UB Paderborn / Katalog / Suche / in CDI

Variable-Stride Multi-Pattern Matching For Scalable Deep Packet Inspection

IEEE INFOCOM 2009, 2009, p.415-423

2009

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Low loss fibre optic polarisers using differential coupling to dielectric waveguide overlays

Electronics letters, 1994, Vol.30 (4), p.349-351

1994

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Study of Silicon thickness for electron transparency

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-4

2019

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Multi-spectral uncooled microbolometer sensor for the Mars 2001 orbiter THEMIS instrument

2000 IEEE Aerospace Conference. Proceedings (Cat. No.00TH8484), 2000, Vol.3, p.151-163 vol.3

2000

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Guest Editorial: Learning From Noisy Multimedia Data

IEEE transactions on multimedia, 2022, Vol.24, p.1247-1252

2022

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Quantitative strain analysis for advanced CMOS technology by Nano Beam Diffraction

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2010, p.1-3

2010

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FIB sample preparation for TEM failure analysis of advanced devices

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2010, p.1-5

2010

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Investigation of Potassium Contamination in SOI Wafer Using Dynamic SIMS

IEEE transactions on device and materials reliability, 2007-06, Vol.7 (2), p.369-372

2007

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SIMS sample preparation method for GOX analysis with small-size polysilicon patterns

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2013, p.478-480

2013

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Failure analysis and elimination of poly residues contamination in wafer fabrication

ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425), 2000, p.44-48

2000

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Auger electron spectroscopy studies on bondpad peeling failure in wafer fabrication

ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425), 2000, p.62-67

2000

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Power MOSFET breakdown voltage study for process control by SIMS

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2012, p.1-3

2012

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A study on silicon nodules due to the Si precipitation in wafer fabrication

ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425), 2000, p.110-112

2000

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Investigation on sidewall polymer contamination during metal etching in wafer fabrication

ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425), 2000, p.131-133

2000

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Wire bonding, bumping & assembly related failures & improvements

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2011, p.1-5

2011

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TEM dark-field off-axis electron holography strain measurement on embedded-SiGe pMOSFETs and comparison with nano-beam diffraction strain measurement

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2012, p.1-5

2012

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Analysis of satellite defects formed in photolithograph process by TOF-SIMS and XPS

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2013, p.293-295

2013

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Interfacial characterization of ultra low-k film (kappa=2.55) with time of flight secondary ion mass spectrometry (TOF-SIMS)

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2008, p.1-4

2008

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Study on Potassium Contamination in SOI Wafer Fabrication Using Dynamic SIMS

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2006, p.133-136

2006

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Development of FIB-based Charge Reduction Methods for Auger Electron Spectroscopy and Their Application in Failure Analysis

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2006, p.67-70

2006

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Gate oxide integrity failure caused by molybdenum contamination introduced in the ion implantation

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2008, p.1-4

2008

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SIMS Analysis of Gate Oxide Breakdown Due to Tungsten Contamination

2006 IEEE International Conference on Semiconductor Electronics, 2006, p.477-480

2006

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Evaluation of Stopping Power of Photo-resist to Ion Implantation by Using SIMS

2006 IEEE International Conference on Semiconductor Electronics, 2006, p.481-484

2006

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A Whispering Gallery Mode Microsphere Resonator Integrated With Angle Polished Multimode Fiber

Journal of lightwave technology, 2021-06, Vol.39 (12), p.4049-4054

2021

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Studies of a new chemical etching method-152 Secco Etch in failure analysis of wafer fabrication

ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187), 1998, p.20-26

Hua Younan

1998

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Variable-Stride Multi-Pattern Matching For Scalable Deep Packet Inspection

Low loss fibre optic polarisers using differential coupling to dielectric waveguide overlays

Study of Silicon thickness for electron transparency

Multi-spectral uncooled microbolometer sensor for the Mars 2001 orbiter THEMIS instrument

Guest Editorial: Learning From Noisy Multimedia Data

Quantitative strain analysis for advanced CMOS technology by Nano Beam Diffraction

FIB sample preparation for TEM failure analysis of advanced devices

Investigation of Potassium Contamination in SOI Wafer Using Dynamic SIMS

SIMS sample preparation method for GOX analysis with small-size polysilicon patterns

Failure analysis and elimination of poly residues contamination in wafer fabrication

Auger electron spectroscopy studies on bondpad peeling failure in wafer fabrication

Power MOSFET breakdown voltage study for process control by SIMS

A study on silicon nodules due to the Si precipitation in wafer fabrication

Investigation on sidewall polymer contamination during metal etching in wafer fabrication

Wire bonding, bumping & assembly related failures & improvements

TEM dark-field off-axis electron holography strain measurement on embedded-SiGe pMOSFETs and comparison with nano-beam diffraction strain measurement

Analysis of satellite defects formed in photolithograph process by TOF-SIMS and XPS

Interfacial characterization of ultra low-k film (kappa=2.55) with time of flight secondary ion mass spectrometry (TOF-SIMS)

Study on Potassium Contamination in SOI Wafer Fabrication Using Dynamic SIMS

Development of FIB-based Charge Reduction Methods for Auger Electron Spectroscopy and Their Application in Failure Analysis

Gate oxide integrity failure caused by molybdenum contamination introduced in the ion implantation

SIMS Analysis of Gate Oxide Breakdown Due to Tungsten Contamination

Evaluation of Stopping Power of Photo-resist to Ion Implantation by Using SIMS

A Whispering Gallery Mode Microsphere Resonator Integrated With Angle Polished Multimode Fiber

Studies of a new chemical etching method-152 Secco Etch in failure analysis of wafer fabrication

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