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A Backpropagation Algorithm for Inferring Disentagled Nodal Dynamics and Connectivity Structure of Dynamical Networks

IEEE transactions on network science and engineering, 2024-01, Vol.11 (1), p.1-12

2024

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A 1.24-pJ/b 112-Gb/s (870 Gb/s/Mm) Transceiver for In-Package Links in 7-nm FinFET

IEEE journal of solid-state circuits, 2022-04, Vol.57 (4), p.1199-1210

2022

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CMOS-Compatible Ti/TiN/Al Refractory Ohmic Contact for GaAs Heterojunction Bipolar Transistors Grown on Ge/Si Substrate

IEEE transactions on electron devices, 2021-12, Vol.68 (12), p.6065-6068

2021

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Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process

IEEE journal of the Electron Devices Society, 2018-01, Vol.6, p.571-578

2018

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Al2O3 Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon

IEEE transactions on electron devices, 2013, Vol.60 (1), p.56-62

2013

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High-Frequency Characteristics of InGaP/GaAs Double Heterojunction Bipolar Transistor Epitaxially Grown on 200 mm Ge/Si Wafers

IEEE journal of the Electron Devices Society, 2020, Vol.8, p.122-125

2020

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GaN HEMTs with Breakdown Voltage of 2200 V Realized on a 200 mm GaN-on-Insulator(GNOI)-on-Si Wafer

2019 Symposium on VLSI Technology, 2019, p.T242-T243

2019

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Kahuna: Problem diagnosis for Mapreduce-based cloud computing environments

2010 IEEE Network Operations and Management Symposium - NOMS 2010, 2010, p.112-119

2010

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hbox\hbox Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon

IEEE transactions on electron devices, 2013-01, Vol.60 (1), p.56-62

2013

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System Level Performance Characteristics of Sub-6GHz Massive MIMO Deployments with the 3GPP New Radio

2018 IEEE 88th Vehicular Technology Conference (VTC-Fall), 2018, p.1-5

2018

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[Formula Omitted] Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon

IEEE transactions on electron devices, 2013-01, Vol.60 (1), p.56-62

2013

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An Interpretable Intensive Care Unit Mortality Risk Calculator

2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), 2021, Vol.2021, p.4152-4158

2021

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Ergonomic considerations for anthropomorphic wrist exoskeletons: A simulation study on the effects of joint misalignment

2011 IEEE/RSJ International Conference on Intelligent Robots and Systems, 2011, p.4905-4910

2011

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GeSn p-FinFETs with Sub-10 nm Fin Width Realized on a 200 mm GeSnOI Substrate: Lowest SS of 63 mV/decade, Highest Gm,int of 900 µS/µm, and High-Field µeff of 275 cm2/Vs

2018 IEEE Symposium on VLSI Technology, 2018, p.197-198

2018

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TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-04, Vol.4 (4), p.581-587

2014

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Tapping drone technology to acquire 21st century skills: A smart city approach

2017 IEEE SmartWorld, Ubiquitous Intelligence & Computing, Advanced & Trusted Computed, Scalable Computing & Communications, Cloud & Big Data Computing, Internet of People and Smart City Innovation (SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI), 2017, p.1-4

2017

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Rapid and Sensitive Human-Specific DNA Quantitation Using a Microfluidic Amplification Module at the Point-of-Care

2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC), 2023, Vol.2023, p.1-6

2023

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Relationship Between Wafer-Level Warpage and Cu Overburden Thickness Controlled by Isotropic Wet Etching for Through Si Vias

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-11, Vol.3 (11), p.1820-1825

2013

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Designing Event-Triggered Prescribed-Time Consensus and Containment Control of Multi-Agent Systems Under Directed Graphs

2021 11th International Conference on Information Science and Technology (ICIST), 2021, p.280-285

2021

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The Design and Optimisation of W-Angular Plate on Quadrilateral Surface

2024 IEEE 1st International Conference on Communication Engineering and Emerging Technologies (ICoCET), 2024, p.1-4

2024

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A 5.5mA 2.4-GHz two-point modulation Zigbee transmitter with modulation gain calibration

2009 IEEE Custom Integrated Circuits Conference, 2009, p.375-378

2009

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Monolithically Integrated GaN+CMOS Logic Circuits Design and Electro-Thermal Analysis for High-Voltage Applications

2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), 2020, p.1-4

2020

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An optimized flow management mechanism in OpenFlow network

2017 International Conference on Information Networking (ICOIN), 2017, p.143-147

2017

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High brightness and bonding yield of integrated Si-CMOS and GaN LED wafers

2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2019, p.1-3

2019

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Monolithic integration of III-V HEMT and Si-CMOS through TSV-less 3D wafer stacking

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.560-565

2015

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A Backpropagation Algorithm for Inferring Disentagled Nodal Dynamics and Connectivity Structure of Dynamical Networks

A 1.24-pJ/b 112-Gb/s (870 Gb/s/Mm) Transceiver for In-Package Links in 7-nm FinFET

CMOS-Compatible Ti/TiN/Al Refractory Ohmic Contact for GaAs Heterojunction Bipolar Transistors Grown on Ge/Si Substrate

Monolithic Integration of Si-CMOS and III-V-on-Si Through Direct Wafer Bonding Process

Al2O3 Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon

High-Frequency Characteristics of InGaP/GaAs Double Heterojunction Bipolar Transistor Epitaxially Grown on 200 mm Ge/Si Wafers

GaN HEMTs with Breakdown Voltage of 2200 V Realized on a 200 mm GaN-on-Insulator(GNOI)-on-Si Wafer

Kahuna: Problem diagnosis for Mapreduce-based cloud computing environments

hbox\hbox Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon

System Level Performance Characteristics of Sub-6GHz Massive MIMO Deployments with the 3GPP New Radio

[Formula Omitted] Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon

An Interpretable Intensive Care Unit Mortality Risk Calculator

Ergonomic considerations for anthropomorphic wrist exoskeletons: A simulation study on the effects of joint misalignment

GeSn p-FinFETs with Sub-10 nm Fin Width Realized on a 200 mm GeSnOI Substrate: Lowest SS of 63 mV/decade, Highest Gm,int of 900 µS/µm, and High-Field µeff of 275 cm2/Vs

TSV Cu Filling Failure Modes and Mechanisms Causing the Failures

Tapping drone technology to acquire 21st century skills: A smart city approach

Rapid and Sensitive Human-Specific DNA Quantitation Using a Microfluidic Amplification Module at the Point-of-Care

Relationship Between Wafer-Level Warpage and Cu Overburden Thickness Controlled by Isotropic Wet Etching for Through Si Vias

Designing Event-Triggered Prescribed-Time Consensus and Containment Control of Multi-Agent Systems Under Directed Graphs

The Design and Optimisation of W-Angular Plate on Quadrilateral Surface

A 5.5mA 2.4-GHz two-point modulation Zigbee transmitter with modulation gain calibration

Monolithically Integrated GaN+CMOS Logic Circuits Design and Electro-Thermal Analysis for High-Voltage Applications

An optimized flow management mechanism in OpenFlow network

High brightness and bonding yield of integrated Si-CMOS and GaN LED wafers

Monolithic integration of III-V HEMT and Si-CMOS through TSV-less 3D wafer stacking

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