- Canaperi, D.
- Celik, M.
- Colburn, M.
- Jagannathan, H.
- Kanakasabaphthy, S.
- Kleemeier, W.
- Liebmann, L.
- Mcherron, D.
- Oldiges, P.
- Paruchuri, V.
- Spooner, T.
- Stathis, J.
- Divakaruni, R.
- Gow, T.
- Iacoponi, J.
- Jenq, J.
- Sampson, R.
- Khare, M.
2014
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2018 IEEE International Electron Devices Meeting (IEDM), 2018, p.35.4.1-35.4.4
- Wu, H.
- Gluschenkov, O.
- Tsutsui, G.
- Niu, C.
- Brew, K.
- Durfee, C.
- Prindle, C.
- Kamineni, V.
- Mochizuki, S.
- Lavoie, C.
- Nowak, E.
- Liu, Z.
- Yang, J.
- Choi, S.
- Demarest, J.
- Yu, L.
- Carr, A.
- Wang, W.
- Strane, J.
- Tsai, S.
- Liang, Y.
- Amanapu, H.
- Saraf, I.
- Ryan, K.
- Lie, F.
- Kleemeier, W.
- Choi, K.
- Cave, N.
- Yamashita, T.
- Knorr, A.
- Gupta, D.
- Haran, B.
- Guo, D.
- Bu, H.
- Khare, M.
2018
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2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2014, p.1-4
- Guo, D.
- Shang, H.
- Seo, K.
- Haran, B.
- Standaert, T.
- Gupta, D.
- Alptekin, E.
- Bae, D.
- Bae, G.
- Chanemougame, D.
- Cheng, K.
- Cho, J.
- Hamieh, B.
- Hong, J.
- Hook, T.
- Jung, J.
- Kambhampati, R.
- Kim, B.
- Kim, H.
- Kim, K.
- Kim, T.
- Liu, D.
- Mallela, H.
- Montanini, P.
- Mottura, M.
- Nam, S.
- Ok, I.
- Park, Y.
- Paul, A.
- Prindle, C.
- Ramachandran, R.
- Sardesai, V.
- Scholze, A.
- Seo, S.
- Southwick, R.
- Strane, J.
- Sun, X.
- Tsutsui, G.
- Tripathi, N.
- Vega, R.
- Weybright, M.
- Xie, R.
- Yeh, C.
- Bu, H.
- Burns, S.
- Canaperi, D.
- Celik, M.
- Colburn, M.
- Jagannathan, H.
- Kanakasabaphthy, S.
- Kleemeier, W.
- Liebmann, L.
- Mcherron, D.
- Oldiges, P.
- Paruchuri, V.
- Spooner, T.
- Stathis, J.
- Divakaruni, R.
- Gow, T.
- Iacoponi, J.
- Jenq, J.
- Sampson, R.
- Yang, W.
- Khare, M.
2014
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2006 International Electron Devices Meeting, 2006, p.1-4
- Agnello, P.
- Ivers, T.
- Warm, C.
- Wise, R.
- Wachnik, R.
- Schepis, D.
- Sankaran, S.
- Norum, J.
- Luning, S.
- Li, Y.
- Khare, M.
- Grill, A.
- Edelstein, D.
- Chen, X.
- Brown, D.
- Augur, R.
- Wu, S.
- Yu, J.
- Wong, R.C.
- Werking, J.
- Wehella-Gamage, D.
- Vayshenker, A.
- Van Meer, H.
- Van Den Nieuwenhuizen, R.
- Tian, C.
- Tabakman, K.
- Sung, C.Y.
- Standaert, T.
- Simon, A.
- Sim, J.
- Sheraw, C.
- Restaino, D.
- Rausch, W.
- Pal, R.
- Prindle, C.
- Ouyang, X.
- Ouyang, C.
- Ontalus, V.
- Nummy, K.
- Nielsen, D.
- Nicholson, L.
- McKnight, A.
- Lustig, N.
- Liu, X.
- Lee, M.H.
- Lea, D.
- Larosa, G.
- Landers, W.
- Kim, B.
- Kelling, M.
- Jeng, S.-J.
- Holt, J.
- Hargrove, M.
- Grunow, S.
- Greco, S.
- Gates, S.
- Frye, A.
- Fisher, P.
- Domenicucci, A.
- Dimitrakopoulos, C.
- Costrini, G.
- Chou, A.
- Cheng, J.
- Butt, S.
- Black, L.
- Belyansky, M.
- Ahsan, I.
- Adam, T.
- Gabor, A.
- Wu, C.-H.J.
- Yang, D.
- Crouse, M.
- Robinson, C.
- Corliss, D.
- Fonseca, C.
- Johnson, J.
- Weybright, M.
- Waite, A.
- Nayfeh, H.M.
- Onishi, K.
- Narasimha, S.
2006
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2012 International Semiconductor Conference Dresden-Grenoble (ISCDG), 2012, p.173-174
2012
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IEEE transactions on nuclear science, 1985-01, Vol.32 (1), p.976-978
1985
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Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695), 2003, p.65-67
2003
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OCEANS '87, 1987, p.661-673
1987
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Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), 2002, p.182-184
2002
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Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), 2002, p.9-11
- Yu, K.C.
- Werking, J.
- Prindle, C.
- Kiene, M.
- Ng, M.-F.
- Wilson, B.
- Singhal, A.
- Stephens, T.
- Huang, F.
- Sparks, T.
- Aminpur, M.
- Linville, J.
- Denning, D.
- Brennan, B.
- Shahvandi, I.
- Wang, C.
- Flake, J.
- Chowdhury, R.
- Svedberg, L.
- Solomentsev, Y.
- Kim, S.
- Cooper, K.
- Usmani, S.
- Smith, D.
- Olivares, M.
- Carter, R.
- Eggenstein, B.
- Strozewski, K.
- Junker, K.
- Goldberg, C.
- Filipiak, S.
- Martin, J.
- Grove, N.
- Ramani, N.
- Ryan, T.
- Mueller, J.
- Guvenilir, A.
- Zhang, D.
- Ventzek, P.
- Wang, V.
- Lii, T.
- King, C.
- Crabtree, P.
- Farkas, J.
- Iacoponi, J.
- Pellerin, J.
- Melnick, B.
- Woo, M.
- Weitzman, E.
2002
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