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Packaged Long Cavity Hybrid III-V/Si 3 N 4 Mode-Locked Laser With Improved Modulation Efficiency
IEEE journal of quantum electronics, 2023-06, Vol.59 (3), p.1-8
2023
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IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management
IEEE journal of solid-state circuits, 2021-01, Vol.56 (1), p.79-97
2021
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Characterization of Old Nuclear Waste Packages Coupling Photon Activation Analysis and Complementary Non-Destructive Techniques
IEEE transactions on nuclear science, 2014-08, Vol.61 (4), p.2137-2143
2014
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Transmission Quality Measurement of Two Types of 60 GHz Millimeter-Wave Generation and Distribution Systems
Journal of lightwave technology, 2009-12, Vol.27 (23), p.5469-5474
2009
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Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022-03, Vol.12 (3), p.462-468
2022
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Packaged Long Cavity Hybrid III-V/Si3N4 Mode-Locked Laser With Improved Modulation Efficiency
IEEE journal of quantum electronics, 2023-06, Vol.59 (3), p.1-8
2023
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Compact InP-Based DFB-EAM Enabling PAM-4 112 Gb/s Transmission Over 2 km
Journal of lightwave technology, 2016-04, Vol.34 (7), p.1572-1578
2016
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Millimeter-Wave Photonic Components for Broadband Wireless Systems: SPECIAL ISSUE ON MICROWAVE PHOTONICS
IEEE transactions on microwave theory and techniques, 2010, Vol.58 (11), p.3071-3082
2010
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2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters
2020 IEEE International Solid- State Circuits Conference - (ISSCC), 2020, p.46-48
2020
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Characterizations of Indium Interconnects for 3D Quantum Assemblies
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.973-979
2023
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SCADA data based realistic simulation framework to evaluate environmental impact on performance of wind turbine condition monitoring systems
2019 4th Conference on Control and Fault Tolerant Systems (SysTol), 2019, p.360-365
2019
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Co-integration of TSV mid process and optical devices for Silicon photonics interposers
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, p.1-5
2020
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Hybrid InP-SiN microring-resonator based tunable laser with high output power and narrow linewidth for high capacity coherent systems
2022 Optical Fiber Communications Conference and Exhibition (OFC), 2022, p.1-3
2022
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Millimeter-wave photonic up-conversion based on a 55GHz quantum dashed mode-locked laser
2008 34th European Conference on Optical Communication, 2008, p.1-2
2008
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Characterization of old nuclear waste packages coupling photon activation analysis and complementary non-destructive techniques
2013 3rd International Conference on Advancements in Nuclear Instrumentation, Measurement Methods and their Applications (ANIMMA), 2013, p.1-7
2013
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Integration challenges for terabit class mid board photonic transceivers
2016 IEEE CPMT Symposium Japan (ICSJ), 2016, p.201-204
2016
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Towards a low noise class-A hybrid III-V/Silicon laser
11th International Conference on Group IV Photonics (GFP), 2014, p.207-208
2014
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All photonic-gain Optoelectronic Oscillator at 10 GHz
2018 International Topical Meeting on Microwave Photonics (MWP), 2018, p.1-3
2018
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Ultra-wideband radio-over-fiber techniques and networks
2010 Conference on Optical Fiber Communication (OFC/NFOEC), collocated National Fiber Optic Engineers Conference, 2010, p.1-3
2010
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Photonics for broadband radio communications at 60 GHz in Access and Home Networks
2008 International Topical Meeting on Microwave Photonics jointly held with the 2008 Asia-Pacific Microwave Photonics Conference, 2008, p.5-8
2008
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