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IEEE transactions on geoscience and remote sensing, 2011-09, Vol.49 (9), p.3460-3470
2011
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2018 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS), 2018, p.5964-5971
2018
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IECON 2012 - 38th Annual Conference on IEEE Industrial Electronics Society, 2012, p.2232-2237
2012
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IECON 2012 - 38th Annual Conference on IEEE Industrial Electronics Society, 2012, p.1007-1012
2012
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IEEE transactions on vehicular technology, 2001-07, Vol.50 (4), p.925-941
2001
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2012 Tyrrhenian Workshop on Advances in Radar and Remote Sensing (TyWRRS), 2012, p.198-201
2012
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5th Brunei International Conference on Engineering and Technology (BICET 2014), 2014, p.2.25
2014
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Proceedings IEEE International Symposium on Computers and Communications (Cat. No.PR00250), 1999, p.354-360
1999
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IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States), 1993-08, Vol.40 (4), p.516-531
- Dell'Acqua, A.
- Hansen, M.
- Lofstedt, B.
- Vanuxem, J.P.
- Svensson, C.
- Yuan, J.
- Hentzell, H.
- Alippi, C.
- Breveglieri, L.
- Dadda, L.
- Piuri, V.
- Salice, F.
- Sami, M.
- Stefanelli, R.
- Cattaneo, P.
- Fumagalli, G.
- Goggi, V.G.
- Brigati, S.
- Gatti, U.
- Maloberti, F.
- Torelli, G.
- Carlson, P.
- Fuglesang, C.
- Kerek, A.
- Appelquist, G.
- Berglund, S.
- Bohm, C.
- Yamdagni, N.
- Sundblad, R.
1993
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IEEE personal communications, 1997-10, Vol.4 (5), p.16-24
1997
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IMTC/2002. Proceedings of the 19th IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.00CH37276), 2002, Vol.1, p.747-751 vol.1
2002
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ICUPC '98. IEEE 1998 International Conference on Universal Personal Communications. Conference Proceedings (Cat. No.98TH8384), 1998, Vol.1, p.483-487 vol.1
1998
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IEEE ATM '97 Workshop Proceedings (Cat. No.97TH8316), 1997, p.416-424
1997
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Proceedings of 1993 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems, 1993, p.1-8
- Dell'Acqua, A.
- Hansen, M.
- Ikinen, S.
- Lofstedt, B.
- Vanuxem, J.P.
- Svensson, C.
- Yuan, J.
- Hentzell, H.
- Del Buono, L.
- David, J.
- Genat, J.F.
- Lebbolo, H.
- LeDortz, O.
- Nayman, P.
- Savoy-Navarro, A.
- Zitoun, R.
- Alippi, C.
- Breveglieri, L.
- Dadda, L.
- Piuri, V.
- Salice, F.
- Sami, M.
- Stefanelli, R.
- Cattaneo, P.
- Fumagalli, G.
- Goggi, G.
- Brigati, S.
- Gatti, U.
- Maloberti, F.
- Torelli, G.
- Carlson, P.
- Kerek, A.
- Appelquist, G.
- Berglund, S.
- Bohm, C.
- Engstrom, M.
- Yamdagni, N.
- Sundblad, R.
- Hoglund, I.
- Persson, S.T.
1993
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IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1994-08, Vol.17 (3), p.302-309
- Dell'Acqua, A.
- Alexanian, H.
- Alippi, C.
- Appelquist, G.
- Bailly, P.
- Benetta, R.
- Berglund, S.
- Bezamat, J.
- Blouzon, F.
- Bohm, C.
- Breveglieri, L.
- Brigati, S.
- Carlson, P.
- Cattaneo, P.
- Dadda, L.
- David, J.
- Engstrom, M.
- Fumagalli, G.
- Gatti, U.
- Genat, J.F.
- Goggi, V.G.
- Gong, S.F.
- Hansen, M.
- Hentzell, H.
- Hoglund, I.
- Inkinen, S.
- Kerek, A.
- LeDortz, O.
- Lofstedt, B.
- Maloberti, F.
- Nayman, P.
- Odmark, A.
- Piuri, V.
- Polesello, G.
- Salice, F.
- Sami, N.
- Savoy-Navarro, A.
- Stefanelli, R.
- Sundblad, R.
- Svensson, C.
- Torelli, G.
- Vanuxem, J.P.
- Yamdagni, N.
- Yuan, J.
1994
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IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1994, Vol.17 (3), p.302-309
- DELL'ACQUA, A
- ALEXANIAN, H
- BREVEGLIERI, L
- BRIGATI, S
- CARLSON, P
- CATTANEO, P
- DADDA, L
- DAVID, J
- ENGSTRÖM, M
- FUMAGALLI, G
- GATTI, U
- GENAT, J. F
- ALIPPI, C
- GOGGI, V. G
- GONG, S. F
- HANSEN, M
- HENTZELL, H
- HÖGLUND, I
- INKINEN, S
- KEREK, A
- LEDORTZ, O
- LOFSTEDT, B
- MALOBERTI, F
- APPELQUIST, G
- NAYMAN, P
- ÖDMARK, A
- PIURI, V
- POLESELLO, G
- SALICE, F
- SAMI, M
- SAVOY-NAVARRO, A
- STEFANELLI, R
- SUNDBLAD, R
- SVENSSON, C
- BAILLY, P
- TORELLI, G
- VANUXEM, J. P
- YAMDAGNI, N
- YUAN, J
- BENETTA, R
- BERGLUND, S
- BEZAMAT, J
- BLOUZON, F
- BOHM, C
1994
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IEEE Conference on Nuclear Science Symposium and Medical Imaging, 1992, p.424-426 vol.1
- Alippi, C.
- Appelquist, G.
- Berglund, S.
- Bohm, C.
- Breveglieri, L.
- Brigati, S.
- Carlson, P.
- Cattaneo, P.
- Dadda, L.
- Dell'Acqua, A.
- Fuglesang, C.
- Fumagalli, G.
- Gatti, U.
- Goggi, V.G.
- Hansen, M.
- Hentzell, H.
- Kerek, A.
- Lofstedt, B.
- Maloberti, F.
- Piuri, V.
- Salice, F.
- Sami, M.
- Stefanelli, R.
- Sundblad, R.
- SveNSSMICon, C.
- Torelli, G.
- Vanuxem, J.P.
- Yamdagni, N.
- Yuan, J.
1992
Volltextzugriff (PDF)
Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI), 1994, p.252-264
- Dell'Acqua, A.
- Alippi, C.
- Appelquist, G.
- Berglund, S.
- Bohm, C.
- Breveglieri, L.
- Brigati, S.
- Del Buono, L.
- Carlson, P.
- Cattaneo, P.
- Dadda, L.
- David, J.
- Engstrom, M.
- Fumagalli, G.
- Gatti, U.
- Genat, J.F.
- Goggi, G.
- Hansen, M.
- Hentzell, H.
- Hoglund, I.
- Inkinen, S.
- Kerek, A.
- Lebbolo, H.
- LeDortz, O.
- Lofstedt, B.
- Maloberti, F.
- Nayman, P.
- Persson, S.T.
- Piuri, V.
- Salice, F.
- Sami, M.
- Savoy-Navarro, A.
- Stefanelli, R.
- Sundblad, R.
- Svensson, C.
- Torelli, G.
- Vanuxem, J.P.
- Yamdagni, N.
- Yuan, J.
- Zitoun, R.
1994
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